Cu-Pcb

Reference parameters: Substrate material: red copper (made in china) Dimension: 69mm*69mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: silver plating (ag thickness¡y12 Forming mode: cnc Package wattage: 150w Vacuum package

Reference parameters: Substrate material: red copper (made in china) Dimension: 140mm*129mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: immersion gold (au thickness Forming mode: cnc Package wattage: 100w Vacuum package

Reference parameters: Substrate material: red copper (made in china) Dimension: 111mm*60mm Thermal conductivity: 400w/m-k Solder resist ink: high reflectivity of dainippon white ink Surface treatment: osp Forming mode: cnc Package wattage: 200w Vacuum package

Material : fr4 Board thickness:1.6mm Number of layer:8l Pth Cu thickness : outerlayer70um, innerlayer 70um Pcb size : 400mm x 220mm Finishing : leadfree hal 2 legend prints, soldermask 2 side Electrical testing required Pcb size : 400mm x 220mm

Thermoelectric Separation Copper Based PCB Layers: 1 Thickness: 3mm Cu PCB for high power LED light Substrate material: Red Copper Copper thickness: 1 Oz Plating process: Immersion gold Description: Power LED MCPCB Countersink holes

Fr4 standard pcb from 2 ~ 28 layer Fpcb, rigid-flex pcb from 1 ~ 12 layer Metal substrates pcb (al / cu based pcb) High tg , halogen free, heavy copper pcb High frequency, mixed delectric pcb (teflon material) Hdi pcb, blind and buried via board, impedance control pcbs

Supplier: MCPCB, FR4 PCB, normal ALU PCB, mirror face ALU PCB, CU-PCB, AL-PCB

1.Number of Layers:1-20Layers 2.Finished Boards Thickness:0.2mm-6.0mm 3.Max. Panel size:600mm X 1200mm 4.Available Laminates Material:FR1, FR2, CEM1, CME3, FR-4, High TG FR-4, PTFE, Aluminum Base, Rogers, Tachnic, Halogen Free, high-frequency, Leadfree and so on. 5.Min Line Width/Spacing:3mil/3mil(0.075mm/0.075mm) 6.Out Layer Copper Thickness:35um--420um Inner Layer Copper Thickness:17um--210um 7.Special technology,Blind hole PCB, Buried via PCB, Impedance control PCB, Heavy Cu PCB (12oz). PCB material we can use: FR1, FR2, HB, CEM1, CEM3, FR4, High TG/CTI FR4, Halogen Free, Rogers, Aluminium based, Leadfree compatible, Hi Frequency. Max. Panel size:600mm X 1200mm

Characteristic Capability Production Capacity 800,000 sq.ft/Month Layer(mass production) 1 to 24 Layers Max Panel Size 450*660mm Base Copper Thickness 1/3 OZ --5 OZ Impedance Control +/-8% Board ThicknessImpedance Control Min:6mil(0.15mm) Max:280mil(7mm) Blind/Buried hole YES Drilling (Minimum size) Mechanical drilling 8mil(0.2mm) Laser drilling 4mil(0.1mm) Inner Etching Minimum line/Space(A/W) 2.5mil(0.0625mm) Line Width Tolerance +/-8% Board Thickness(min) 2.5mil(0.625mm) Plating Hole Minimum Hole Size 6mil (0.15mm) Aspect Ratio (max) 12:01 Position Accuracy +/-1.8mil(0.045mm) Microvia Minimum Hole Size 3mil(0.075mm) Aspect Ratio (max) 1:01 Outer Etching Minimum Width /Space 2.5mil(0.05mm) Line Width Tolerance +/-0.4mil(0.01mm) Solder Mask Bridge 3.0mil(0.075mm) Position Accuracy 1.5mil(0.0375mm) Selective Gold Plating Gold Thickness 100u ís (2.5um) Press Thickness Tolerance 8% Wrap/Twist 0.70% Inner Opening (min) (1) 4/L:5mil(0.125mm) (2) 6/L-8/L:6mil(0.15mm) (3) 8/L or above:8mil(0.2mm) Lead Time sample S/D L:3days;4-8L:5-15days mass productioníí S/D L:5days;4-8L:10-25days Base Material Special Technology Surface Finish CEM-1/CEM-3/FR-4 FR4(Halogen free) High-speed & high-frequency material High Tg/CTI material Al-base PTFE,Rogers,Getek,BT,Polyimide blind hole PCB buried resistor PCB laser-drill HDI PCB mix-material PCB Plating edge PCB buried via PCB impedance control PCB heavy Cu PCB (5oz) Counter-Sink PCB ; HASL &Lead Free HASL Chem. Ni/Au Chem. Tin Ni/Au plating Flash Gold Gold finger OSP &F2 Chem. Silver