Leadsintec Co., Ltd is an ISO certified electronic and electrical manufacturer, providing services in the fields of PCB, Component procurement, PCB assembly and metal fabrication, growing global supplier channel management, electronics manufacturing service (EMS). Our Capability and Services Range 1.PCB layout & fabrication 2. Production of customer designed components 3. SMD assembly and through hole components insertion 4. IC pre-programming 5. Function verification and burn in testing 6. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc.) 7. Environmental Coating 8. Engineering service including end of life components, obsolete component replace and design support for circuit, metal & plastic enclosure, packing design 9. Logistic arrange for import and export from China
1Layer1-30 layer 2MaterialFr-4, cem-1, cem-3, hight tg, fr4 halogen free, fr-1, fr-2, aluminum 3Board thickness0.2mm-7mm 4Max.Finished board side500mm*500mm 5Min.Drilled hole size0.2mm 6Min.Line width0.075mm(3mil) 7Min.Line spaceing0.075mm(3mil) 8Surface finish/treatmentHals/hals lead free, chemical tin, chemical gold, immersion gold inmersion silver/gold, osp, gold plating 9Copper thickness0.5-6.0oz
Technical Capability: Product type FR4+FCCL(Flexible Copper Clad Laminate)rigid flex PCB Material FR4+FCCL Field of application military industrial Layers/thickness 4L/1.2mm Line Space/width 6/6mil Surface treatment ENIG Minimum hole dia. 0.2mm Technical feature special material,rigid-flex technology
We OffeCircuit Boardr a Full Range of Printed Circuit Board Capabilities to Fit All of Your PCB Needs Process Item Craft Capacity Prepares materials Base Material FR4, CEM-1, Aluminium, High Tg Material, Halogen-free Material Lamination press Layer Count 1-12Layers Thickness 0.2-3.0mm Drill Min.Hole Diameter 0.15mm (mechanical drill), 0.1MM (laser drill) PTH Diameter Tolerance + / - 3mil NPTH Diameter Tolerance + / - 2mil Outer layer Min.Line/Space 3.5mil/3.5mil Copper Thickness 1- 6oz Impendence Impedance tolerance ±10% (±5%(Need assessment) Solder Masking Min.Solder Dam 0.1mm Min.Solder Mask Opening 0.075mm Color Green, White, Red, Yellow, Black, Blue Surface Treatment LF-HASL, OSP,Ni/Au Enig,Immersion Tin, Immersion Silver, carbon oil; Out-Line Profiling Profile Tolerance + / - 0.12MM V-cut Remain Thickness Tolerance + / - 0.1MM V-cut Angle Tolerance + / - 5° Testing E-Testing 100% E-Testing (High Voltage Testing); Flying Probe Testing Final Product Thickness Tolerance + / - 10% Warpage Tolerance + / - 0.75% Lead Time Double layer PCB Multilayer PCB Mass production Normal 6 work days Normal 8 work days Double layer 9-12 work days Urgent 3 work days Urgent 6 work days Multilayer 12-15 work days Email:sales5@(keyoupcb.com) Learn more from our website:www.keyoucircuit.com ADD:Room K221,jinhetian Center,QINGHU AREA,SHENZHEN, Guangdong,China
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Product type 2 Layer Metal Base PCB Material Copper base Layers/thickness : 2L/1.6mm Line Space/width : 25/30mil Surface treatment : ENIG Minimum hole dia. 2.5mm Outer Layer Copper Thickness 1/1 OZ
Material: Aluminum Bases Layer/Thickness: 2L/1.6 mm Copper Thickness:1 OZ Surface treatment:ENIG Min Line Width: 0.13mm Min Line Space: 0.12mm Min Hole:0.32mm Solder Mask:White Technical featuer: special materials Application Field: High frequency amplifier
10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control
Layer NO# 1 or 2Layers Material: Aluminum 0.80~3.80W/m.k Finished Thickness: 1mm or 1.6mm Outer Copper: 1 ~3 OZ Surface treatment: HASL LF / OSP / ENIG
Copper Base PCB, Metal PCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and the metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. LED PCB always be produced with Aluminum core, but sometimes steel core PCB and copper core PCB also be used. Copper Base PCB Metal PCB ENIG White 1 Layer, Copper base material. Finished board thickness is 1.6mm. White solder mask 1 Oz finished copper thickness. Surface Finish is ENIG 2u
PCBA Capability Capability - SMT Lines 9 (5 Yamaha, 4 KME) Capacity 52 million placements per month Max Board Size 457 X 356mm. (18 x 14) Min Component size 0201 54 sq. mm. (0.084 sq. inch), long connector, CSP, BGA, QFP Speed 0.15 sec/chip, 0.7 sec/QFP Capability - PTH Insertion Type # of Lines Capacity (points/mth) Max Board Size Lead Pitch Jumper Wire 3 6 million 330X250 mm (13 x 9.8) 5-30 mm Axial 3 6 million 457x559 mm (18 x 22) 5-20 mm Radial 3 9 million 457x559 mm (18 x 22) 0.36-21.5 mm Wave Soldering Wave Soldering 2 Max board width 400 mm Type Dual wave Pbs Status Lead-free line support Max temp 399 degree C Spray flux add-on Pre-heat zones 3
Layer: 1 to 16 layers Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX Board thickness: 0.20mm to 3.4mm copper thickness: 0.5 OZ to 6 OZ copper thickness in hole: >25.0 um(>1mil) Max size of finish board: 700*460mm Min.Drilled Hole Size: 1.0mm Min.Line Width: 3mil Min.Line Spacing: 3mil Surface finishing: HASL/HASL lead free,HAL,Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating Solder Mask Color: Green/Yellow/Black/White/Red/Blue Shape tolerance: ±4mil Hole tolerance: PTH:±3mil,NPTH:±2mil Package: Inner paking/Plastic bag,Outer packing:Standard carton packing Certificate: UL,SGS, ISO 9001:2008,IATF16949 Special requirements: Buried and blind vias+controlled impedance+BGA Profiling: Punching,Routing, V-CUT,Beveling
Thermoelectric Separation Copper Based PCB Layers: 1 Thickness: 3mm Cu PCB for high power LED light Substrate material: Red Copper Copper thickness: 1 Oz Plating process: Immersion gold Description: Power LED MCPCB Countersink holes
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Type: Double sides printed wiring board Laminate: FR4 TG170 Board size and thickness: 100*36*1.60mm*3UP Surface finished: ENIG Copper thickness: 35um Solder mask : Green Silkscreen : White
FR4 material, 0.2mm thickness pcb, thin pcb, ENIG pcb, 94v0 pcb material: FR4, copper finished: 1/1 OZ finished thickness: 0.2mm surface finished: immersion gold (Au 2Uâ??) min hole: 0.25mm solder mask: green
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added
Layers: 2Rigid + 2flex + 2Rigid design Material: FR4 middle TG + Dupont AP8515R Thickness: Rigid 0.80mm Flex 0.20mm with stiffener Surface treatment: immersion gold Apply for surveillance producation Solder mask: Green + Coverlay Legend: White Rigid-flex Printed circuit board manufacturer from China
MEGTRON 6 is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON 6 are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410C (77°F). MEGTRON 6 meets IPC specification 4101 /102 /91.
