Ceramic Pcb Suppliers and Manufacturers

Model No.: LTCC3535,LTCC5050,3535,3028, Made in Taiwan, ROC Key Features Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate

Product features: The ceramic circuit board has high accuracy and good electrical and thermal properties 2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole 3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology 4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced 5. Customized production, without mold opening, short production cycle 6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life. 7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment. 8. High frequency loss, it can be used in high frequency circuit. 9. Copper sealing, high reliability. 10. 3d substrate and 3d routing. 1. Ceramic circuit board appearance size is not limited 2., ceramic laser printing, three-dimensional routing 3. Ceramic circuit board without mask, fast response 4. Ceramic circuit board technology is mature, environmental protection, pollution-free

The photosensitive sensor is currently the highest yield, the most widely used sensor, exist in the form of photosensitive resistance, along with the change of light intensity, the resistance value is also relatively change, resulting with the light intensity of the pulse signal. The structural elements of common cadmium sulphide photosensitive electrode are: electrode / cadmium sulfide / ceramic substrate / wire / resin moisture-proof film, etc.. Ceramic substrates have been widely used in photosensitive resistors. Product features: The ceramic circuit board has high accuracy and good electrical and thermal properties 2. Ceramic circuit board with high bonding strength and good weldability, can realize blind through hole 3. Ceramic circuit board technology is mature, environmental protection, pollution-free, cost is lower than traditional technology 4., a wide range of applications, single-sided and double-sided three-dimensional ceramic circuit boards can be produced 5. Customized production, without mold opening, short production cycle 6., no organic ingredients, resistant to cosmic radiation, high reliability in aviation and space, long service life. 7. Can carry out high-density assembly, line / pitch (l/s) resolution can reach 20 m, so as to realize the integration and miniaturization of equipment. 8. High frequency loss, it can be used in high frequency circuit. 9. Copper sealing, high reliability. 10. 3d substrate and 3d routing. 1. Ceramic circuit board appearance size is not limited 2., ceramic laser printing, three-dimensional routing 3. Ceramic circuit board without mask, fast response 4. Ceramic circuit board technology is mature, environmental protection, pollution-free

Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test

Alumina ceramic pcb in China PCB specification Alumina Ceramic PCB from China Alumina Ceramic material 0.63mm board thickness High conductivity silver+Immersion gold suitable for gold wirebonding Unit zie:23.8mm*23.8mm ceramic glaze for solder Application: Semi-Conductor Company Profile Hitech focuses on high-mix, low volume and quick turn pcb service. With a special market position and excellent corporate culture, we can provide "One-stop shop" service from 1 to 26 layers of PCB products, which includs double layers PCB, Multilayer PCB, Aluminium PCB (Metal core PCB) Flexible PCB (FPCB), Rigid-Flex PCB (Flex-rigid PCB), High Density Interconnect (HDI )PCB boards, heavy copper boards, buried Capacitance & resistance boards, etc. Our products cover various products are exported to Europe, America and Asia. Now Hitechpcb has formed the marketdevelopment, the product research, the development, the production,the quality guarantee complete system, we focus on quality, cost, service, and experienced continuous growth and succeeded in passing the certification of international quality systems as ISO 9001, UL(UL#E354070) and ISO14001 environmental quality system.

We are a unique name in the industry as a leading Supplier of Nitride Ceramic PCB in Wuhan, Hubei, China. Substrate type:aluminium nitride ceramics Conducting layer:Cu Surface preparation:immersion gold Metal single-sided / double sided:double sided Copper plated through hole:yes Solder mask:no

Today ceramics are already widely used as substrates in many microelectronic components and power led packages and more and more they are replacing entire printed circuit boards reducing complexity in design and manufacturing while increasing performance. Examples are chip-on-board (cob) modules, high power circuits, proximity sensors, battery drivers for evs, - . Ceramics advantages over other printed circuit boards: Lower expansion coefficient Good thermal properties Superior high frequency performance Lower system cost: reduces test, insertion, assembly Smaller package size due to integration Cost effective for dense package due to parallel processing of layers Hermetic packages possible, 0% water absorption

High ceramic PCB thermal conductivity is probably the leading reason more industries are turning to ceramics in their printed circuit boards and packages, as this material has a clear edge over plastics in this regard. Better CTE matching and hermetic sealing only add to the appeal of these materials. The challenge is that these materials, and the boards your ceramic PCB manufacturer makes from them, are considerably more expensive than materials for traditional printed circuit boards, which can add up significantly over the length of a high-volume job. However, the benefits of ceramic boards and the need for heightened thermal conductivity is so great, any company in a relevant industry that can afford to use ceramic boards will probably do so out of necessity. While we can have an estimate of the level of thermal conductivity each ceramic board can provide, the final values will vary depending upon the manufacturing process, in addition to grain size and composition. We can offer a range of values that experts seem to agree upon. Thermal conductivity for one of the most popular, although expensive ceramics â?? aluminum nitride â?? is one that many identify as over 150 W/mK, usually around 180 W/mK. However, studies find values ranging all the way from 80 W/mK to 200 W/mK at room temperature, with values dropping by more than one-third as you approach 100 degrees Celsius. Other thermal ranges we can identify at room temperature include 18-36 W/mK for aluminum oxide, 184 to 300 for beryllium oxide, 15 to 600 for boron nitride and 70-210 for silicon carbide. Because the variations are so wide, it is difficult to pin down actual thermal conductivity numbers. Your best approach will be to do your own testing, record the values you obtain and use those in your future calculations.

Product parameters Substrate typealumina ceramics Substrate material thickness0.5mm Conducting layercu Thickness of metal layer35m/35m Surface preparationheavy silver Metal single-sided /double sideddouble sided Copper plated through holeyes Solder maskyes Product features 1.High precision, good electrical and thermal properties, high bonding strength of. 2.Good weldability, blind hole through hole can be realized 3.Mature technology, environmental protection, pollution-free, cost is lower than traditional technology. 4. A wide range of applications, single-sided, double-sided three-dimensional ceramic circuit board can be produced. 5. Customized production, without mold opening, short production cycle. Company profile Folysky technology (wuhan) co., ltd., is a professional engaged in the plane, three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production, sales as one of the high-tech enterprises, which owns the well-known brand of ceramic circuit substrate -- slitong.

customized al2o3 ceramic pcb board manufacturer Main Material: FR-4, High TG135TG155,TG170, Aluminum Base, High Frequency ,AIO,AIN CCL Brand: Shenyi, KB, ITEQ, ISOLA, NANYA,ROGERS Sample Layers: 1-12L Mass Production: 1-8 Layers Surface Finish: LF HAL, HAL, Immersion Gold/Tin/Silver Technology: Gold Finger, PeenLble, Carbon Ink ,Impedance Control BGA,HDI Min Hole Size: 8 MIL 0.20mm Min Line Width: 3 MIL(0.076MM) Min Line Spacing: 3 MIL(0.076MM) Outline: CNC Routing, Punching, V-Cut Place of Origin: Guangdong, China (Mainland) Brand Name: IBE OEM Mounting Production: 6 SMT Lines Through Hole Production: 2 DIP Lines Enclosure Assembly: 2 Assembly Lines Certification: UL 94V0, ISO 9001 Environmental Compliance: REACH, RoHS, CMRT, PB-Free Specifications: Top PCB PCBA Electronic Manufactur Testing: 100% E-Testing Standards: IPC-A-610 E Class II-III Package: Vacuum Skin Double-Sided Profiling punching: Routing, V-CUT, Beveling Product special: Customized Company information: Hitech PCCB is a leading PCB manufacturer in China, We can provide the customized PCB fabrication, assembly, purchasing components one-stop service. Hitech focuses on high-mix, low volume and quick turn pcb service. With a special market position and excellent corporate culture, we can provide "One-stop shop" service from 1 to 26 layers of PCB products, which includs double layers PCB, Multilayer PCB, Aluminium PCB (Metal core PCB) Flexible PCB (FPCB), Rigid-Flex PCB (Flex-rigid PCB), High Density Interconnect (HDI )PCB boards, heavy copper boards, buried Capacitance & resistance boards, etc. Our products cover various products are exported to Europe, America and Asia. T-SOAR can be trusted PCB Partner, We are waiting for cooperation with you anytime. - UL, RoHS, ISO, SGS Certification Compliance. - OEM Assembly, Design, Prototype Service. - We will be responsible for the quality of our products, - Survive by quality, Win by Price.

Hitech Circuits Co., Ltd. is a leading Ceramic PCB Manufacturer and Ceramic Substrate Manufacturer in China, we specialized in Ceramic PCB Manufacturer Ceramic Substrate Manufacturer, Electronic Ceramic Supplier, AL2O3 Ceramic Supplier, ZRO2 Ceramic Supplier, High Temperature Ceramic Coating, Industrial Ceramics Manufacturer, Anti ESD Coating, Anti Glue Coating, and Silicon Carbide Coating Services. The products are widely used in high power LED ceramic substrate, microwave wireless communications, HCPV solar animal cells, ceramic sensor substrates, semiconductor and military electronics. DBC Ceramic PCB DPC Ceramic PCB HTCC Ceramic PCB LTCC Ceramic PCB

There are three kinds of forming methods of ceramic substrate: pressing film, dry pressing and casting forming. The casting process has the highest forming production efficiency, and it is easy to realize continuous production and automation. It can improve product quality, reduce costs and realize mass production. The thickness of the production substrate can be as thin as 10m or less than 1mm. Casting forming is an important step in the practical transformation of aluminum nitride ceramic circuit board, and has an important application prospect.

High tg pcb Base material: fr4, fr1, fr2, ceramics, aluminum, rogers, f4b, f4bk, f4bt, tp, pf, cem-1, cem-3, etc. Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers Tg 170, packing :vacuum packing in carton

Base material:Aluminum Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: IPI solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers. Carton.