Formica (high pressure laminate hpl), aqueous formaldehyde solution (f 37/40), conc sulfuric acid (h2so4 98%), melamine formaldehyde powder resin gh and la, melamine moulding compound, urea moulding compound, phenolic moulding compounds, sulphonated naphthalene formaldehyde powder, urea formaldehyde concentrate (uf 80) / (uf85), urea formaldehyde powder resin 400 and 500 and e1 and mix, melamine urea formaldehyde powder resin muf..
Formaldehyde, moulding compounds (urea and melamine), form urea, dry and liquid glues, urea formaldehyde powder resin, glaze, muf, phenolic resins, formica, lpl, snf, and sulfuric acid.manufacturer
