Find Verified Pcb Suppliers, Manufacturers and Wholesalers

PCB

PCB Solutions
We offer you:
Low to high layer counts:
Single sided to 28 layers
Complex PCB solutions:
Special materials, heavy copper
Aluminum board
FPCB: Flexible PCB (FPC)
Quick turn Prototype,Volume production
Design for manufacturability (DFM)
We never stop building and perfecting
our global support to meet
your growing needs

PCBA Solutions
We offer you :
PCBA, PCB assembly:
SMT & PTH & BGA
PCBA and enclosure design
Components sourcing and purchasing
Quick turn prototype,Volume production
BGA rework/ reback
Plastic injection molding
Metal sheet stamping
Final assembly, OEM ,EMS services
Test: AOI, In-Circuit Test (ICT),
Functional Test (FCT)

PCB Assembly manufacturer. Our PCB production capacity can reach 10000 square meters per month and PCB assembly capacity at 250, 0000 components per month.

2. Kind: lightest load

3. Product color: brown

4. Material: based on chinese steel products: 65mn, 50grva, 60si2mn, 55grsi (may request according to the visitor)


Packing: pe or on request

- PCB design technique for a certain product
- Design skill dealing with Power signals
- Team work in PCB design
- EDA software advanced function & application
- Introduction new layout & Simulation
- IC package design technique
- Design for Cost-down consideration


www.green-partner.com.cn

Reference parameters:
Substrate material: red copper (made in china)
Dimension: 69mm*69mm
Thermal conductivity: 400w/m-k
Solder resist ink: high reflectivity of dainippon white ink
Surface treatment: silver plating (ag thickness¡y12
Forming mode: cnc
Package wattage: 150w


Vacuum package

Reference parameters:
Model number: csx-cu-005
Substrate material: red copper (made in china)
Dimension: 60mm*58mm
Thermal conductivity: 400w/m-k
Solder resist ink: high reflectivity of dainippon white ink
Surface treatment: silver plating (ag thickness¡y120|¨¬¡å)
Forming mode: cnc
Package wattage: 100w


Vacuum package

Reference parameters:
Substrate material: red copper (made in china)
Dimension: 140mm*129mm
Thermal conductivity: 400w/m-k
Solder resist ink: high reflectivity of dainippon white ink
Surface treatment: immersion gold (au thickness
Forming mode: cnc
Package wattage: 100w


Vacuum package

Board name: n-multilayer-pcb-22
Pcb type: mechanical blind buried board
Layers: 22
Board thickness: 5.4mm
Min bga sphere diameter: 0.30mm
Material: fr4(tg130)
Rohs material: yes
Industry: military
Finishing: enig
Acceptance criteria: ipc-6012-ii

Reference parameters:
Substrate material: red copper (made in china)
Dimension: 111mm*60mm
Thermal conductivity: 400w/m-k
Solder resist ink: high reflectivity of dainippon white ink
Surface treatment: osp
Forming mode: cnc
Package wattage: 200w


Vacuum package

Material: fr-4 tg180
Board thickness: 2.0mm
Min line/space: 0.127/0.127mm
Min hole size: 0.25mm
Surface treatment: immersion gold

Material: fr-4+pi
Layer count£º6 layer
Board thickness:1.60mm
Min line/space: outer layers:0.09/0.09mm
Inner layers: 0.075/0.075mm

Material of pcb: rigid pcb and flexible pcb¨¦hdi
Layers: 2-18(layers)
Finished thickness¨ºo0.2-3mm
Pcb surface finish:
Enig, hasl, hasl leadfree, gold plated, golden finger
Pcb soldermask color: green, blue, black, white, yellow, red
Copper thickness: 1oz, 2 oz, 3oz, 4oz
Min. Line width/space: 3/3mil
Min. Hole size: 0.1mm
Max. Pcb dimession: 1200*800mm



1kg

6-layer tg 170; 1.6mm ipc class 2; 1oz copper & enig(2u'')

10-20pcs per bag, with vaccum packing

Layer: 1 to 32 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 OZ to 7.0 OZ
Copper thickness in hole: >25.0 um (>1mil)
Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)

Key specifications/special features: specifications:
Base material: fr4, pcb,
Layer count: 4 layer board
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: immersion gold
Soldermask color: green
Available specifications:
Base materials: fr4, aluminum, fpc and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: hal, enig, osp, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1, 000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)

Key specifications/special features: specifications:
Base material: ptfe, pcb, fr4
Layer count: 4layer board
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: enig
Solder mask color: green
Available specifications:
Base materials: fr4, aluminum, fpc and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: hal, enig, osp, gold finger and tin chemistry
Possible solder mask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1, 000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
Smt pitch: 30¡ã (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (pth): 0.25mm
Hole tolerance (npth): 0.15mm
Sm tolerance (lpi): dimensions

Key specifications/special features: specifications:
Base material: ptfe, pcb, fr4
Layer count: 4layer board
Board thickness: 1.6mm
Copper thickness: 1oz
Surface finishing: enig
Solder mask color: green
Available specifications:
Base materials: fr4, aluminum, fpc and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: hal, enig, osp, gold finger and tin chemistry
Possible solder mask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1, 000mm

Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30¡ã (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): Dimension
Electrically test: supported
RoHS Directive-compliant
Possibility of SMT device mounting: supported


Product-level Certifications:

SGS:12024915-G2
ROHS:SP10-003347-SH
UL:E302512-080423
SGS:12409491-GZ

Specifications:
Applicable pcb (l x w): 50 ¡á 50 to 700 ¡á 460mm
Minimum component: 0201
Minimum qfp pitch: 0.4mm
Minimum ic pitch: 0.30mm.
Minimum bga ball diameter: 0.40mm
Ball pitch: 1.0mm
Maximum bga size: 74x74mm
Service include: pcb layout and bom design or copying, component procurement, smt, dip, enclosure assembly, test, and packing
Mounting capability: 9, 000, 000 chips a day
Dip: 700, 000 pieces a day
We are planning to prepare 2 lines more this year
Applications of our product: smps, pci, mother board, controller, cctv, telecommunication, dvd, mp3, gprs, military, and more
Primary competitive advantages:
Shenzhen has the biggest electronic market
We can procure most of component in the shortest at the lowest price
We have good business relationship with main ic manufacturers, such as ns, ti, on, fairchild, st, microchip, and more
We have our own pcb factory, can offer one stop service for client
Our employees are experienced and stable
High-precision machine and equipment can guarantee quality
X-ray, aoi, visual checking and function test confirm our delivery goods 100% past
No moq
All inquiries will be replied within 2 hours
Competitive price and short lead-time
Rich experience in importing and exporting
Good relationship with all kinds of forwarder