Modified Polyamines KINGCURE X-2001 is a mannish type Epoxy Resin hardener. Based on aromatic amine developed for low viscosity fast curing. KINGCURE X-2001 can be used in all normal amine reactions . It is a slightly yellow product and has only limited solubility in water. The reactivity with epoxy resin is so high that no accelerator are required The cure takes place at high atmospheric humidity at temperature down to 5and even under water. Viscosity(mPas /25C) ,200 ~ 2,500.
Modified Polyamines KINGCURE 367-KV is a modified aromatic polyamines type curing agent for liquid epoxy resin. Itis a medium viscosity and pot life, The surface hardness is more than KINGCURE X-165A to the mixed resin .The major applications solventless coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required. Viscosity (mPas /25C ) 100 ~ 400 .
Modified Polyamines KINGCURE 800-C is a mercaptan terminated liquid polymer which is imparts rapid-cure characteristics to epoxy resins in combination with selected amines these systems are unique in that they also provide rapid cure rates at low temperatures and thin film ,application in construction adhesives(Bonding compounds)5min fast-setting adhesives. Viscosity (mPa s/ 25C ) 10,000~20,000 .
Modified Polyamines KINGCURE N-768 is a rapid room temperature curing agent for epoxide resins. It is a stable liquid activated amine of particular use for solvent-free coatings, floor patch repair kids,fast-setting adhesives,cold weather patching compounds and as an accelerator for other amine and polyamide cures Viscosity (mPa s/ 25C ) 150 ~ 250 .
Modified Polyamines KINGCURE B-311 is a low viscosity, modified cyclo-aliphatic polyamines epoxy curing agent. It has been designed for use in solvent-less coatings and leveling floorings where excellent flow, good adhesion and high gloss films are required. Viscosity (mPa s , 25C) 300 ~ 700.
Polyamide For Hot Melt KINGMIDE H-140HP is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. It is easy to soluble in mixed organic solvent such as toluene and alcohol type solvent. This resin has the characteristics of good mechanical strength, good heat resistance and flexibility. It is suitable for use in sealing and electric parts adhesive . Viscosity (mPa�·s / 200C) 5,000 ~ 10,000.
Polyamide For Hot Melt KINGMIDE H-170HV is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-170HV is easy to soluble in mixed organic solvent suchas toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance and high adhesive strength and good toughness are particularly needed. Viscosity (mPa s / 200 C) 3,000 ~ 7,000.
Polyamide For Hot Melt T-558-N is a solid-type fatty polyamide resin especially designed for HOT-MELT STRUCTUAL ADHESIVE uses. It has superior processing properties for its ready-to-apply nature due to the lower molten viscosity. Optimum application temperature of T-558-N is in the range of 180C~200C. T-558-N shows excellent adhesion onto various types of plastics, and steel, as well as onto many other surfaces, giving very tough bonding and sealing strength. T-558-N may be applied either by hand or manually operated by hand-guns. An automatic dispensing equipment with a nozzle or a wheel applicator may also be benefited. Viscosity (mPa s/ 200C ) :500 ~ 800.
Polyamide For Hot Melt KINGMIDE H-175SP is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-175SP is easy to soluble in mixed organic solvent, such as toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance and high adhesive strength and good toughness. Viscosity (mPa s / 232C) 3,000 ~ 6,000.
Polyaminoamide Resin KINGMIDE 315-FC is a polyaminoamide curing agent for liquid epoxy resin to achieve fast cure more than KINGMIDE 315 at ambient temperature. It has a high molecular weight andm provide the cured products with high orders of flexibility, adhesion, good chemical and water resistance. The major applications of KIMGMIDE 315-FC are for general adhesives, civil engineering and construction. Viscosity (mPa S / 40C ) -12,000 ~ 18,000.
Polyaminoamide Resin KINGMIDE 310 is a polyaminoamide curing agent for liquid epoxy resin to achieve fast cure more than KINGMIDE 305 at ambient temperature. It has a high molecular weight and provide the cured products with high orders of flexibility, adhesion, good chemical and water resistance. The major applications of KIMGMIDE 310 are for general adhesives, civil engineering and construction. Viscosity (mPa S / 40C degree) - 30,000 ~ 50,000.
Polyaminoamide Resin KINGMIDE 328-A is a Polyaminoamide type epoxy curing agent. Mixtured resin of KINGMIDE 328-A with an epoxy resin maintain a rather longer pot-life, and provides its cured products with well balanced cured properties. KINGMIDE 328-A is a therefore recommended to be employed for such applications as general adhesives and structural adhesives in construction works. Viscosity (mPa s /25C degree) - 10,000 ~ 20,000 .
Polyaminoamide Resin KINGMIDE 384-S is a modified polyaminoamide epoxy adduct curing agent for liquid epoxy resin to achieve fast cure at ambient temperarure. It has a high molecular weight and provide the cured products with high orders of flexibility, adhesion, good chemical and water resistance. The major applications of KIMGMIDE 384-S are for general adhesives, civil engineering and construction.
Solution type polyamide type epoxy curing agent KINGMIDE 581-60 is a solvent type epoxy curing agent of modified polyaminoamide, designed for such coating applications as tar-epoxy system and enamel type. KINGMIDE 581-60 provides its cured film with high orders of curing properties and superior anti-chemical resistance.
Solution type polyamide type epoxy curing agent KINGMIDE 300-65 is a polyamide type epoxy curing agent synthesized by polymerized fatty acid and polyamines. The resin component of KINGMIDE 300-65 is designed for high molecule weight and it is therefore semi-solid in its form at an ambient temperature. However, for easy handling at an actual application works, KINGMIDE 300-65 is dissolved in the manufacturing process before being released to the users. KINGMIDE 300-65, when cured with an epoxy resin, provides its cured films with such high orders desired at actual application field as good flexibility, simultaneously with good water resistance and good alkali resistance. KINGMIDE 300-65 is thus desired for heavy duty primer coatings application of anti corrosion resistance. Viscosity (Gardner Holdt/25C degree )- Z ~ Z6.
Solution type polyamide type epoxy curing agent KINGMIDE 305-70 curing agent is a standard reactive polyamide intended for use in curing of epoxy resin. KINGMIDE 305-70 is cut to 70 percent solids by weight in xylene/ isobutanol. Whem cured with ac high molecule weight of epoxy resin. It is provides cured films with such high orders desired at actual application field as good flexibility, simultaneously with good water resistance and good alkali resistance. KINGMIDE 305-70 is thus desired for heavy duty primer coatings application of anti corrosion resistance. Viscosity ( Gardner Holdt/25C degree ) - W~ Z.
Solution type polyamide type epoxy curing agent KINGMIDE 423-HPP is a reactive modified polyamide curing agent for epoxy resins. KINGMIDE 423HPP is cut to 60 percent solids by weight in xylene/ isobutanol . When cured with high molecule weight of epoxy resin. It is provides cured films with such high orders desired at actual application field as good flexibility, simultaneously with good water resistance and good alkali resistance. Especially for heavy duty primer coatings application of anti corrosion resistance. Viscosity ( Gardner Holdt/25C degree ) - U~Y.
Polyaminoamide Resin KINGMIDE 305 is a typical polyaminoamide type epoxy curing agent. KINGMID 305 has large molecular weight, it thus provide the cured products with an epoxy resin with high orders of flexibility and adhesive. Viscosity (mPa s /40C degree)- 50,000 ~ 70,000 .
Polyamide For Hot Melt KINGMIDE H-120 is a high molecular weight polyamide resin especially designed for hot melt-adhesive use. KINGMIDE H-120 is easy to soluble in mixed organic solvent , such as toluene and alcohol type solvent. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications were high heat resistance and high adhesive strength and good toughness are particularly needed. Viscosity (mPa s / 200C degree) - 2,200 ~ 2,800 .
Hot melt for gravure printing ink KINGMIDE 550 is a solid type fatty polyamide resin synthesized by a polycondensation of mainly the dimerized fatty acid and the alkylenepolyamines. The major applications of KINGMIDE 550 are in the rotogravure printing inks . KINGMIDE 550 shows superior adhesion onto wide variety of surface so that it is highly useful for rotogravure ink formulation .
