Bga Rework Station

hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair. Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding. 220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days. With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles Features : With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. Specification : Power: 1000W Voltage: AC 220V 110V Temperature range: 100 C 500 C Air volume ratio range: 1 to 120 Maximum air flow: 120L min Dimensions: 188 (L) 245 (D) 135 (H) mm Package List : 1pcs x Quick 861DW rework station 1pcs x Hot air gun 1pcs x Hot air gun holder 3pcs x Heat gun nozzles 1pcs x Ground lead 1pcs x Instructions

Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

ZM-R 5860 specifications 1 Total Power 4800W 2 Top heater 800W 3 Bottom heater 2nd heater 1200W 3rd IR heater 2700W 4 Power supply AC220V 50/60Hz 5 Machine dimension L635*W600*H560 6 Positioning V-groove, PCB support can be adjusted in any direction with external universal fixture 7 Temperature control (K Sensor) closed loop, independent heating, precision within 8 PCB size Max 410 370mm Min 20 20 mm 9 Electrical selection Highly sensitive temperature control module£«Touch screen (Taiwan)+Delta PLC 10 Weight 40kg 11 Package Wooden Box 12 G.W. 78KG 13 Package dimension L78*W78*H77cm. Main Features 1.Adopt liner slide which makes X¡¢Y¡¢Z axis all can do high positioning accuracy and fast maneuverability. 2. PCL control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repairment need. 3. There are 3 independent heating areas, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power comsumption.Top heater can be adjusted freely; second heater can be adjusted up and down. The machine operations be runned by human machine interface- high definition touch screen (Taiwan) 4. Offer all kinds of hot-air nozzle, it can rotate 360, with magnet, easy to install and change, and offer customized service. 5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ¡¾3 ¡Æ. 6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size. 7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly. 8 There is an alarming after desoldering & soldering, and it is settled alarming in advance. 9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens. 10. It can save many temperature parameters, easy to repair same chips. And can repair lead or lead free chips, can meet repairment of laptop, xbox360, mobile, ps3 and other components on the motherboard. wooden box, G.W. is 78KG,package dimension is L78*W76*H77cm.

Features introduce independent control heaters top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. temperature accuracy within there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly. it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system it can show seven temperature curves and the millions of groups data can be saved through U storage device with instant curves analysis function and analyzing BGA temperature at any time; the sensor is for precise temperature testing. Precise optical alignment system Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within 0.01mm. InMulti-function operation system Ù Adopt high definition human-machine interface, available for setting ¡°set up¡± and ¡°operate¡± to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic identify BGA chips and mounting height, it is of automatic soldering and desoldering function.it can set 6 segments rising temperature and 6 segments activity temperature, and can save N groups temperature profiles. Adopted all kinds of BGA nozzles, with 360 rotation, easy for installation and replacement, customized is available; ÚV-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board; Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of sizes of BGA repair. Superior safety functions With CE certification; after desoldering and soldering, there is alarming. when temperature goes out of control the circuit will automatically power off, it is of double over-temperature protection function. Temperature parameter has a password to avoid from arbitrary changes, with superior safety protection functions, can protect PCB board components and the machine from damage at any abnormal situation Specifications and technical parameters Total power 5300W Max Top heater power 1200W (1st heater) Bottom heater power 1200W (2nd heater) 3rd IR heater 2700W independent controlling left and right IR heaters) power AC 220VA10 50/60Hz Electrical materials temperature control system Adopted Dalian University of Technology Dimensions L640*W630*H900mm Temperature control K-type thermocouple (Closed Loop), intelligent temperature compensation system Positioning V type groove, with universal fixture P C B size Max 410A370mm, Min65A65mm Wooden box

WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering

Phone PCB Repair Metal Shelving Bracket for Soldering Station external fixator Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun. picture show : Phone repair Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. Scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun

Reflow Touch Screen BGA Rework Station1. Product application of reflow bga rework station DH-C12. Product specification of reflow bga rework station DH-C1 3. Product advantages of reflow bga rework station DH-C1 4. Product details of reflow bga rework station DH-C1 Cooling fanAfter heating is completed, manually turn on the high-power fan to cool the PCB board to prevent PCB board deformation.KnobMove the knob up and down for more convenient and flexible operation.LED LightUsing Taiwan's imported high-brightness LED lighting can effectively see the melting of tin or mold on small components. 7" Touch ScreenChinese and English manual display for your option. 5. Why Choose reflow bga rework station DH-C1 ? Precise PID smart temp control , the No.1 key factor for the quality of BGA Rework Station Temperature curve. Wide range of application, one machine suits for different kinds of IC. High successful rate of BGA rework. Accurate rework only heats the chips where is needed. All excess heat will reflow back to ensure the components around BGA will not be influenced . Heating doesn't influence the appearance of PCB even after using several times.6. Packing, delivery of reflow bga rework station DH-C1Flexible delivery By DHL, TNT, FEDEX, Air shipping, Sea shipping and Land transportation etc. taking 3~30 days to arrive at destination according to different shipping ways. 7. Contact us for more details of BGA rework station Scan the QR code to save the contact 8.Learn something related about BGA Advantages of BGA : Improved PCB design as a result of lower track density. The BGA package is robust. Lower thermal resistance. Improved high speed performance and connectivity. What's the difference between LGA, BGA, and PGA sockets, LGA is Land Grid Array. PGA is Pin Grid Array. BGA is Ball Grid Array.LGA is what you're going to get right now. The CPU has metal contacts flush on the surface, pins in the socket. PGA is the other way around. The pins are on the chip. BGA is for CPUs that will be soldered into place (think laptops and consoles).LGA are desktop sockets.BGA are laptop sockets where the CPU is soldered to the board.PGA are laptop sockets where the CPU may be able to be removed.