PCB
PCB Solutions We offer you: Low to high layer counts: Single sided to 28 layers Complex PCB solutions: Special materials, heavy copper Aluminum board FPCB: Flexible PCB (FPC) Quick turn Prototype,Volume production Design for manufacturability (DFM) We never stop building and perfecting our global support to meet your growing needs PCBA Solutions We offer you : PCBA, PCB assembly: SMT & PTH & BGA PCBA and enclosure design Components sourcing and purchasing Quick turn prototype,Volume production BGA rework/ reback Plastic injection molding Metal sheet stamping Final assembly, OEM ,EMS services Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
PCB Assembly manufacturer. Our PCB production capacity can reach 10000 square meters per month and PCB assembly capacity at 250, 0000 components per month.
2. Kind: lightest load 3. Product color: brown 4. Material: based on chinese steel products: 65mn, 50grva, 60si2mn, 55grsi (may request according to the visitor) Packing: pe or on request
- PCB design technique for a certain product - Design skill dealing with Power signals - Team work in PCB design - EDA software advanced function & application - Introduction new layout & Simulation - IC package design technique - Design for Cost-down consideration www.green-partner.com.cn
Reference parameters: Substrate material: red copper (made in china) Dimension: 69mm*69mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: silver plating (ag thickness¡y12 Forming mode: cnc Package wattage: 150w Vacuum package
Reference parameters: Model number: csx-cu-005 Substrate material: red copper (made in china) Dimension: 60mm*58mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: silver plating (ag thickness¡y120|¨¬¡å) Forming mode: cnc Package wattage: 100w Vacuum package
Reference parameters: Substrate material: red copper (made in china) Dimension: 140mm*129mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: immersion gold (au thickness Forming mode: cnc Package wattage: 100w Vacuum package
Board name: n-multilayer-pcb-22 Pcb type: mechanical blind buried board Layers: 22 Board thickness: 5.4mm Min bga sphere diameter: 0.30mm Material: fr4(tg130) Rohs material: yes Industry: military Finishing: enig Acceptance criteria: ipc-6012-ii
Reference parameters: Substrate material: red copper (made in china) Dimension: 111mm*60mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: osp Forming mode: cnc Package wattage: 200w Vacuum package
Material: fr-4 tg180 Board thickness: 2.0mm Min line/space: 0.127/0.127mm Min hole size: 0.25mm Surface treatment: immersion gold
Material: fr-4+pi Layer count£º6 layer Board thickness:1.60mm Min line/space: outer layers:0.09/0.09mm Inner layers: 0.075/0.075mm
Material of pcb: rigid pcb and flexible pcb¨¦hdi Layers: 2-18(layers) Finished thickness¨ºo0.2-3mm Pcb surface finish: Enig, hasl, hasl leadfree, gold plated, golden finger Pcb soldermask color: green, blue, black, white, yellow, red Copper thickness: 1oz, 2 oz, 3oz, 4oz Min. Line width/space: 3/3mil Min. Hole size: 0.1mm Max. Pcb dimession: 1200*800mm 1kg
6-layer tg 170; 1.6mm ipc class 2; 1oz copper & enig(2u'') 10-20pcs per bag, with vaccum packing
Layer: 1 to 32 layers Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers Board thickness: 0.21mm to 7.0mm Copper thickness: 0.5 OZ to 7.0 OZ Copper thickness in hole: >25.0 um (>1mil) Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm) Min. Drilled Hole Size: 3mil (0.075mm) Min. Line Width: 3mil (0.075mm) Min. Line Spacing: 3mil (0.075mm)
Key specifications/special features: specifications: Base material: fr4, pcb, Layer count: 4 layer board Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: immersion gold Soldermask color: green Available specifications: Base materials: fr4, aluminum, fpc and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: hal, enig, osp, gold finger and tin chemistry Possible soldermask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1, 000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum)
Key specifications/special features: specifications: Base material: ptfe, pcb, fr4 Layer count: 4layer board Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: enig Solder mask color: green Available specifications: Base materials: fr4, aluminum, fpc and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: hal, enig, osp, gold finger and tin chemistry Possible solder mask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1, 000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) Smt pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (pth): 0.25mm Hole tolerance (npth): 0.15mm Sm tolerance (lpi): dimensions
Key specifications/special features: specifications: Base material: ptfe, pcb, fr4 Layer count: 4layer board Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: enig Solder mask color: green Available specifications: Base materials: fr4, aluminum, fpc and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: hal, enig, osp, gold finger and tin chemistry Possible solder mask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1, 000mm
Available specifications: Base materials: FR4, aluminum, FPC and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry Possible soldermask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1,000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) SMT pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (PTH): 0.25mm Hole tolerance (NPTH): 0.15mm SM tolerance (LPI): Dimension Electrically test: supported RoHS Directive-compliant Possibility of SMT device mounting: supported Product-level Certifications: SGS:12024915-G2 ROHS:SP10-003347-SH UL:E302512-080423 SGS:12409491-GZ
Specifications: Applicable pcb (l x w): 50 ¡á 50 to 700 ¡á 460mm Minimum component: 0201 Minimum qfp pitch: 0.4mm Minimum ic pitch: 0.30mm. Minimum bga ball diameter: 0.40mm Ball pitch: 1.0mm Maximum bga size: 74x74mm Service include: pcb layout and bom design or copying, component procurement, smt, dip, enclosure assembly, test, and packing Mounting capability: 9, 000, 000 chips a day Dip: 700, 000 pieces a day We are planning to prepare 2 lines more this year Applications of our product: smps, pci, mother board, controller, cctv, telecommunication, dvd, mp3, gprs, military, and more Primary competitive advantages: Shenzhen has the biggest electronic market We can procure most of component in the shortest at the lowest price We have good business relationship with main ic manufacturers, such as ns, ti, on, fairchild, st, microchip, and more We have our own pcb factory, can offer one stop service for client Our employees are experienced and stable High-precision machine and equipment can guarantee quality X-ray, aoi, visual checking and function test confirm our delivery goods 100% past No moq All inquiries will be replied within 2 hours Competitive price and short lead-time Rich experience in importing and exporting Good relationship with all kinds of forwarder
