Supplier: Formica (high pressure laminate hpl), aqueous formaldehyde solution (f 37/40), conc sulfuric acid (h2so4 98%), melamine formaldehyde powder resin gh and la, melamine moulding compound, urea moulding compound, phenolic moulding compounds, sulphonated naphthalene formaldehyde powder, urea formaldehyde concentrate (uf 80) / (uf85), urea formaldehyde powder resin 400 and 500 and e1 and mix, melamine urea formaldehyde powder resin muf.
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