Enterprise's development, the key depends on the human, the company implements throughout ¡°humanist¡± the policy. One, established set of quantities only then to hire, decided the reward according to the duty, according to ability, contribution reward fair, fair personnel management mechanism and wages assignment pattern, has broken the region, the status boundary and the dear ones fetter, stimulated all staff the host consciousness which was own enterprise fights bravely; Two is the self-raise higher management and the engineers and technicians; Three, takes staff's training, organizes the staff to study underthe new form regularly the electronic technology development request. The product quality is company's life, in order to enable the company the product to adapt the electronic technology rapid development high quality request, the company has also established the perfect staff post responsibility and the work direction, formed a set to have the modern characteristic, the science document management system. Date delivery ability reaches 100 varieties, the month variety reaches, 4000 kinds, the area amounts to 10000 square meters. Manufacture experience rich staff for customer body custom make model. The double kneading board fast processing may complete in 24 hours, may amount to for 48-72 hour 4 to 8 plywood processing cycle, supports the customer project research and development advancement stably, the occupation city machine. Also may which provides according to the customer copies the board according to the customer PCB schematic diagram design wiring or the model.The design wiring or the model.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc). 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK. HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free & Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm. HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK .
LEAD Free HASL1 Layer / Single Side, Rigid PCB/PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with lower price than double side PCB. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA: 1) Base material: FR-1(94v0), FR-4, CEM-1, 2) Max Board size: 600*600mm 3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm 4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz 5) Special tech: BGA, PTH, Blind and buried vias 6) Profile: V-scoring, V-cutting, punching, etching, milling, routing 7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating) 8) With best price to USA, South American, India, South Africa and Europe 9) Main market: USA, EGYPT, Europe, South American, mid-east 10) Compliant: UL, ROHS, ISO9001-2000 11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II 12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical quipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night. 13) Small quantity and prototypes acceptable. 14) Lead time: 5-7days for prototypes, 9-13days for mass production. 15) Available Service: OEM, 24hrs service for fast prototype. 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & H.
OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with competitive price. Specifications of OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA: Layer 2 Finished Board Thickness 1.6mm Material FR-4 Min. Drilled Hole Size 3 mil(0.075mm) Min. Line Width 3 mil(0.075mm) Min. Line Spacing 3 mil(0.075mm) Surface Finish Plating/Immersion Gold Copper Thickness 10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ Solder Mask Color Blue/Red/Green Copper Thickness in Hole >25.0um (>1mil) Inner Packing Vacuum Packing/Plastic Bag Outer Packing Standard Carton Packing Shape Tolerance +/-0.13 Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05 Certificate UL/ISO 9001, ISO14000, SGS, ROHS Special Requirements Buried and blind vias + controlled impedance BGA Profiling Routing, V-CUT, Beveling 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & HK.
1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton.
Printed circuit board.
Double Sided Multilayer Min Pref Min Pref Min Track Width 0.005 0.008 0.005 0.008 Track To Track Spacing 0.005 0.008 0.005 0.008 Min Drill Size 0.008 0.020 0.008 0.020 Min Annular Ring 0.006 0.010 0.010 0.012 Bare Board Test(flying Probe) 0.006 0.006 Router Tolerance 0.010 0.010.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1/1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
FR-4 1oz 2-layer. Vacuum package.
Layer count: 4L Base material: FR4 Board Thickness: 1.6mm Min Hole: 0.2mm Line width/Line Spacing: 0.1MM/0.1MM Surface Finish: Immersion Gold + Gold Finger.
Layers(2-38) Lines and Spaces (Volume 3/3 Prototype 2.5/2.5) Controlled Impedance(+/-10% Stamdard) Blind and Buried Vias Microvias,Laser Drill Backpanels(up to 1 inch thick) MCM/Substrates High performance and Emerging Materials Sequential Lamination Micro BGA,BGA Plug Finishing:HAL,Entek(OSP),Gold Finger,Flash Gold,Immersion Gold,Immersion Tin,Immersion Silver. Special PCBs Heavy Copper PCBs.
We provide you excellent service with high quality guarantee based on our professional COB production technology and experience. Production Eauipment:AB 510 AB 520A AB 530 AB559A DS500 Full-automatic Epoxy Coating Mac Production Experience:Aluminum wire and golden wire bonding manufacturing the PCBA of car display.Fully automatic epoxy coating,multi IC Bonding,The max quality of wire lines is 318 for each IC.
