Base Material FR4/CEM/Aluminum/Non-halogen Layer Count 1-20 layer Thickness of Board 0.2-3.0mm Thickness of Base Copper 17um-105um Finishing HAL(LF)/Immersion gold/Plating gold/Gold finger/OSP Profile Routing/Punching Min. hole 0.2mm ( 8 mil ) Min.line width 0.1mm ( 4 mil ) Min.line spacing 0.1mm ( 4 mil ) Solder mask color Green/Blue/Red/Black/Matt Green/Yellow/White¡­¡­ Silkscreen color White/Black/Gray/Red/Yellow¡­¡­ Certificate UL-796 Certified (E334023) ISO 9001: 2008 ISO14001:2004 Leadtime sample:Double-layer:1-3 days; Multi-layer:2-5 days mass: Double-layer:3-7 days; Multi-layer:7-9 days. Coton Box.