PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
PCBA capability and services: SMT (Surface mounting technology), THT. 1. Material Sourcing Service 2. SMT assembly and Through hole components insertion 3. IC pre-programming / Burning on-line 4. Function testing as requested 5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc) 6. Packing design. Export carton.
HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK. HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free & Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm. HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK .
LEAD Free HASL1 Layer / Single Side, Rigid PCB/PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with lower price than double side PCB. Specifications of LEAD Free HASL 1 Layer / Single Side Rigid PCB/PCBA: 1) Base material: FR-1(94v0), FR-4, CEM-1, 2) Max Board size: 600*600mm 3) Board thickness: 0.2mm/0.6mm/0.8mm/1.2mm/1.6mm/3.2mm 4) Copper thickness: 0.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz 5) Special tech: BGA, PTH, Blind and buried vias 6) Profile: V-scoring, V-cutting, punching, etching, milling, routing 7) Surface treatment: HASL, OS, Immersion gold, gold plated (coating) 8) With best price to USA, South American, India, South Africa and Europe 9) Main market: USA, EGYPT, Europe, South American, mid-east 10) Compliant: UL, ROHS, ISO9001-2000 11) Standard: IPC-A-600F, IPC-D-300G, MIL-STD-105D LEVEL II 12) Application: Home appliances, electronics, digital camera, LCD TV sets, medical quipments, telecommunication, LED lightings, street light, mobile phone, computer, laptop test equipment and power meter, electrical weighing scale, night. 13) Small quantity and prototypes acceptable. 14) Lead time: 5-7days for prototypes, 9-13days for mass production. 15) Available Service: OEM, 24hrs service for fast prototype. 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & H.
OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with competitive price. Specifications of OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA: Layer 2 Finished Board Thickness 1.6mm Material FR-4 Min. Drilled Hole Size 3 mil(0.075mm) Min. Line Width 3 mil(0.075mm) Min. Line Spacing 3 mil(0.075mm) Surface Finish Plating/Immersion Gold Copper Thickness 10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ Solder Mask Color Blue/Red/Green Copper Thickness in Hole >25.0um (>1mil) Inner Packing Vacuum Packing/Plastic Bag Outer Packing Standard Carton Packing Shape Tolerance +/-0.13 Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05 Certificate UL/ISO 9001, ISO14000, SGS, ROHS Special Requirements Buried and blind vias + controlled impedance BGA Profiling Routing, V-CUT, Beveling 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & HK.
1) Layer: from 1 to 20 2) Board finished thickness: 0.5-6.0mm 3) Material: FR-4,CEM-1, CEM-3, High TG, FR4 Halogen Free, etc 4) Surface finish/treatment: HASL/HASL lead free, HAL, Chemical Gold/tin, Immersion Silver/Gold/Tin, OSP, Gold plating, Hard &Soft gold, Plating tin. 5) Product range: Flex-PCB, Rigid-PCB, Flex-rigid PCB,HDI PCB ,PCB of single, Double and Multi-layers, High frequency PCB ,etc 6) Max. finished board size: Single & Double Layer:450mm*650mm Multilayer:450*500mm 7) Min. drilled hole size: 3mil(0.075mm) 8) Min. line width: 3mil(0.075mm) 9) Min. line spacing: 3mil(0.075mm) 10) Solder mask color : Green/yellow/black/white/red/blue 11) Copper thickness in hole: >20.0um (1mil) 12) Shape tolerance: plus or minus 0.13 13) Hole tolerance: PTH: plus or minus 0.076; NPTH: plus or minus 0.05 14) Certificate: UL,ISO9001,ISO14001,SGS,RoHS compliance 15) Special req. Buried and blind vias +controlled impedence +BGA 16) Profiling : Punching ,Routing ,V-CUT, Beveling. Inner: Vacuum packing/Plastic bag Outer: Standard carton.
Printed circuit board.
Double Sided Multilayer Min Pref Min Pref Min Track Width 0.005 0.008 0.005 0.008 Track To Track Spacing 0.005 0.008 0.005 0.008 Min Drill Size 0.008 0.020 0.008 0.020 Min Annular Ring 0.006 0.010 0.010 0.012 Bare Board Test(flying Probe) 0.006 0.006 Router Tolerance 0.010 0.010.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1/1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 8mils/8mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.
FR-4 1oz 2-layer. Vacuum package.
Layer count: 4L Base material: FR4 Board Thickness: 1.6mm Min Hole: 0.2mm Line width/Line Spacing: 0.1MM/0.1MM Surface Finish: Immersion Gold + Gold Finger.
Layers(2-38) Lines and Spaces (Volume 3/3 Prototype 2.5/2.5) Controlled Impedance(+/-10% Stamdard) Blind and Buried Vias Microvias,Laser Drill Backpanels(up to 1 inch thick) MCM/Substrates High performance and Emerging Materials Sequential Lamination Micro BGA,BGA Plug Finishing:HAL,Entek(OSP),Gold Finger,Flash Gold,Immersion Gold,Immersion Tin,Immersion Silver. Special PCBs Heavy Copper PCBs.
We provide you excellent service with high quality guarantee based on our professional COB production technology and experience. Production Eauipment:AB 510 AB 520A AB 530 AB559A DS500 Full-automatic Epoxy Coating Mac Production Experience:Aluminum wire and golden wire bonding manufacturing the PCBA of car display.Fully automatic epoxy coating,multi IC Bonding,The max quality of wire lines is 318 for each IC.
ALPCB MCPCB for LED lighting Copper base PCB Thermal PCB Materials Aluminium (AL) copper base(CUPCB) Thickness: 0.2-6.0mm Copper weight:0.5-2.0mil Min.line width: 0.2mm Min.line space:0.2mm Min.hole diameter:0.3mm Max.board size:600*1200mm Treatment : Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP , Gold palting etc. Solder Mask : Green, Red, White, Yellow, Black, Blue, or NO soldering mask; * We can provide quickturn prototype and small quantity PCBs with short lead time. * The quality of Our products is excellent and stable. * We choose the best material for all our products. * We will send the boards to you by DHL, TNT, UPS, FEDEX and so on to saving the transport time. Vacuum packing.
Rigid PCB such as single side PCB,CEM1 PCB,double side PCB,FR4 PCB,multi-layer PCB up to 32 layers,PTFE PCB,Teflon PCB,high frequency board PCB,ceramic PCB,rogers PCB,high TG PCB,aluminium PCB,microwave PCB etc,the biggest size is 600mm*1200mm ,the tolerance of hole is 0.05mm and 0.075mm for min line width and space.
