Steel wheel rims.
Wheels and rims.
Wheel Rims.
Various kinds of tube - type wheel rims such as 20-7.00T/20-7.50V/20-7.50FL.
Floating wheel cap, led floating wheel cap, car accessory.
Bush, sleeve, valve body, propeller cap, ring, liner, worm wheel, crusher part (bush), screw nut, seat liner.
Wheels, car wheels, oem wheels, after market wheels, premium wheels, luxury wheels, forged, flow forming,low pressure casting.
Korean auto part, wheel hub bearing, alternator (generator) & starter motor, drive shaft (cv axle) & boot kit, fuel pump & fuel motor, filter (air filter, a/c filter, oil filter), gasket, shock absorber, suspension parts (ball joint, stabilizer link, rack end, tie rod end, control arm), brake pad & shoe, power steering gear & p/strg oil pump, engine oil.
Used rail, aluminum ingot, copper cathode, zinc ingots, sugar ic45, lng, lpg, en590, espo, diesel fuel, lco, bitumen, petroleum coke, sulphur, sulfur, silicon manganese, bauxite, iron ore, copper ore, aluminum scrap, copper scrap, organic fertilizer, butyl tube.
1565, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast 1675, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast 1780, 35, 4h 5h/114.3, 67.1~73.1 flow forming 1880/1890, 1985/1995, etc. Export standard packing
Price of product (USD price or FOB price) - Ask for price Product Origin - South Korea Minimum Order Size and Packaging details - 1 pieces / general export packing
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
20 inch SET OF Alloy GT63S COPY WHEELS - CUSTOM MADE MOST MERCEDES AMG & GT 4 DOOR Opset fronts 20 X 8.5 J +15 5H 112 rears 20 X 9.5 J +20 5H 112
20 inch SET OF Alloy GT63S COPY WHEELS - CUSTOM MADE MOST MERCEDES AMG & GT 4 DOOR Opset fronts 20 X 8.5 J +15 5H 112 rears 20 X 9.5 J +20 5H 112