Auto Bga Rework Station Wds 750 Free Training Suppliers and Manufacturers

WDS-750 higher automatic bga rework station https://youtu.be/5fbCW4nN3w4 Features of WDS-750 1.touch screen interface,heating time,heating temp,temp rise speed,cooling time,alarm advance,vacuum time are set up inside the touch screen,easy to use; 2.Panasonic PLC, independent control temperature control module,shows 3 temp curves all the time,4 independent sensors,check the temp accurately for the chip points,ensure the weld yield. 3.3 independent heating zones,each heating zone can set up the heating temp,heating time,temp rise rate;Six period of heating temperature, simulate the reflow heating mode,set up as Preheating, keeping, heating, welding, welding, cooling; 4.auto feed chip,auto pick up chip,auto belowing chip,can identify the central position automatically when optical alignment; 5.multifunction mode choice, four modes as weld,remove,mount,manual,automatic and semi-auto function,meet the various needs of the users; 6.Uses the high precision K-type thermocouple closed-loop control which is imported from USA,with the unique heating method,ensure the weld temp precision control within ±1 â?? 7.Uses imported optical alignment system,500 pixel HD camera,HDMMI HD signal output,15 inch HD LCD,high accurate micrometer X/Y/Z axis adjustment,ensure the location precision within 0.01-0.02mm; 8.The upper heating head and placement head are designed 2 in 1,different size of heating nozzles are provided,easy to remove and install,can be customized,meet the more requirement for users. 9.High automation and precision to avoid artificial error fully,can make the best repairing effect for the lead free technology,double-deck BGA,QFN,QFP,capacitance resistance and other components and parts. 10.Equipped the extra camera to obverse the solder ball melting,to ensure the temp curve and weld effect(this function is optional). WDS-750 parameter Total power:6800W Upper heating power:1200W Bottom heating power:1200W Bottom IR heating power:4200W2400W is controlled Power supply:(Single Phase) AC 220V±10 50Hz Location way :Optical camera+ V-shape card slot + laser position for fast location Temperature control:High precision K sensor closed loop control,independent temperature control with ±1 â?? precision Appliance selection:High sensitive touch screen + temperature control mode +Panasonic PLC +step driver Max. PCB size:500Ã?450mm Min. PCB size:10Ã?10mm Sensor:4units Chip amplification multiple:2-30X PCB thickness:0.5-8mm Chip size :0.3*0.6mm-8cm Min. chip space:0.15mm Max. mount loading:500G Mount precision:±0.01mm Overall size :L670Ã?W780Ã?H850mm Optical camera:Can be removed front and back,left and right,prevent the dead angle Machine weight :90kg

1. Adopt infrared weld technology which independent exploration. 2. Use infrared heat, easy to cut through, heat proportion piercing tradition weld machine with sirocco. 3. Easily operate. Just need one day training. Can operation this machine. 4. Don't need weld tools. This machine can weld all the component of 35-50cm. 5. This machine has 800W heating system. Widely 240x180mm.

WDS-620 hot selling auto laptop mobile phone playstation TV motherboard repair machine https://youtu.be/K5aGW60I6vE Independent 3 heating zones temperature control system 1.The upper and lower hot air heating,which can heat up at the same time from the top of he component to the bottom of the PCB;bottom IR heating,temperature precision control within ±1â??.8 segment temperature control independently. 2.Hot air district heating for BGA and PCB at the same time,and large area IR heater preheating up for the bottom of PCB to avoid completely PCB deformation during reworking,the upper or lower temperature zones could be used alone and combine freely the energy of up and lower heating element. 3.Adopted high precision K-type thermocouple close-loop control and PID parameter self-setting system;4 temperature curves can be displayed with instant curve analysis function and multi-group user data can be saved;temperature can be tested precisely through external measurement interface,curves can be analysedã?�set and correct on the touch screen at any time. Precision optical alignment system Using HD and adjustable CCD color optical alignment system,beam splitã?�amplificationã?�lesseningã?�fine adjustment and auto focus with the function that automatic color aberration resolution and brightness adjustment,adjustable image contrast;equipped with 15 â?� high definition LCD monitor. Multi-functional and humanized operation system 1.Adopting the HD touch human-machine interface;upper heating head and mounting head designed 2 in 1;providing many kinds of titanium alloy BGA tuyere can be rotated in 360 degree for easy installation and replacement. 2.Xã?�Y and R angle adopted micrometer fine-tuning,accuracy locating,precision can reach ±0.01mm. Superior safety protection function With the alarm function, after the BGA welding the machine can alarm by itself.In the case of temperature abuse, the circuit can power off automatically with the double over-temperature protection.Temperature parameter having password protection to prevent any modification. Higher automatic function Newest WDS-620 is the updated system with 5 modes.Itâ??s Remove,Mount,Weld,Manual and Semi-auto.The mode can be changed freely.It can be used under automatic,semi-auto & manual mode. Technology parameter 1Power supply:AC 110V/220V±10 50/60Hz 2Total power:Max 5300W 3Heater power:Upper temp.zone 1200W,second temp.zone 1200W,IR temp.zone 2700W 4Electrical material :Driving motor+PLC smart temp.controller+color touch screen 5Temperature controlling:high precision K-sensorClosed Loop),independent temp.controller,the precision can reach ±1 6Locating way:V shape slot,PCB support jigs can adjust,laser light do fast centering and position 7PCB size:Max 410*380mm Min 10*10 mm 8Applicable chips:Max 80*80mm Min 1*1 mm 9Overall dimension:L650 W630 H850mm 10Temperature Interface:1 pcs 11Weight of machine:60KG 12Color :White&Blue

Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power 5100W Max 2 Top heater power 1200W 1st heater¡ 3 Bottom heater power 1200W 2nd heater 4 3rd IR heater 2700W (independent controlling left and right IR heaters) 5 power AC 220V;¨¤10 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions 640¢630900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size Max 410 370mm¡; Min65 65mm 10 Available BGA chip 11- 80 80mm 11 External temperature sensor 1piece 12 Net weight 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Feature: 1.3 independent heating system ZM-R6200 is available heating portion of the PCB board by hot-air circulate both from top and bottom at the same time. With large IR bottom heating, it can completely avoid PCB deformation during reworking period, you can use software to choose freely or use top heater or bottom heater depart, and combine freely with top and bottom heatercapacity, to make it easies for rework double BGA, CCGA, QFN, CSP, LGA, SMD etc. External sensor socket is precise detected temperature to analyze and proof on actual temperature curve of BGA at the same time. 2.Precise optical alignment system with optical alignment system and clear images, components can enlarge up to Maximum 230 times, mounting accuracy within +/-0.01mm, with a beam split, zoom in, zoom out and micro-adjust functions, adopted 12 HD monitor. 3.Multi-function operation system With touch screen interface, k-type thermocouple, close-loop control, and intelligent temperature compensation with automatically system, integrated design of top heater and sucker point. It can auto identify a high degree of suction and mounting. With automatic soldering and desoldering function. the temperature can be set to 6 segment and 6 segment constant temperature control, N groups of storage temperature setting parameters according to kinds of BGA chip set. 4.Superior safety functions After finish desoldering and soldering, there is alarming, when temperature goes out of control, the circuit will automatically power off, it is of double excess temperature protection function. Temperature parameter has a password to avoid arbitrary changes, with superior safe protection functions, can protect PCB, components and the machine from damage at any abnormal situation Specification parameters 1 Total power- 5100W Max 2 Top heater power- 1200W ¡ê¡§1st heater 3 Bottom heater power -1200W ¡ê¡§2nd heater 4 3rd IR heater- 2700W (independent controlling left and right IR heaters) 5 power-AC 220V10- 50/60Hz 6 Electrical materials temperature control system Adopted Dalian University of Technology 7 Dimensions- 640,630,900mm 8 Temperature control K-type thermocouple (Closed Loop), 9 Positioning V type groove;with universal fixture 9 P C B size- Max 410 mm Min65mm 10 Available BGA chip-180mm 11 External temperature sensor1piece 12 Net weight- 65kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Main features 1.Embedded industrial control computer,windows system. Adopt high definition human-machine interface, PLC control, there is password protection and modify function, can show 4-6 temperature curves and store multiple sets of data, with instant curves analysis function, and analyzing and correct BGA temperature at any time; 2.For guarantee the heating effect and mounting precision, control independently the top heater and mounting heat ,adopted linear slide make X,Y,Z axis can do micro adjustment and rapid positioning;after mounted, no need to move the PCB board in the bottom area, it can heat directly when move the top heater, avoid the moving of bga placement when move the PCB. Ensured the mounting accuracy and welding effect. 3.top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time, three heaters control independently. Show the heat time, temperature, and curves act, on the touch screen. 4.choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system control temperature precisely through PLC and temperature module, keep the temperature deviation at 2 degree.external temperature measuring interface check temperature precisely, achieve accurate analysis and collate the actual temperature curve. 5.V-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board. 6.Flexible and removable universal fixture the operator and the protective effects and no damage to the PCB board suitable for all kinds of sizes of BGA repair. 7.Adopted all kinds of BGA nozzles, with 360,227; rotation, easy for installation and replacement, customized is available; 8.Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, can adjust the clearness of the image by hand or automatic. 9.The X, Y axis and R angle with micrometer adjust; alignment accuracy is within0.01mm, with high definition HD monitor, avoiding human operation errors completely. 10.There are 8 segments rising temperature and 8 constant temperatures, can store millions of temperature curves, curve analyze, set and modify on the touch screen. 11.With voice control ãalarm in advance .À function, 5-10 seconds before finished soldering and desoldering alarm the operators with voice control to prepare the related works. Powerful cross-flow fan cool the PCB board fast by hand or automatic after desoldering and soldering, it can prevent the PCB board from deformation, ensure the welding effect. 12.With vacuum pump,|¦Ìangle 60 rotation, micrometer precise adjust mounting and nozzle, need no air source. 13.With CE certification, there is emergency stop switch and automatic cut off protective device when abnormal situation happen. Specifications and technical parameters: 1 Total Power-4850W 2 Top heater-800W 3 Bottom heate-The second heat area 1200w, the third heat area 2700w (plus size area to suit any kinds of PCB board) 4 Power-AC220V 50/60Hz 5 Dimensions-L790W640H800 mm 6 Positioning-V-groove, PCB support can X,Y axis adjust at any direction, additional with universal fixture 7 Temperature control-K Sensor, Closed loop 8 Temperature accuracy-2 degree 9 PCB size-Max 370 x 410mm Min 22 x 22mm 10 Work bench fine-tuning-front and back 15mm, right and left 15mm 11 Camera magnification10x-100x times 12 BGA chip2*2-80*80mm 13 Minimum chip spacing-0.15mm 14 External Temperature Sensor1-5 pieces available to choose, optional 15 Placement Accuracy-0.01MM 16 Net weight-93kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

ZM-R 5860 specifications 1 Total Power 4800W 2 Top heater 800W 3 Bottom heater 2nd heater 1200W 3rd IR heater 2700W 4 Power supply AC220V 50/60Hz 5 Machine dimension L635*W600*H560 6 Positioning V-groove, PCB support can be adjusted in any direction with external universal fixture 7 Temperature control (K Sensor) closed loop, independent heating, precision within 8 PCB size Max 410 370mm Min 20 20 mm 9 Electrical selection Highly sensitive temperature control module£«Touch screen (Taiwan)+Delta PLC 10 Weight 40kg 11 Package Wooden Box 12 G.W. 78KG 13 Package dimension L78*W78*H77cm. Main Features 1.Adopt liner slide which makes X¡¢Y¡¢Z axis all can do high positioning accuracy and fast maneuverability. 2. PCL control, can save 50 groups profile and analyze instant temperatures curves, equipped with password protection and modify function. The temperature curves can be show on the touch screen. Instantly set and analyze temperature parameter according with repairment need. 3. There are 3 independent heating areas, the 1st and 2nd hot-air heaters, can be set many temperatures parameters and sections at the same time. The 3rd IR preheating, prevent the PCB motherboard cracking, and can be adjusted the power comsumption.Top heater can be adjusted freely; second heater can be adjusted up and down. The machine operations be runned by human machine interface- high definition touch screen (Taiwan) 4. Offer all kinds of hot-air nozzle, it can rotate 360, with magnet, easy to install and change, and offer customized service. 5. Choose imported high-precision K-type thermocouple, closed loop control and automatic temperature compensation system, combined PLC module for the precision control of temperature. Temperature controlled within ¡¾3 ¡Æ. 6. Use a V-groove flexible fixture for PCB positioning to protect the PCB from deformation when heated or cooled, and it can rework for any BGA package size. 7. Powerful cross-flow fan rapidly cool the PCB board, built-in vacuum pump and external vacuum suction pen, pick up the chips rapidly. 8 There is an alarming after desoldering & soldering, and it is settled alarming in advance. 9. CE certificate, with emergency stop and Automatic power-off protection device when abnormal accident happens. 10. It can save many temperature parameters, easy to repair same chips. And can repair lead or lead free chips, can meet repairment of laptop, xbox360, mobile, ps3 and other components on the motherboard. wooden box, G.W. is 78KG,package dimension is L78*W76*H77cm.

hot air rework desoldering station is a professional phone repair rework station, desoldering and soldering of BGA IC components, 1000W 500 C QUICK 861DW lead free rework station for mobile phone BGA desoldering repair. Hot Air Rework Station Lead Free Soldering Station For BGA IC Components Welding. 220V or 110V option voltage. Note: 110V, need customized, time: about 1-2 days. With 3pcs Heat Gun Nozzles - size : 5mm 6mm 8mm, if need 3mm 12mm nozzle, need bought it alone. More QUICK 861DW Nozzles Features : With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. Specification : Power: 1000W Voltage: AC 220V 110V Temperature range: 100 C 500 C Air volume ratio range: 1 to 120 Maximum air flow: 120L min Dimensions: 188 (L) 245 (D) 135 (H) mm Package List : 1pcs x Quick 861DW rework station 1pcs x Hot air gun 1pcs x Hot air gun holder 3pcs x Heat gun nozzles 1pcs x Ground lead 1pcs x Instructions

Features introduce independent control heaters top and bottom heaters are hot-air heating, the third IR heater is infrared heating, the top and bottom heaters can heat PCB from upper and bottom at the same time. temperature accuracy within there are multi segments can be set at the same time; IR preheating area is adjustable according to desire requests, to make PCB heating evenly. it can heat PCB board and bga chips at the same time. And the third IR heater can preheat the PCB board from bottom, to avoid PCB from deformation during repair process. The top and bottom heaters heat independently choose high accurate K type close-loop thermocouple, and PID parameters automatic adjustment system it can show seven temperature curves and the millions of groups data can be saved through U storage device with instant curves analysis function and analyzing BGA temperature at any time; the sensor is for precise temperature testing. Precise optical alignment system Adopt adjustable CCD color optical system, with a beam split, zoom in, zoom out and micro-adjust functions, has automatic chromatism resolution and brightness adjustment system, amplify to 230 X, mounting accuracy within 0.01mm. InMulti-function operation system Ù Adopt high definition human-machine interface, available for setting ¡°set up¡± and ¡°operate¡± to avoid error settings, The top heater device and mounting head 2 in 1 design, with automatic identify BGA chips and mounting height, it is of automatic soldering and desoldering function.it can set 6 segments rising temperature and 6 segments activity temperature, and can save N groups temperature profiles. Adopted all kinds of BGA nozzles, with 360 rotation, easy for installation and replacement, customized is available; ÚV-groove PCB support, with rapid, convenient and accurate positioning, can fit for all kinds of PCB board; Flexible and removable universal fixture has protective effects and no damage to the PCB board, suitable for all kinds of sizes of BGA repair. Superior safety functions With CE certification; after desoldering and soldering, there is alarming. when temperature goes out of control the circuit will automatically power off, it is of double over-temperature protection function. Temperature parameter has a password to avoid from arbitrary changes, with superior safety protection functions, can protect PCB board components and the machine from damage at any abnormal situation Specifications and technical parameters Total power 5300W Max Top heater power 1200W (1st heater) Bottom heater power 1200W (2nd heater) 3rd IR heater 2700W independent controlling left and right IR heaters) power AC 220VA10 50/60Hz Electrical materials temperature control system Adopted Dalian University of Technology Dimensions L640*W630*H900mm Temperature control K-type thermocouple (Closed Loop), intelligent temperature compensation system Positioning V type groove, with universal fixture P C B size Max 410A370mm, Min65A65mm Wooden box

Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply¡ê;no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400 230; (Max) Preheating temp. 400 Positioning V-groove +laser positioning + universal fixture PCB size Max 410 370 mm Preheaing size 370mm 270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80¨80mm Min 22 mm Dimensions L640 W630 H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Features 1 Suitable for LED lamp beads repairing, size of micro LED components not less than 0.6*0.6mm can be repaired 2 Suitable for LED lamp beads of tape packaging and bulk materials, also any BGA and components which are difficult to repair. 3 High solution optical alignment system, accurate LED components positioning, ensure precise mounting. 4 Optical alignment is controlled electrically, can rotate automatically 5 Mounting head built-in pressure testing device, to protect the PCB 6 Built-in infrared laser positioning, fast positioning for PCB. 7 Adopt HIWIN precision guide rail for up and down movement system, ensure reliable and accurate running 8 Adopt up and down alignment for top and bottom heater, heating for appointed local zone, prevent PCB to turn yellow. 9 Bottom heater up and down manually, can adjust the heating height real time. 10 Adopt ceramics infrared radiator for IR heater, heating stably and uniformly with long serve life 11 Human-machine interface has multiple operation mode and permission, welding, and mounting manually, easy operation. 12 High resolution touch screen, which is up to 800*600 pixel 13 Adopt joystick control for alignment system, no need setting complicated parameters 14 Adopt Delta double ball bearing flow fan for air supply no need external air source 15 Adopt DCCE 6 channel module for temperature control system, automatic PID adjustment 16 Monitoring heaters real time, when accident happens, relevant sensors will send signal to PLC,which will close output channel and display fault condition. Protect itself automatically. Specifications Total Power Max 5300W Power AC 220V10% 50/60 Hz Top heater power 1200W Bottom heater power 1200W IR power 2700W Hot air temp. 400(Max) Preheating temp. 400Max Positioning V-groove +laser positioning + universal fixture PCB size Max 410 ,370 mm Preheaing size 370mm,270mm Chip type BGA,QGN,CSP,POP,QFN, Micro SMD,LED lamp beads Chip size Max 80,80mm Min 22 mm Dimensions L640 W630 ,H900 mm Temperature sensor 1 piece Net weight 70kg Package Wooden box Dimension :80*80*105cm Gross weight: 120kg Delivery time: 3-7 working days

Features: 1. Embedded Windows system, PLC user interface control, optical alignment system, display 8 temperature profile at the same time; 2. Can save and print temperature profile, contrast and analysis temperature; 3. HD color optical alignment system, optical zoom up to 22 times; 4. When welding,with CCD camera to monitor the melting process of solder ball; 5. Auto alignment, mounting, welding and removal and recycle BGA after remove; 6. Upper heater with hot air, bottom with hot air and IR to preheat; 7. Three independent heater with 9 segment temperature up(down)+9 segment constant control, can store N groups temperature profile; 8. Bottom heater with supporter to prevent PCB deformation; 9. Reserved Nitrogen interface, rework process in the protection of Nitrogen; 10. After removal and welding, with cooling fan to cool PCB board, ensure welding effect; 11. Equipped with various size of hot air nozzle, heater can 360 degree rotation, easy to replace. 12. Build-in vacuum pump, no need gas sources. Specification: PCB Size: L750, W700mm PCB Thickness: 0.1~5mm Fine-tuning accuracy: 0.01mm Angle fine-tuning: 360 Temperature Control: (K Sensor)(Closed loop) PCB Positioning: (Outer) Sub (Bottom) heater: (Infrared)4200W Main (Top) heater: (Hot air) 800W+800W Power supply: (Single phase)220V,50/60Hz,5.8KVA Machine dimension: L1500, W910, H1600mm Weight of machine: (Approx.)260kgs. Wooden package or customized: The price is not including delivery charge. Payment: T/T Western Union Money Gram delivery terms: EXW.

Digital Trainer is intended for elementary as well as advance training of Digital electronics and for bread board digital circuits, AND, OR, NOT, NAND, NOR, XOR, Three State Buffer, RS Latch, JK Flip Flop, Monostable Multibrator. and UP/ DOWN Counter. Practical experience on this board carries great educative value for R & D labs, Science and Engineering Students. Specifications: 01. Breadboard : Solderless Bread board with 1680 inter connected Tie Points 02. Pulse Switches : 2 No?s. Bounce free push buttons 03. Logic Switches : 8 logic level Switches in Dip type . 04. Power Supply : Fixed: +5V at 750 mA 5. Power Sockets : Logic Probe Power Supply Sockets 06. Logic Input : 8 LED buffered logic level indicators 07. Variable Clock : Fine adjustment of clock frequency. Clock range selection L : 10 ? 40 Hz, H : 1K ? 20K Hz. 08. Jacks : 2mm to BNC Socket 2 No. 2mm to 4mm Socket 2 No.

BGA Rework Station Zhuomao bga rework station china is one of the best BGA rework station suppliers in China. First of all, what is BGA machine? BGA rework/repair station is what we called ball grid array rework station, also abbreviated as BGArs. BGA is a chip packaging technology, which is applied to improve the performance of digital products and reduce the volume of products through the ball grid array structure. All digital products through this BGA machine china technology will have common characteristics, that is, small volume, strong performance, low cost, and powerful function. BGA rework machine is the exact equipment used to repair BGA chips. According to the operation requirements, we have launched different BGA rework machines that enjoy a good reputation from our clients all over the world recently.

Quick 861X 1300W Soldering Rework Station Quick Hot air gun Flagship Edition Hardcover Edition,Quick 861X Intelligent Digital Display 1300W High Power Heat Gun Rework Hot Air Gun Desoldering Station Soldering Station. Features: With CH1, CH2, CH3 three working channels, and each channel can be set to the amount of wind, and temperature. Password protection and key lock function. Facilitate real-time operation, with magnetic switch control lever is placed in the handle holder immediately into hibernation. With automatic sleep function, in a dormant state parameters can be set. Sensor closed loop, microcomputer zero trigger temperature control, power, heating quickly, easily and precisely adjust the temperature stable, free from the influence of wind. The use of brushless vortex blower, air flow adjustable, wide range, can be adapted to a variety of uses. The system has an automatic cooling function of wind capacity, extend the life of the heating element and protect the hot air handle. ADB black, leading, the trend, 1300W high power, air volume 2-200 level. Real-time operation is convenient with magnetic control switch control, put the handle on the handle stand and sleep immediately. 3 standard air nozzles with different specifications. Temperature-locked channel, according to different job requirements, three different working modes can be set. Real-time operation is convenient with magnetic control switch control, convenient temperature adjustment.

WDS-700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after-sales service and rework. How to separate BGA chip from motherboard / How to replace a new BGA chip Repair steps 1.Separate the BGA chip from mother board -we called desoldering 2.Clean Pad 3.Reballing or replace a new BGA chip directly 4.lignment/Positioning -Depend on experience ,silk frame ,optical camera 5.replace a new BGA chip - we called Soldering

Atten ST-2090D 80W Thermostatic Digital Rapid Heating Welding Rework Station Soldering Iron Kit with Soldering Wire Holder, ATTEN ST-2090D Multi-function Digital Thermostatic 80W Lead-free Original Soldering Station for Cellphone BGA SMD PCB IC Repair. Features: Max Power of 80 W, soldering iron 28 V AC Temperature read out in MCU controlled temperature calibration. Soldering station with solder wire stand. Auto-standby, Auto-shutdown function are available. Heating wire and sensor use PTC materials. Soldering tip designed separate from heater and using common T900 series to save use-cost. Very fast heating: from room temperature to 350 C only approx. 15 s Soldering iron with flexible connection cable Adjustable temperature range 80 - 480 C Specification: Model: ST-2090D Power consumption: 80W Input voltage: AC 220V Output voltage: AC 24V Display method: LED Temperature range: 80~480 (176 896) Temperature offset range: 50 (90) Temperature stability: 2 at idle temperature Tip to ground resistance:

Phone PCB Repair Metal Shelving Bracket for Soldering Station external fixator Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun. picture show : Phone repair Air gun on the shelf can be rotated 360 degree, easy operate. Height can be adjusted within a range of convenience. Scientific design, operation Circuit boards with arbitrarily placed in the bottom range, arbitrary. Plate using metal, sturdy and beautiful.Is the perfect companion for hot air gun

Reflow Touch Screen BGA Rework Station1. Product application of reflow bga rework station DH-C12. Product specification of reflow bga rework station DH-C1 3. Product advantages of reflow bga rework station DH-C1 4. Product details of reflow bga rework station DH-C1 Cooling fanAfter heating is completed, manually turn on the high-power fan to cool the PCB board to prevent PCB board deformation.KnobMove the knob up and down for more convenient and flexible operation.LED LightUsing Taiwan's imported high-brightness LED lighting can effectively see the melting of tin or mold on small components. 7" Touch ScreenChinese and English manual display for your option. 5. Why Choose reflow bga rework station DH-C1 ? Precise PID smart temp control , the No.1 key factor for the quality of BGA Rework Station Temperature curve. Wide range of application, one machine suits for different kinds of IC. High successful rate of BGA rework. Accurate rework only heats the chips where is needed. All excess heat will reflow back to ensure the components around BGA will not be influenced . Heating doesn't influence the appearance of PCB even after using several times.6. Packing, delivery of reflow bga rework station DH-C1Flexible delivery By DHL, TNT, FEDEX, Air shipping, Sea shipping and Land transportation etc. taking 3~30 days to arrive at destination according to different shipping ways. 7. Contact us for more details of BGA rework station Scan the QR code to save the contact 8.Learn something related about BGA Advantages of BGA : Improved PCB design as a result of lower track density. The BGA package is robust. Lower thermal resistance. Improved high speed performance and connectivity. What's the difference between LGA, BGA, and PGA sockets, LGA is Land Grid Array. PGA is Pin Grid Array. BGA is Ball Grid Array.LGA is what you're going to get right now. The CPU has metal contacts flush on the surface, pins in the socket. PGA is the other way around. The pins are on the chip. BGA is for CPUs that will be soldered into place (think laptops and consoles).LGA are desktop sockets.BGA are laptop sockets where the CPU is soldered to the board.PGA are laptop sockets where the CPU may be able to be removed.