Types: Single-sided, Double-sided, Multi-layers (max 28 layers) and Rigid-flexible PCB, Aluminium board Surface Finishing: HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4 Copper Foil:ED/RA Min. Line Width:2 mil Min. Line Spacing:2 mil Min. Hole Size:0.2mm Max. Board Size:800x400mm Min. Board Thickness:0.1mm Min. Solder Mask Thickness:10um Solder Mask Types:Green, yellow, black, white, blue, red and clear Profiling:Punching, Routing, V-cut Soldering Thermal Resistance:300°C/10 seconds Peeling Strength:=1.4kg/cm Surface Resistance:105mO Insulation Resistance:105mO Dielectric Strength:9.8x105v/cm Flammability:UL-94V-0 Performance Test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Types: Single-sided, double-sided, multi-layers (max 28 layers) and Rigid-flexible pcb, aluminium board Surface finishing: Hasl(lf), gold plating, electroless nickel immersion gold, Immersion tin, osp(entek) Base material:Polyimide(kapton), polyester(pet), aluminium, fr4 Copper foil:Ed/ra Min. Line width:2 mil Min. Line spacing:2 mil Min. Hole size:0.2mm Max. Board size:800x400mm Min. Board thickness:0.1mm Min. Solder mask thickness:10um Solder mask types:Green, yellow, black, white, blue, red and clear Profiling:Punching, routing, v-cut Soldering thermal resistance:300°c/10 seconds Peeling strength:=1.4kg/cm Surface resistance:105mo Insulation resistance:105mo Dielectric strength:9.8x105v/cm Flammability:Ul-94v-0 Performance test: 100% electrical and electricity performance test
Layer count: 2L Laminate: Aluminum Board thickness: 1.60mm Base copper: loz Surface finish: Lead free HASL
Layer count: 10L Laminate: IT180, Tg180¡æ Board thickness: 1.60mm Board size: 85.00mm X 146.50mm Line W/S: 3.5mil / 3.5mil Min hole: 0.25mm Impedance control: 50+/-10% Surface finish: ENIG
Layer count: 16L Laminate: FR4, S1170 Board thickness: 2.95mm Board size: 129.50mm X 151.50mm Line W/S: 4mil / 4mil Min hole: 0.20mm Impedance control: 50+/-10% Surface finish: Immersion Silver
Layer count: 8L Laminate: Rogers 4350 Board thickness: 1.60mm Board size: 102.60mm X 121.80mm Min hole: 0.30mm Line W/S: 4.5mil / 4.5mil Surface finish: ENIG
Layer count: 18L Laminate: FR4, S1170 Board thickness: 3.20mm Board size: 420.00mm X 226.50mm Line W/S: 4mil / 4mil Min hole: 0.20mm Impedance control: 100+/-10%
4-Layer Base film: 1oz CU/1-mil PI No ADH RD Cover lay: 1-mil PI/1-mil, ADH Stiffener: 1mm steel Surface finishing: immersion gold With differential impendence Control: 10|10%, thick within 0.350.350.05mm 1mm steel stiffener vacuum packing
Fast delivery single&double side led pcb, aluminum pcb for variety of power led.
Layer:1-50/material:FR4,PTFE,Rogers/Board thickness:0.2-10mm/min hole diameter 0.15mm/Min line wideth&space2&2mil/Aspect ratio:32:1/size:50X50mm--609X1200mm/copper thinckness:HOZ-10OZ/surfce finishing: ENIG,I-S,I-Tin,Panel Gold plating,Hard gold plating,Soft gold,HASL,Lead free HASL,OSP,ENPIG/others:back drill,special technology
FR4 High Tg 34 layer ATE,Burn-in IC or semiconductor test PCB: Thickness 4.8mm,min hole diameter:0.15mm,Aspect ratio:32:1,size:440*440mm,surface finishing:panel gold plating+hard gold plating,min hole wall to conductor:4.8mil, via hole:vacuum resin plugging
we can do 2L-8L boards normal size
We adopt most of the testing and inspecting equipments of the industry No standard Lot size
We are manufacturer of Printed circuit board (PCB) in china. Our main products range from Multilayer PCB, High frequency PCB, Metal base PCB, Hi-Tg heavy copper foil PCB and Mixed Dielectric base PCB, HDI, rigid-flex PCB, and many other customized PCB with special performance which are widely used in Communication, power supply, computer, consumer electronics, industrial control, medical device, Aeronautics and Astronautics high technology field and spread over America, Europe and some Asia Districts, achieving their satisfacation.
