Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material
Key specifications/special features:
Number of layers: 2 to 4
Thickness: 12 mil only
Thermal performance: 30% better conduction than standard 0.062-inch fr4
New fr4 technology from photo circuit
New thermally conductive adhesive technology
Suitable for body through power train controller application
Standard dimension: 490x8857; 490mm 600x8857; 500mm (optional dimension for discussion)
Standard thickness: 1.0, 1.5, 2.0, 3.0 mm(optional dimension for discussion)
Copper foil thickness: 35um, 70um, 105um, 140um, 210um
Heat conduction and insulating layer thickness: 60um
Application
Motor, auto-bicycle trigger, voltage adjustor
Audio output magnifier
Power supply, solid transistor base
Industrial power
Solar-energy batter base, heat sinker etc.
Printed circuit board assembly service
Key specifications/special features:
Applications: computer motherboard, net card communication card
Smd, dip, ai, oem/odm assembly
Small orders can be accepted
Primary competitive advantages:
Payment terms: t/t or l/c
Country of origin: china
Minimum order: 1, 000 pieces
Three phase elcb with shock guard
Three phase elcb is micro controller based with shock guard phase preventer inbuilt which allows you to set low, high voltage and amp cut off phase wise individually and it conitnuously displays on lcd display all the parameters like consumption of amp individually per phase and voltage received from the source leakage etc.
PCB - printed circuit board
Our company is specialized in doublesided and multi-layer pcb, pcba, oem and so on. Our mission is to be the most successful pcb and pcba maker. We have advanced production machine and stable product quality. Also you can enjoy our considerate after-sales service.
You can search our webside to know our company and our product. If you are interested in our product, please have no hesitent to contact with us. We hope youf+re not too busy to know us.
Printed Circuit Board
We specialise in Manufacturing and Exports of DRILL ENTRY AND BACK UP BOARDS
DRILL ENTRY AND BACK UP BOARDS
WE HAVE THREE TYPES OF DRILL ENTRY AND BACK UP MATERIAL
PHENOLIC LAMINATED SHEETS ,BOTH SIDE GLOSS(BROWN COLOUR)
MELAMINE LAMINATED SHEETS,BOTH SIDE GLOSS(BOTH SIDE WHITE COLOUR)
Wood Core with Melamine Paper both sides. THICKNESS : 2.5MM
THIS IS A GOOD BACK UP MATERIAL.
Features:
Used for PCB drilling
Good surface flatness, good thickness tolerance
Size:
42"X48"
54"X48"
Thickness: 0.5mm, 0.8mm, FOR (ENTRY BOARD)
THICKNESS: 1.2mm,1.5mm,2.0mm,2.5MM (BACK UP BOARD)
ALLUMINUM ENTRY SHEET
FOIL PAPER FOIL LAMINATE
FEATURES
USED FOR PCB DRILLING
THICKNESS AS PER REQUIREMENT
All models of the H41q system family have all the components required for control tasks in a 19 inch subrack 5 units high with an integrated cable tray.
â?? Depending on the system model, one or two central modules controlled by micro processors
â?? Two interfaces RS485 on the central module for a transfer rate of up to 57600 bps
â?? The central module generates a watchdog signal to switch off the testable output modules as the second way of switch off in the case of a fault
â?? One or two power supply modules 24 V DC/5 V DC to generate the 5 V DC operating voltage for the central modules and the control voltage for the input/output modules
LAYER Double side FPCB + partial PSR + SUS + CBF
Application CCM
Thickness 0.3T
L/S 60/60
DRILL/LAND 200/350
Copper plating Inner Hole Min. 18
Inspection spec Zero defect in SUS and appearance
LAYER Double side FPCB + Partial PSR
Application SENSOR
Thickness CON. 0.2T
L/S 125/125
LASER Drill 50
Copper plating Hole inner Min. 25
Inspection spec Not allowing damage on copper plating part
SPECIAL item for controlling
Stair-shape at Copper plating neighboring area
Apply WET LAMINATION method
LAYER FPCB S/S
Application Medical equipment
Thickness 0.06T
L/S 50/50
LASER CUT tolerance +-50
Surface treatment SILVER
Inspection spec Zero defect
SPECIAL item for controlling
Film coating and resolution
Will apply scale for Laser individual recognition
Trends driving the car of the future are all enabled by more complex and intelligent electronics.
Advanced driver-assistance systems (ADAS), human-machine interface (HMI), electrification, and increased vehicle to vehicle (V2V) and vehicle to infrastructure (V2I) connectivity rely on advanced electronics and sensing components. Electronics for automotive that must be produced at the highest quality levels, and quite literally, cannot fail.
JinSung Electronics prides itself on the ability to support all levels of flex interconnect technology requirements that are truly helping to save lives and improve quality of life.
For JinSung's entire twenty-five years of flex interconnect fabrication service dedication to the field of medicine has been a key drive and focus. With innovation and collaboration with our customers, JinSung has produced flex and rigid-flex printed circuit boards that help to combine more functionality, ease of operation and smaller package size to doctors and health professionals.
JinSung is providing it's rigid-flex technology to our Military's continuing efforts to promote next generation Intelligent Weaponry Technology to the battlefield.
JinSung is providing small volume prototypes and mass production quantities that address the needs of defense applications responding to time critical and embedded real-time mission critical applications.
Jinsung Electronics is developing its competitive RF & FPCB products to keep pace with the rapid changes in smart phones & portable electronics.
Jinsung Electronics, founded in 1995, manufactures RF/Flexible PCB, which are the most basic main board of electronic products that are closely related to our daily life.
The trend for Future automobiles enable with more complicated and Intelligent electronic devices. Advanced Driver Assistance Systems (ADAS), human-to-machine interface (HMI), electrification, and connection increases of V2V and V2I depend on the advanced electronic devices and detecting parts. Electronic devices for automobiles that should be produced under the best quality condition cannot be failed.
1. LAYER : 10 LAYER [FLEXIBLE 4L + RIGID 6L] 10-4-10
2. Application : GPS
3. Thickness : 1.6T
4. Machine Drill : Min. 0.2 mm
5. Laser Drill : BVH Min. 0.1 mm
6. Cu Plating : HOLE Min. 25 micrometer
7. L/S : 100 micrometer / 100 micrometer
Jinsung Electronics company produces High-end Rigid-Flex PCB which is used for multiple product groups such as smartphones, camera module, electric apparatuses, medical devices, defense articles, and so on supplying to domestic and global market
1. LAYER : 6 Layer (FLEXIBLE 2 layer+RIGID 4 layer) 6-2-6
2. Application : Inspection equipment of Semiconductor
3. Thickness : 0.5T
4. Structure : 1-2LBVH ,2-3L BVH 1-4 STACK BVH , 4-6BVH , 56BVH
5. Machine Drill : Min. 0.25mm
6. Cu Plating : VIA FILL + PTH
7. BGA(LAND/PTICH) : 0.3 mm / 0.4pitch
