AMAOE OFix A universal PCB holder fixture for mobile phone motherboard soldering repair. Amaoe OFix-A multifunctional repair fixture for motherboard CPU IC glue removal soldering repair. Feature: 1. New design with hidden screw, separate base. 2. Add practical functions, add glue removal modules, backle inner groove design. 3. The base is separated, the upgrade space is reserved, and the new model will be released later to reduce the cost of purchasing the base. 4. Hidden screw, prevent residue from falling into the screw more durable and batter to use. 5. Add glue removal module to meet most chip glue removal, convenient, practical and fast. 6. Shallow inner slot buckle design, the cart board will not pop out, and then capacitor resistance will not be stuck. 7. Diversified buckle design.
We can manufacture vaccum fried snacks of fruit and vegetables. And also organic coconut chips manufactured right here in New Zealand.
Upgraded version MJ K22 Pro motherboard holder fixture for mobile phone soldering repair. MiJing K22 Universal PCB Board Holder Fixture for mobile phone fixing soldering repair. Cell Phone Circuit Board Soldering Fixture welding repair tool. Features : Mobile phone Motherboard Repair Universal maintenance fixture holder, rotary fixed design, no rebound, fixed firmly! The design has three adjustable distances. Prevent clamps from moving during use, special anti-skid pad, in order to allow heating. Let the hot air can be discharged more efficiency. Add heat sink to button of clamp. Rotary shaft locks the motherboard or IC more efficiency, Fixed well without rebound. PCB Fixture also support IC type fixtures fixed for removal of back glue, the clamp is designed to bear the force of IC beam, which can hold up the empty parts of IC well and avoid the IC breaking when removing black glue. The PCB fixture can be adjusted at difference distance from the high, middle and low levels. It's necessary to loosen the two screw as the bottom, move the fixing plate to the appropriate gear position, and then tighten the bottom screws to lock it.
Arco spares XDL PCB with control for cooker hood. Our popular product export to worldwild use in chimney. If you are interested in this product,pls be free to contact with us.
There are three kinds of forming methods of ceramic substrate: pressing film, dry pressing and casting forming. The casting process has the highest forming production efficiency, and it is easy to realize continuous production and automation. It can improve product quality, reduce costs and realize mass production. The thickness of the production substrate can be as thin as 10m or less than 1mm. Casting forming is an important step in the practical transformation of aluminum nitride ceramic circuit board, and has an important application prospect.
Spring Probe Pin PQL100 for PCB Assembly Test In-circuit test probes are mainly used for testing electrical performance of in-circuit components on PCB and the connection between circuit networks. It could quantitatively measure components such as resistors, capacitors, inductors, crystal oscillators, and perform functional tests of diodes, triodes, optocouplers, transformers, relays, operational amplifiers, power supply modules and integrated circuits. We will introduce in-circuit test probe PQL100 series here. Its diameter is 1.36 mm and the total length is 33.2 mm. Various tip styles, for example, H, S, T, E, C, U, G, etc., are available for test probes. For details, please check below parameters. Technical Specifications Recommended Current Rating: 3 Amps, continuous Contact Resistance: 50 milliohms Full Stroke: 6.65 mm Rated Stroke: 4.4 mm Spring Force: 140 gf (5 oz) at load 4.4 mm Materials Contact Barrel: Brass, Au on Ni Plated Spring: SWP-A/B, Au on Ni Plated Plunger: SK4, Au on Ni Plated manufacture, sales and technical service, Centalic is one of the earliest high-tech enterprises which concentrates on large-scale production of various test probes and precision metal parts, and has a professional manufacturing base owning complete production lines and test equipment. Our products include semiconductor test probes, in-circuit test probes, radio frequency probes, harness probes, battery contact probes, switching probes, big-current probes, spring probes, universal complex test probes, wafer probes, and so on. They are widely applied to the tests of various electronic products, such as in-circuit tests of semiconductor components, chips, PCB and other electronic peripherals. Our company owns professional R&D, production, sales teams under the working principle of 'quality, punctuality, confidentiality' to totally efficiently develop test probes in accordance with the requirements of customers' test projects and meet the needs of customers for mass production as well as developing markets. With many years' continuous endeavour of our staff, Centalic has built a solid foundation in this industry and our products have been sold all over the world. Welcome to browse our website and download any catalogs of our products. If you need a complete set of product manual, please feel free to contact us. Many products are not uploaded due to a huge range. If you can't find what you need, please feel free to contact us. Notice: Stock: standard product. As usual, they are in stock. Express: DHL, FedEx, UPS, etc. Payment: T/T, PayPal
Single-ended Probe Pogo Pin P125 Series for PCBA Test In-circuit test probes are mainly used for testing electrical performance of in-circuit components on PCB and the connection between circuit networks. It could quantitatively measure components such as resistors, capacitors, inductors, crystal oscillators, and perform functional tests of diodes, triodes, optocouplers, transformers, relays, operational amplifiers, power supply modules and integrated circuits. We will introduce in-circuit test probe P125 series here. Its test center is 125 mil. The diameter is 2.02 mm� and the total length is� 33.28 mm. Various tip styles, for example, A, B, U, H, K, L, BK, etc., are available for test probes. There are roughly four types of receptacles, namely CR, SC, WW and WW-L, to fit each test probe. For details,� please check below parameters. Technical Specifications Recommended Minimum Center: 3.18 mm (125 mil) Current Rating: 3 Amps, continuous Contact Resistance: 30 milliohms Mounting Hole Size: 2.4 mm Full Stroke: 6.35 mm Rated Stroke: 4.32 mm Spring Force: 113/198/255/285 gf (4/7/9/10 oz) Materials Receptacle: Phosphor Bronze, Gold Plated Contact Barrel: Phosphor Bronze, Gold Plated Spring: Music Wire, Gold Plated Plunger: Beryllium Copper, Nickel Plated or Gold Plated Company Information Centalic Technology Development Ltd. was founded in 1980. Specializing in R&D, manufacture, sales and technical service, Centalic is one of the earliest high-tech enterprises which concentrates on large-scale production of various test probes and precision metal parts, and has a professional manufacturing base owning complete production lines and test equipment. Our products include semiconductor test probes, in-circuit test probes, radio frequency probes, harness probes, battery contact probes, switching probes, big-current probes, spring probes, universal complex test probes, wafer probes, and so on. They are widely applied to the tests of various electronic products, such as in-circuit tests of semiconductor components, chips, PCB and other electronic peripherals. Our company owns professional R&D, production, sales teams under the working principle of 'quality, punctuality, confidentiality' to totally efficiently develop test probes in accordance with the requirements of customers' test projects and meet the needs of customers for mass production as well as developing markets. With many years' continuous endeavour of our staff, Centalic has built a solid foundation in this industry and our products have been sold all over the world. Welcome to browse our website and download any catalogs of our products. If you need a complete set of product manual, please feel free to contact us. Many products are not uploaded due to a huge range. If you can't find what you need, please feel free to contact us. Notice: Stock: standard product. As usual, they are in stock. Express: DHL, FedEx, UPS, etc. Payment: T/T, PayPal
multi game and single game pcb book of ra best price . high quality.
We are taking care of printed circuit board manufacturing
fpc/rigid-flex pcb factory
12 Layers PCB Board12 Layers PCB Board12 Layers PCB Board 1 to 36 layers manufacture NO MOQ/ NO Tooling fee Quickest lead time 24 hours IPC Class 2/3 acceptance UL,ISO14001 and ISO 9001 certified SMT/DIP/PTH/BGA/Box Build assembly 12 Layers PCB Board Place of Origin: Guangdong, China (Mainland) Brand Name: Shanxun Model Number: PCB RoHS Compliant Number of Layers: 1-30 layer Base Material: FR4, High Tg FR4, Halogen Free, SYL, Rogers, Aluminium Copper Thickness: 1/3oz ~ 6oz Board Thickness: 0.2mm ~ 7.0mm Min. Line Width/space: 3mil/3mil Min. Hole Size: 0.2MM Surface Finishing: Immersion Gold/Au, HASL,LF HASL, OSP, Immersion silver, etc. Impedance control: ±10% Solder mask:green/black/white/red/blue/yellow,etc Silkscreen: White, Black, Yellow, Blue Hole tolerance: PTH:±0.075,NTPH:±0.05 PCB Standard: IPC-A-610 E Class II-III profiling punching: Routing, V-CUT, Beveling Wrap and twist: 5%
VEICHI provides OEM/ODM Service for TOP Customers. S200K construction elevator integrated special machine is a special model specially developed for the series of construction elevators without a cab. It integrates console, frequency conversion control unit, logic control unit, lifting weight limiter, etc. The products are multi-functional, beautiful in appearance, and reasonable in structure, suitable for export. Product Advantages 1. Run steadily with low frequency and large torque S200K adopts the latest speed sensorless magnetic flow vector control technique that has a very quick dynamic response. The advanced current limiting technology ensures steady running during starting, rising, and dropping process without trip when the load fluctuates frequently. 2. Adopts special logic brake sequential control It adopts special logical break sequential control technology that brake will be set to open status only when starting frequency and starting current have arrived at the same time. It effectively ensures the security and reliability of the construction elevator system. 3. Professional brake circuit design The holding brake circuit design is secure and reliable. Two logical break signals control 2-line brake contactors respectively. When contactor adhesion or other mechanical failure happens, it still ensures the high security of the system. Applications Construction lifts
Board Thickness 0.07-0.40mm Base Material 0.5mil - 2mil Polyimide Copper Thickness 0.5OZ-2OZ Stiffener PI: 0.10-0.25UM, Fr4: 0.1-1.20MM, PET: 0.10-0.18MM, Metal:0.10-0.30MM Min. Line Width/ Spacing 3mil (0.08mm)/3mil (0.08mm) Coverlay Yellow, White, Balck Silkscreen Color White, Black Surface Finishing ENIG, Flash Gold, Immersion Tin, OSP Min.Quantity of Order No MOQ Layer Count 1-8 Layer
uick Details: 2W/m.k, Aluminum Core, 1L+Al+1L Base Material Aluminum Core Thermal conductivity 2W/m.k Layer Counts 1L+Al+1L Board Thickness 2.0 mm Copper Thickness 1OZ Min. Hole Size 12mil (0.3mm) Min. Line Width/ Spacing 4mil (0.1mm)/5mil (0.125mm) Solder mask Color White Silkscreen Color Black Surface Finishing Lead Free HASL Min.Quantity of Order No MOQ Certificate UL, ISO 9001, ISO 14001 Difficulty Aluminum Core
We have available following Ships spareparts for Sale: Product-Electronic tacho system controller unit Type-371-24V.dc. Maker-Soren T.Lyngso Country of origin-Denmark
Model No.: LTCC3535,LTCC5050,3535,3028, Made in Taiwan, ROC Key Features Ceramic metallized: Ti/W,gold(Au), sliver(Ag),Copper(Cu),nickel(Ni)¡Kothers & produce final circuit coating:0.075um to 5mil Ceramic Metallized substrate: Al2O3 substrate metallized AlN substrate metallized Silicon wafer metallized LED heat-dissipation ceramic substrate: LED Al2O3 thin film substrate LED Al2O3 thick film substrate LED AlN thin film heat-dissipation substrate Flip chip substrate: The integration of the thin film,thick film,electrode plating and electroless plating processes: Application: 1. High Power LED ceramic substrate 2. Microwave (Wireless Communication & Radar) 3. Semiconductor Process Equipment 4. Solar Cell 5. Hybrid Electric Vehicles 6.Flip chip/eutectic substrate 7.Sensor ceramic substrate
Adopt f4bme high frequency material, osp, hasl, lf-hasl, enig, etc. Used in satellite, antenna, radar, etc.
For a long time, AL2O3 and Beo ceramics have been used in most high power hybrid of IC circuit board materials, but the thermal conductivity and thermal expansion coefficient of AL2O3 substrates do not match with Si. Although Beo has excellent comprehensive performance, its high production cost and high toxicity limit its application and popularization. Therefore, considering the performance, cost and environmental protection, the two can not meet the development and demand of modern electronic power devices. Aluminum nitride ceramic with excellent comprehensive properties is a new generation of advanced ceramics which has received extensive attention in recent years. It has a wide application prospect in many aspects. Especially, it has the advantages of high thermal conductivity, low dielectric constant, low dielectric loss, excellent electrical insulation, thermal expansion coefficient matching with silicon and non-toxicity, making it an ideal material for high density, high power and high speed integrated circuit boards and packaging substrates.
We are a unique name in the industry as a leading Supplier of Nitride Ceramic PCB in Wuhan, Hubei, China. Substrate type:aluminium nitride ceramics Conducting layer:Cu Surface preparation:immersion gold Metal single-sided / double sided:double sided Copper plated through hole:yes Solder mask:no
Backed by rich industry experiences, we are leading Manufacturer and Supplier of Customized Integrated Circuit Board in Wuhan, Hubei, China. Folysky Technology is dedicated to providing the polishing of advanced materials to surface finishes and supplier quality levels that consistently meet or exceed our customer�¢�?�?s expectations. Advanced level polishing requires that appropriate abrasive and pre-lapping conditions be used to significantly reduce sub-surface damage. Centerline uses both mechanical and CMP (chemical mechanical process) depending on the customers requirements. We are constantly looking for ways to enhance the processes that we have already established, while maintaining careful process controls and qualifications. Industry standard materials polished are 99.6% Alumina, 96% Alumina, AlN, BeO, Sapphire, Fused Silica. Centerline polishes virtually any ferrous or non ferrous material. Centerline Technologies�¢�?�? polishing process controls the surface finish and, combined with our lapping process, assures thickness identity and parallelism, as well as flatness of substrates. Our lapping and polishing processes are custom designed for each type of material and the physical dimensions required
