Casters, castors wheels.
Furniture parts,hinge, adjustable foot, minifix, caster.
Wheels, car wheels, oem wheels, after market wheels, premium wheels, luxury wheels, forged, flow forming,low pressure casting.
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1565, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast 1675, 35, 5h/114.3, 8h/100~114.3 67~73.1 cast 1780, 35, 4h 5h/114.3, 67.1~73.1 flow forming 1880/1890, 1985/1995, etc. Export standard packing
Price of product (USD price or FOB price) - Ask for price Product Origin - South Korea Minimum Order Size and Packaging details - 1 pieces / general export packing
20 inch SET OF Alloy GT63S COPY WHEELS - CUSTOM MADE MOST MERCEDES AMG & GT 4 DOOR Opset fronts 20 X 8.5 J +15 5H 112 rears 20 X 9.5 J +20 5H 112
20 inch SET OF Alloy GT63S COPY WHEELS - CUSTOM MADE MOST MERCEDES AMG & GT 4 DOOR Opset fronts 20 X 8.5 J +15 5H 112 rears 20 X 9.5 J +20 5H 112
TECHNICAL SPECIFICATION Main specification Chassis brand Shacman Others Chassis model H3000 Overall dimensionLWH 1031524963400mm Gross Curb weight 16250kg 10100kg Chassis Drive model 6x4 Left hand drive Wheel Base 43251350 mm Tyre size number 1200R20 radial tires 101 with one spare tyre FuelEngine type 6 cylinders inline 4stroke water cooled turbo intercooling direct injection diesel engine Engine model WD61547 Engine horse power 371HP
20 Inch Set Of Forged Gt63s Copy Wheels - Custom Made Most Mercedes Amg & Gt 4 Door Opset Fronts 20 X 8.5 J +15 5h 112 Rears 20 X 9.5 J +20 5h 112
20 inch SET OF FORGED GT63S COPY WHEELS - CUSTOM MADE MOST MERCEDES AMG & GT 4 DOOR Opset fronts 20 X 8.5 J +15 5H 112 rears 20 X 9.5 J +20 5H 112
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Resin Bonded Wheels is manufactured by mixing synthetic resin (phenol and Polyimide) and fillers super abrasive materials. Usage of the product: Resin Bonded Wheels can be effectively used in the brodest range of appliances. Resin Bonded Wheels can be designed for both wet and dry grinding modes.
Vitrified Bonded Wheels is very fragile as a mixture of glass materials is used. It is more excellent in bonding. Strength than the Resin bond. It can adjust its strength and chip discharging function by changing its porosity and Structures.
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
Usage of the products : Wafer Grinder Wheel to adjust the thickness and height for easy Chip packaging with the Patterned Wafer that completed FAB process, which is the pre-process in the semiconductor manufacturing process
- MODEL: HL770-9 - Bucket : 4.2 CBM - Engine : Cummins-QSL (284 ps / 2,000 rpm)-TIER III - Operating weight : 23,100 KGS - Overall dimension (LxWxH) : 8,700 x 3,100 x 3,560 mm - Tire : 26.5-25-32PR(L3) - Dump height: 3,090 mm - Dump distance: 1,295 mm - Including ride control, single joystick lever, ROPS & FOPS Cabin , A/C