Two- to four-layer rigid-flex pcbs with fr4/hdi-pda laminate material Key specifications/special features: Number of layers: 2 to 4 Thickness: 12 mil only Thermal performance: 30% better conduction than standard 0.062-inch fr4 New fr4 technology from photo circuit New thermally conductive adhesive technology Suitable for body through power train controller application Standard export carton
