Layers Count:2L Base Mateial:Alu Board Thickness: 1.60±0.15mm Copper Thickness: 2/2 oz Min Hole:0.20mm(8mil) Min Trace Width: 0.5mm(19mil) Min Trace Spacing: 0.25mm(10mil) Surface Finishing: ENIG 5u' Test: Flying probe Panel Dimension: 110.00mX437.50mm/pcs Panel Method: 1up, 1*1 Lead Time:fastest 5 wds,normal 8-13wds
Part Name: ME-PCB-197-01 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 335* 245/1 up. Copper thickness : 1/1/1/1/1/1/1/1oz Surface: HASL Solder: Blue Silkscreen: White Special: hole copper 25um, blue solder mask
Layer count:20l Base material: fr-4 tg170 Copper thickness: all layers 2oz Board thickness: 3.2mm±0.3mm Min hole diameter: 0.50mm(19mil) Min trace width: 0.20mm(8mil) Min trace spacing: 0.20mm(8mil) Suface finishing: enig Test: flying probe Panel dimension: 106.63mmx134.42 mm Panel method: 6up, 2*3 Blind:dr1-2, dr3-4, 2 step blind vias Via diameter: 0.5mm(19mil) Lead time:fastest 10wds, normal 15-20 wds
Layers count:4l Base mateial: iteq tg180 Board thickness: 1.60±0.15mm Min hole: 0.20mm(8mil) Min trace width: 0.089mm(3.5mil) Min trace spacing: 0.094mm(3.7mil) Surface finishing: enig Test: flying probe Panel dimension: 157.00mmx409.55mm/pcs Panel method: 1up, 1*1 Lead time:fastest 3wds, normal 5-7wds
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material: Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil: Ed/ra Min. Line width: 2 mil Min. Line spacing: 2 mil Min. Hole size: 0.2mm Max. Board size: 800x400mm Min. Board thickness: 0.1mm Min. Solder mask thickness: 10um Solder mask types: Green, yellow, black, white, blue, red and clear Profiling: Punching, routing, v-cut Soldering thermal resistance: 300°c/10 seconds Peeling strength: =1.4kg/cm Surface resistance: 105mo Insulation resistance: 105mo Dielectric strength: 9.8x105v/cm Flammability: Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, Double-sided, Multi-layers (max 28 layers) and Rigid-flexible PCB, Aluminium board Surface Finishing: HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4 Copper Foil:ED/RA Min. Line Width:2 mil Min. Line Spacing:2 mil Min. Hole Size:0.2mm Max. Board Size:800x400mm Min. Board Thickness:0.1mm Min. Solder Mask Thickness:10um Solder Mask Types:Green, yellow, black, white, blue, red and clear Profiling:Punching, Routing, V-cut Soldering Thermal Resistance:300°C/10 seconds Peeling Strength:=1.4kg/cm Surface Resistance:105mO Insulation Resistance:105mO Dielectric Strength:9.8x105v/cm Flammability:UL-94V-0 Performance Test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Layer count: 2L Laminate: Aluminum Board thickness: 1.60mm Base copper: loz Surface finish: Lead free HASL
Layer count: 10L Laminate: IT180, Tg180¡æ Board thickness: 1.60mm Board size: 85.00mm X 146.50mm Line W/S: 3.5mil / 3.5mil Min hole: 0.25mm Impedance control: 50+/-10% Surface finish: ENIG
Layer count: 16L Laminate: FR4, S1170 Board thickness: 2.95mm Board size: 129.50mm X 151.50mm Line W/S: 4mil / 4mil Min hole: 0.20mm Impedance control: 50+/-10% Surface finish: Immersion Silver
Layer count: 8L Laminate: Rogers 4350 Board thickness: 1.60mm Board size: 102.60mm X 121.80mm Min hole: 0.30mm Line W/S: 4.5mil / 4.5mil Surface finish: ENIG
