Detailed Product Description 1)PCB 2)Printed circuit board 3)High quality,ROHS 4)HAL lead free board. Base material:FR-4,FR-1.CEM1.CEM3,Aluminum Core board Surface processing type:HASL/ plating gold /immersion gold/ Ni/Au plating gold finger/OSP processing/immersion Tin (Sn) Layers:single-sided,double-sided ,Multilayer board Min trace width/space:4mil/4mil Min drill diameter:0.2mm Max board size:560mmX720mm Molding board thickness:0.6-3.00mm Solder mask type:Green/yellow/black/red/white/blue or transparent photosensitive solder mask and peel off blue glue. Silk legend color:White/ yellow /black Electricity performance testing:100% electrical performance testing,high pressure testing Various types base material to PCB processing:High TG board, high frequency board(ROGERS,TEFLON) halogen-free board (FR-4,CEM-1,CEM-3)
Lead free HASL PCB 1. Lead free HASL 2. Certificate: UL, ROHS, T/S16949 3. Company management: ISO9001:2000 4. Markets: Euro,America, Asia Detailed Product Description 1)Aluminum board (Al type:5052 or 6061) 2)Surface finish: OSP 3)Finish thickness:0.8-3.2mm 4)Thermal Conductivity(Dielectric layer):1.8 to 3.0W/m-k We offer as following Layer:1-22 Layers rigid PCB Base Material:FR-1, FR-2, CEM-1, CEM-3, FR-4, Aluminium base(MCPCB) Board Thickness:0.2/0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.5/3.2/6.0 mm Copper Thickness:0.5/1/2/3 OZ Supplier:Nanya/KB/Shengyi Surface Finish:HAL, HAL lead free, OSP(Entek), Immersio Nickel Gold, Immersio Tin/Silver, Flash gold over nickel, Carbon Ink, Abailable Peelable Mask available Solder mask:Liquid Photo Imageable Soldermask(LPI) Color:Green/Blue/Red/Yellow/Black/white.
2 layer With surface finish for gold 1.6mm board thickness.
PCBA design, layout, fabrication, assembly and function test Suitable for standby power protection Functions: overcharge, over-discharge and overflow protections Used in mobile, MP3/MP4, digital camera, notebook PC, electric motorcycle, electric tool and all kinds of miner's lamp Oem and odm services are also welcome.
Surface finish : lead free hasl, immersion gold, gold plating osp immersion pin Min line width: 3mil Min line space: 3mil Min space between pad to pad :3 mil Min hold diameter 0.1um Max size of finish board: 23inch*35inch Max proportion drilling hold and bord thickness: 1:12.5 Rang of finish board thickness: 0.21~0.7mil Min tickness soldermask :10um Min line width of idents: 4mil Min height of idents: 25mil Color of silk screen: yellow white blue Soldermask: green yellow blue red balck white transparent photesensitive soldermask strippable soldermask Date file foemat: gerber file, drilling file, protel series , pads2000series, powerpcb series odb++ E test: 100% e test, high voltage test Material pcb: fr4 high tg fr4 halogen free, rogers, cem-1 , arlon taconic, ptfe, isola.
Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-20 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold finger/OSP Profile Routing/Punching Min. hole 0.2mm ( 8 mil ) Min.line width 0.1mm ( 4 mil ) Min.line spacing 0.1mm ( 4 mil ) Solder mask color Green/Blue/Red/Black/Matt Green/Yellow/White¡¡ Silkscreen color White/Black/Gray/Red/Yellow¡¡ Certificate UL-796 Certified (E334023) ISO 9001: 2008 ISO14001:2004 Leadtime sample:Double-layer:1-3 days; Multi-layer:2-5 days mass: Double-layer:3-7 days; Multi-layer:7-9 days. Coton Box.
Layer: Single-Layer PCB Material: 94V0,CEM1,FR4,HIGH TG£¨170-200¡æ£©,PTFE(F4B,F4BK), Rogers(4003,4350£©Ceramic,Aluminium,alumina Surface Finish: Hal,HAL LEAD Free,OSP,Immersion Gold/Tin/Silver. Deliver Time:Single-Layer PCB 1-3 working days.
Decription about printed circuit board, 1.Product: printed circuit board 2.material: FR4 3.Layer:4 layer 4.solder mask: Green 6.Surface finish: HSAL Lead Free 7.Min. hole size: 0.2mm 8.Min. line width/space: 3 mil/3mil. Other information. 1.MOQ:1pcs 2.Certificate:ISO,UL,RoHS 3.100% E-testing. Reference our production capability for kartain pcb: 1) Layer:1-30layer 2) PCB board finished thickness:0.1mm-7.0mm 3) Material:FR-4,High TG,FR-4 Halogen Free,Rogers,Teflon 4) Min. Drilled hole size:3mil(0.075mm) 5) Min.Line width:3mil(0.075mm) 6) Min.Line spacing:3mil(0.075mm) 7) Surface finish:HASL/HASL lead free,HAL, Chemical tin,Chemical Gold,Immersion Silver/Gold,OSP,Gold plating 8) Copper thickness:0.5-7.0OZ 9) Solder mask color:green,yellow,black,white,red,blue 10)Inner packing:Vacuum packing/Plastic bag Outer packing:Standard carton packing 11)Shape tolerance:+-0.13 Hole tolerance:PTH +-0.075, NPTH +-0.05 12)Certificate:UL,ISO 9000,SGS,RoHS 13)Special requirements:Buried and blind vias + controlled impedance + BGA 14)Profiling:Punching,Routing,V-cut,Beveling 15)Provides OEM services to all sorts of printed circuit board(PCB) assembly as well as electronic encased products. Package: Inner package: Vaccum packing , plastic bag Outer package: standard carton packing.
Line Width/Space: 4/4mil Min Hole Size: 0.3mm Solder Mask: Red Vias: BGA filled with ink Impedance Control: Single 50ohm,differential 100ohm
1. Base Materials: Polyimide, Copper 2. Layer count: Single layer 3. Copper: Copper: 1.0 oz, ED 4. Coverlayer: Polyimide, 1 mil 5. Thickness: 0.1381 mm 6. Line Width/Space: 3.9mil/3.93mil 7. Surface Finishing: Immersion Gold 8. Smallest Hole Diameter: 0.40mm . Vacuum packing.
Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers. Carton.
Material: FR-4 1.6mm 1/1oz Surface finish: HASL Characteristic: 8 counter holes to be counter sink from bottom side; Routing in the center of the board: thickness1.0mm
Double sided rogers 4003 material 0.508mm board thickness 0.5OZ copper thickness Green soldermask Immersion gold finish seal packing
Single sided FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend LF HASL finish Seal packing
Double sided FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend LF HASL finish Seal packing
4 layers PCB FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend Immersion gold finish Seal packing
Single sided Aluminum (IMS) material 1.0mm board thickness 1OZ copper thickness White soldermask Black legend LF HASL finish Seal packing
Base material:Aluminum Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: IPI solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers. Carton.
Base material: ceramics, aluminum, rogers, high tg, f4b, f4bk, f4bt, tp, pf, fr4, fr1, fr2, cem-1, cem-3, etc. Board thickness: 0.30 to 3.20mm (12 to 26mil) Copper thickness: 0.50 to 5 ounce Solder mask: lpi solder mask, conventional solder mask, peelable solder mask, uv solder mask Minimum line width: 0.1mm (4mil) Minimum line space: 0.1mm (4mil) Minimum hole diameter: 0.25mm (10mil) Pth hole diameter tolerance: +/-0.076mm (+/-3mil) Npth hole diameter tolerance: +/-0.03mm (+/-1.2mil) Maximum board size: 460 x 620mm (18 x 24) Board finishing type: hot air leveling, soft gold, hard gold, immersion gold, gold fingers. Carton packing.
Printed Circuit Board (PCB) from 2to 30 layers. We can supply board of rigid, flexble, rigid-flexble, blind/burried via and HDI in very fast delivery and competitive prices. Any prototype, small volume and mass production order are welcomed.
