1. Adopt infrared weld technology which independent exploration. 2. Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco. 3. Easily operate. Just need one day training. Can operation this machine. 4. Don't need weld tools. This machine can weld all the component of 35-50cm. 5. This machine has 800W heating system. Widely 240x180mm.
BGA Rework Station Zhuomao bga rework station china is one of the best BGA rework station suppliers in China. First of all, what is BGA machine? BGA rework/repair station is what we called ball grid array rework station, also abbreviated as BGArs. BGA is a chip packaging technology, which is applied to improve the performance of digital products and reduce the volume of products through the ball grid array structure. All digital products through this BGA machine china technology will have common characteristics, that is, small volume, strong performance, low cost, and powerful function. BGA rework machine is the exact equipment used to repair BGA chips. According to the operation requirements, we have launched different BGA rework machines that enjoy a good reputation from our clients all over the world recently.
hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair. Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding. 220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days. With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles Features : With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. Specification : Power: 1000W Voltage: AC 220V 110V Temperature range: 100 C 500 C Air volume ratio range: 1 to 120 Maximum air flow: 120L min Dimensions: 188 (L) 245 (D) 135 (H) mm Package List : 1pcs x Quick 861DW rework station 1pcs x Hot air gun 1pcs x Hot air gun holder 3pcs x Heat gun nozzles 1pcs x Ground lead 1pcs x Instructions
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
ZM-R 5860 specifications 1 Total Power 4800W 2 Top heater 800W 3 Bottom heater 2nd heater 1200W 3rd IR heater 2700W 4 Power supply AC220V 50/60Hz 5 Machine dimension L635*W600*H560 6 Positioning V-groove, PCB support can be adjusted in any direction with external universal fixture 7 Temperature control (K Sensor) closed loop, independent heating, precision within 8 PCB size Max 410 370mm Min 20 20 mm 9 Electrical selection Highly sensitive temperature control module£«Touch screen (Taiwan)+Delta PLC 10 Weight 40kg 11 Package Wooden Box 12 G.W. 78KG 13 Package dimension L78*W78*H77cm. Main Features 1.Adopt liner slide which makes X¡¢Y¡¢Z axis all can do high positioning accuracy and fast maneuverability. 2. PCL control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repairment need. 3. There are 3 independent heating areas, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power comsumption.Top heater can be adjusted freely; second heater can be adjusted up and down. The machine operations be runned by human machine interface- high definition touch screen (Taiwan) 4. Offer all kinds of hot-air nozzle, it can rotate 360, with magnet, easy to install and change, and offer customized service. 5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ¡¾3 ¡Æ. 6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size. 7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly. 8 There is an alarming after desoldering & soldering, and it is settled alarming in advance. 9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens. 10. It can save many temperature parameters, easy to repair same chips. And can repair lead or lead free chips, can meet repairment of laptop, xbox360, mobile, ps3 and other components on the motherboard. wooden box, G.W. is 78KG,package dimension is L78*W76*H77cm.
Features introduce independent control heaters top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. temperature accuracy within there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly. it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system it can show seven temperature curves and the millions of groups data can be saved through U storage device with instant curves analysis function and analyzing BGA temperature at any time; the sensor is for precise temperature testing. Precise optical alignment system Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within 0.01mm. InMulti-function operation system Ù Adopt high definition human-machine interface, available for setting ¡°set up¡± and ¡°operate¡± to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic identify BGA chips and mounting height, it is of automatic soldering and desoldering function.it can set 6 segments rising temperature and 6 segments activity temperature, and can save N groups temperature profiles. Adopted all kinds of BGA nozzles, with 360 rotation, easy for installation and replacement, customized is available; ÚV-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board; Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of sizes of BGA repair. Superior safety functions With CE certification; after desoldering and soldering, there is alarming. when temperature goes out of control the circuit will automatically power off, it is of double over-temperature protection function. Temperature parameter has a password to avoid from arbitrary changes, with superior safety protection functions, can protect PCB board components and the machine from damage at any abnormal situation Specifications and technical parameters Total power 5300W Max Top heater power 1200W (1st heater) Bottom heater power 1200W (2nd heater) 3rd IR heater 2700W independent controlling left and right IR heaters) power AC 220VA10 50/60Hz Electrical materials temperature control system Adopted Dalian University of Technology Dimensions L640*W630*H900mm Temperature control K-type thermocouple (Closed Loop), intelligent temperature compensation system Positioning V type groove, with universal fixture P C B size Max 410A370mm, Min65A65mm Wooden box
WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering
Phone PCB Repair Metal Shelving Bracket for Soldering Station external fixator Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun. picture show : Phone repair Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. Scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun
Reflow Touch Screen BGA Rework Station1. Product application of reflow bga rework station DH-C12. Product specification of reflow bga rework station DH-C1 3. Product advantages of reflow bga rework station DH-C1 4. Product details of reflow bga rework station DH-C1 Cooling fanAfter heating is completed, manually turn on the high-power fan to cool the PCB board to prevent PCB board deformation.KnobMove the knob up and down for more convenient and flexible operation.LED LightUsing Taiwan's imported high-brightness LED lighting can effectively see the melting of tin or mold on small components. 7" Touch ScreenChinese and English manual display for your option. 5. Why Choose reflow bga rework station DH-C1 ? Precise PID smart temp control , the No.1 key factor for the quality of BGA Rework Station Temperature curve. Wide range of application, one machine suits for different kinds of IC. High successful rate of BGA rework. Accurate rework only heats the chips where is needed. All excess heat will reflow back to ensure the components around BGA will not be influenced . Heating doesn't influence the appearance of PCB even after using several times.6. Packing, delivery of reflow bga rework station DH-C1Flexible delivery By DHL, TNT, FEDEX, Air shipping, Sea shipping and Land transportation etc. taking 3~30 days to arrive at destination according to different shipping ways. 7. Contact us for more details of BGA rework station Scan the QR code to save the contact 8.Learn something related about BGA Advantages of BGA : Improved PCB design as a result of lower track density. The BGA package is robust. Lower thermal resistance. Improved high speed performance and connectivity. What's the difference between LGA, BGA, and PGA sockets, LGA is Land Grid Array. PGA is Pin Grid Array. BGA is Ball Grid Array.LGA is what you're going to get right now. The CPU has metal contacts flush on the surface, pins in the socket. PGA is the other way around. The pins are on the chip. BGA is for CPUs that will be soldered into place (think laptops and consoles).LGA are desktop sockets.BGA are laptop sockets where the CPU is soldered to the board.PGA are laptop sockets where the CPU may be able to be removed.
ZM-R5860 Hot Air BGA Rework Station ZM R5860C Hot Air BGA Rework Station is a kind of rework station provided by Zhuomao, which has three temperature zone Independently control, convection hot air heating, lower temperature zone height-adjustable, high-precision autonomous control system, high-precision K-type thermocouple with accuracy up to ± 3, dynamic APR multi-loop closed-loop control selective reflow process. Imported high power constant current integrated cooling fan. As one of the most reputable BGA Rework Station suppliers, Seamark ZM provides the best BGA Rework Station with good quality. If you want to know seamark ZM R5860 price, please contact us now! Functions of Zhuomao ZMR5860 Smart BGA Rework Equipment 01 Temperature Curve Setting High-definition touch screen operation, real-time display and, editing of temperature curves, each group of temperature curves can be set to 8 segments, 100 groups of temperature curves can be stored, with temperature self-organizing function. 02 Laser Red-dot Positioning Guide Laser indicator for PCB and component positioning. 03 Vacuum Adsorption The external vacuum suction pen is convenient for taking BGA. Specification Of Seamark Zhuomao BGA Rework Station Power Supply AC220V±10% 50/60HZ Power 5.0KW(Max), Top heater(0.8KW) Bottom heater (1.2KW), IR Preheater (2.7KW),Other(0.3KW) PCB Size 410*370mm(Max); 10*10mm(Min) BGA Chip Size 40*40mm(Max); 10*10mm(Min) IR Heater Size 375*285mm Temperature Sensor 1 pcs Operation Method 7" HD touch screen Control System Autonomous heating control system V1 software copyright Alignment System Laser dot Vacuum Adsorption Manual Temperature Control K-type thermocouple closed-loop control with accuracy up to ±3 Positioning V-groove with universal fixture Dimensions L635*W620*H655mm Weight 43.5KG Principle And Operation Mode Of Seamark ZM R5860 BGA Machine The Seamark ZM R5860 BGA Machine is a rework station used for soldering and desoldering ball grid array (BGA) components on printed circuit boards(PCBs).BGA components are a type of surface-mount packaging used for integrated circuits. Seamark Zhuomao ZM R5860 BGA Machine is based on the hot air rework technique. lt uses precisely controlled hot air to melt the solderballs of the BGA component allowing it to be removed or replaced without damaging the PCB or the component itself. The machine also uses a vision alignment system to accurately align the BGA component with the PCB. The Seamark ZM R5860 BGA Machine allows for precise control over the temperature and airflow, ensuring a reliable and high-quality soldering/desoldering process. lt is suitable for use with a wide range of BGA components and PCBs. The operation mode of the Seamark ZMR5860 BGA Machine involves several steps: Preheating: The PCB is preheated to a suitable temperature to prevent thermal shock to the board when the hot air is applied.
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply¡ê;no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400 230; (Max) Preheating temp. 400 Positioning V-groove +laser positioning + universal fixture PCB size Max 410 370 mm Preheaing size 370mm 270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80¨80mm Min 22 mm Dimensions L640 W630 H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400(Max) Preheating temp. 400Max Positioning V-groove +laser positioning + universal fixture PCB size Max 410 ,370 mm Preheaing size 370mm,270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80,80mm Min 22 mm Dimensions L640 W630 ,H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days
WDS-750 higher automatic bga rework station https://youtu.be/5fbCW4nN3w4 Features of WDS-750 1.touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use; 2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield. 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling; 4.auto feed chip,auto pick up chip,auto belowing chip,can identify the central position automatically when optical alignment; 5.multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users; 6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 â?? 7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm; 8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users. 9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts. 10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional). WDS-750 parameter Total power:6800W Upper heating power:1200W Bottom heating power:1200W Bottom IR heating power:4200W2400W is controlled Power supply:(Single Phase) AC 220V±10 50Hz Location way :Optical camera+ V-shape card slot + laser position for fast location Temperature control:High precision K sensor closed loop control,independent temperature control with ±1 â?? precision Appliance selection:High sensitive touch screen + temperature control mode +Panasonic PLC +step driver Max. PCB size:500Ã?450mm Min. PCB size:10Ã?10mm Sensor:4units Chip amplification multiple:2-30X PCB thickness:0.5-8mm Chip size :0.3*0.6mm-8cm Min. chip space:0.15mm Max. mount loading:500G Mount precision:±0.01mm Overall size :L670Ã?W780Ã?H850mm Optical camera:Can be removed front and back,left and right,prevent the dead angle Machine weight :90kg
YIHUA 1000B / 1000A 3-IN-1 Infrared BGA Rework Station: SMD Hot Air Gun 540W Preheating Station 75W Soldering Irons, YIHUA 1000B personal BGA rework station 3 in 1 SMD Hot Air Gun 75W Soldering Irons 540W Preheating Station. YIHUA 1000B Soldering rework station: powerful electronics repairing machine for all kinds motherboard / repair, YIHUA 1000B 3-IN-1 Infrared BGA Rework Station Feature: 1. Using the new microcomputer processor PID programmable temperature control technology and uses an infrared source and optics to target heat to individual components without dislodging other SMT parts by way of eddies air currents. 2. Adopt infrared weld technology which independent exploration , infrared penetration strength , components uniform heating , beyond the traditional hot air heating vowed to prevent blow off the IC surrounding small components. 3. Technician focused infrared heat is easy to target most component removal/replacement and re-work. 4. Infrared heat source bulbs are long-lived , un-expensive and easily replaced. 5. Has bright delicate , low voltage LED lighting , safety and energy conservation. 6. It has External Sensor Temperature control mode , that is detected by the sensor IC surface temperature control temperature , this function is good for freshman operation , itâ??s safe way protect components . 7. MountTechnology (SMT) components 15-35cm in size. 8. This machine has 540W heating system , widely to 120mm 120mm. 9. Preheating plate color is black , from the photics point of view , black color easy to absorb heating , shorten the warm-up time. 10. Powerful human function design , with the following functions A. Temperature correction function Correction of temperature range 50 C 50 C ( Infrared lamp analog value 580 ). B. Celsius / Fahrenheit temperature display function 11. This machine also has soldering iron function , if you have the device , you can used for all of the components solder , desoldering , preheating , repair all components , especially Micro BGA components.
JDI hot air gun 863 1600W BGA rework station with 3 air gun nozzles for mobile phones repair, JDI 863 desoldering rework station for phone motherboard repair, cell phone repairing BGA desoldering rework station. JDI Hot Air Gun 863 BGA Desoldering Rework Station Product Features : This hot air rework station uses heating device to warm up air which can be used to weld. There are three working channels CH1, CH2, and CH3, and the air volume and temperature of each channel can be set. Equipped with magnetic sensor, as long as holding the handle, the machine can quickly work. With auto sleep function, can set up while sleep status. Warming up quickly, accurate and stable temperature control, make it real lead-free welding. Using frequency conversion blower, which has adjustable, large range air flow, can achieve a variety of purposes. Packing List : 1pc x JDI 863 Hot Air Gun 1pc x Power Cable 3pcs x Air Gun Nozzles 1pc x Instruction Book
SUGON 858D Hot Air Gun Soldering Station 700W Temperature 500 Digital Display SMD Desoldering Station BGA Rework Station. Product Introduce: 1. Essential basic soldering tool,fast heat up,easy to desoldering. 2. Skeleton winding Heating Element,higher heat generating efficiency,more stable longer use life. 3. Long service life brushess fan,safety&efficiency,auto start-stop technology 120L/min large volume. 4. F temperature display options,meet different country need 5. Temperature Calibration,when the display temp different from test temp,can use this function. 6. Not need large space 858D also can work perfect. Product Data: 1. Input voltage: 110V,220V~240V. 2. Output Power: 700W. 3. Temperature range: 100~500 Celsius. 4. Temperature Stabillty: Good 5. Display mode: LED Display 6. Airflow type: Brushless-Motor Fan
ATTEN ST862D Intelligent digital display rework station For PCB chip soldering repair, 1000W Whirlwind ATTEN ST-862D lead-free hot air gun soldering station, ATTEN ST-862D Hot Air Rework Station 1000W Whirlwind 20L-120L/Min. Feature: 1. The LCD screen displays the operating temperature and status to achieve visual and human-machine interaction. 2. Menu-style operation, three sets of fast temperature / air volume access keys to achieve common temperature fast switching, 100 C -480 C. 3. Strong airflow with brushless fans. 4. Plug-in heating chip replacement is fast. 5. Straight wind and spiral wind convertible. 6. Automatic sleep. 7. Temperature lock function, timed work function. 8. Software calibration temperature control function, temperature compensation, to achieve constant temperature work. Input Voltage : 220V / 110V. Power: 1000W. Temperature Range: 100~480 Maximum Air Flow:120L/min.
2 in 1 head Touch Screen BGA Rework Station1. Product description of 2 in 1 head bga rework station DH-A1LDinghua BGA Rework Station DH-A1LThis machine is for repairing motherboard IC/Chip/Chipset of Laptop, Mobile, PC, iPhone, Xbox, etc. With features 3-heater(2xHot air+IR Preheating), embedded Smart PC, Auto Profile, Cooling Fan, Laser Position , Soldering Iron, Vacuum Pick-up & Place, Universal Support for most of the PCB Size/Shape.2. Product specification of 2 in 1 head bga rework station DH-A1L DH-A1L SpecificationProduct namesoldering and desoldering machinePower4900WTop heaterHot air 800WBottom heaterHot air 1200W, Infrared 2800WIron heater90wPower supplyAC220V ±10% 50/60HzDimension640*730*580mmPositioningV-groove, PCB support can be adjusted in any direction with external universal fixtureTemperature controlK type thermocouple, closed loop control, independent heatingTemp accuracy ±2 degreesPCB sizeMax 500*400 mm Min 22*22 mmBGA chip2*2-80*80mmMinimum chip spacing0.15mmExternal Temperature Sensor1(optional)Net weight45kg 3. Product advantages of 2 in 1 head bga rework station DH-A1L 4. Product details of 2 in 1 head bga rework station DH-A1L 5. Why Choose 2 in 1 head bga rework station DH-A1L ? Precise PID smart temp control , the No.1 key factor for the quality of BGA Rework Station Temperature curve. ?¡Accurate rework only heats the chips where is needed. All excess heat will reflow back to ensure the components around BGA will not be influenced . Heating doesn't influence the appearance of PCB even after using several times.6. Packing, delivery of 2 in 1 head bga rework station DH-A1L 7. Contact us for more details of BGA Rework Station 8. Know something about BGA Light BGA package materialOptical BGA packaged shells are often made of ceramic materials. This rugged ceramic material has many advantages, such as design flexibility with micro design rules, simple process technology, high performance and high reliability, generally by changing the physics of the shell The structure can be designed for optical BGA packages. Ceramic materials also have airtightness and good primary reliability. This is due to the fact that the thermal diffusion coefficient of the ceramic material is very similar to the thermal diffusion coefficient of the GaAs device material. Moreover, since the ceramic material can be three-dimensionally wired with overlapping channels, the overall package size will be reduced. In general, heat can be controlled when mounting optical devices because heat can deform the package. Final alignment of the optical device with the optical fiber can also produce movement that will change the optical characteristics. With ceramic materials, thermal deformation is small. Therefore, ceramic materials are very suitable for optoelectronic component packaging and have a significant impact on the optical communications transmission network market.
