CuCo1Ni1Be/CW103C Cobalt Nickel Beryllium Copper Chemical Composition: Be: 0.40-0.70% Co: 0.80-1.30% Ni: 0.80-1.30% Cu: Balance Note: Copper plus additions equal 99.5% minimum. Shapes : Round bars, Round wires, Round tube, Flat bars, Square bars, Rectangular bars, Hexagon bars, Plates, Sheets, Coils Custom shapes are available upon request. Available Sizes: Rod: Dia.5~16mm; Wire: Dia.0.1-5.0mm Tube: OD10~60mm, ThK 0.1~10mm Plate: thk min 0.5mm Custom Diameter & Sizes, Random Mill lengths Typical Physical Properties: Density (g/cm3): 8.83 Density before age hardening (g/cm3): 8.75 Elastic Modulus (kg/mm2 (103)): 14.10 Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): 17 x 10-6 Thermal Conductivity: 209 W/m � oK at 20 C Melting Range (°C): 1000-1070 Note: 1). the units are based upon Metric. 2). the typical physical properties apply to age hardened products. Related Standard : Rods/Bars/Tubes: ASTM B441, SAE J461,463; RWMA Class 3 Sheets: ASTM B534 Wires: ASTM B441 Plates: ASTM B534, SAE J461,463; RWMA Class 3 European Standards: CuCo1Ni1Be, CW103C to EN Other material are also available C17200/CuBe2/CW101C/DIN 2.1247 C17300/CuBe2Pb/CW102C/DIN 2.1248 C17500/CuCo2Be/CW104C/DIN 2.1285 C17510/CuNi2Be/CW110C/DIN 2.0850 CuCo1Ni1Be/CW103C
Copper-powder fractions 69.1% cu63 & 30.9% of cu65 with purity 99.99%.
C18150 Chromium Zirconium Copper bar as per RWMA Class 2
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) One-side shiny
Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm Performance: ClassificationUnit9µm12µm18µm35µm70µm105µm Cu content%=99.8 Area weigthG/m280±3107±3153±5283±7585±10875±15 Tensile strengthR.T.(23?)Kg/mm2=28 H.T.(180?)=15=18=20 ElongationR.T.(23?)%=5.0=6.0=10 H.T.(180?)=6.0=8.0 RoughnessShiny(ra)µm=0.43 Matte(rz)=3.5 Peel strengthR.T.(23?)Kg/cm=0.77=0.8=0.9=1.0=1.5=2.0 Degraded rate of hcl(18%-1hr/25?)%=7.0 Change of color(e-1.0hr/200?)%Good Solder floating 290?Sec.=20 Appearance(spot and copper powder)----None PinholeEaZero Size toleranceWidthMm0~2mm LengthMm---- CoreMm/inchInside diameter 79mm/3 inch
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. NameGbAlloy no.Size (mm) (iso)(asmt)(jis)(bis)(din) Copper foilT2Cu-etpC11000C1100C101R-cu57Thickness: 0.009-0.15 /max width: 640 ItemUnitThickness 9um12um18um35um70um90um PurityCu%=99.97 Surface roughnessRaUm=0.17 Tensile strengthRm(hard)N/mm2420-440450-470460-480430-450410-430 Rm(soft)N/mm2160-180180-220200-230210-240220-250 ElongationA50(hard)%0.8-1.20.8-1.31.0-1.51.2-1.81.5-2.0 A50(soft)%=5.0=6.0=8.0=10.0=15.0=20.0 Oxidation resistance200?Min60 PinholeEaNone WidthMm100-660 Width accuracyMm0~ +2 Core/3 in, 6 in, 80mm Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c Sizes and tolerances (mm) ThicknessThickness tolerancesWidthWidth tolerances 0.012~0.04± 0.001100~600± 0.1 > 0.04~0.10± 0.002 Specifications available (mm) ThicknessWidthTemper 0.012~0.04100~600O, h, > 0.04~0.10100~600O, h
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance.
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm
1. Material: tinned copper foil 2. Single foil thickness: 0.05mm, 0.10mm, 0.20mm, ... 3. Cross section: 50-4000 SQMM 4. Purpose: flexible electrical or conductive connection 5. RoHS compliant 6. Customization available for special dimension, shapes and structure.
Cas no: 7440-33-7Eninec no: 231-143-9 Mf: w Grade standard:industrial, Purity:99.9%Appearance: black poweder Application:hard alloySize:40nm, 70nm, 100nm, 150nmShape:spherical Note: we can supply different size products of nano tungsten w nanoparticles according to client's requirements. Product performance Nano powder particles is uniform, high activity, high specific surface passivization treatment after the powder can be controlled in oxygen content of less than 1%.
Negotiation must be done first then test and buy the product, we also proposed penalty cost after negotiation being done All products are by tons
Refined sunflower oil, refined palm oil (cp10), refined soybean oil, cocopeat/coco pith, neem oil, foxnuts, makhana, cashew, virgin coconut oil, cold pressed coconut oil, groundnut oil, groundnut, peanut oil, peanut, en590 diesel, aluminum ingots, copper cathode.Import, export, merchant trading
Cocoa beans, arabica coffee, robusta coffee, white refined sugar icumsa 45, sugar icumsa 600/1200, frozen caribbean lobsters, frozen caribbean shrimps, caribbean seafood, a1 jet fuel, diesel en 590, gas d6, liquefied natural gas (lng), liquefied petroleum gas (lpg), light crude oil..
Copper sulphate 24.5%, manganese sulpahte 32%, cobalt sulphate 20.5%, ferrous sulphate 19% & 30%, ammonium molybdate 54%, zinc sulphate mono 33% & hepta 21%, magnesium sulphate 9.6%, boron 20%, boric acid, borax decahydrate 10.5% & pentahydrate 15%, water soluble fertilizers, potassium schoenite, edta chelates(zn, mg, mn, cu, ca, fe), amino acid 80% & 50%, amino cheleted mix, (zn, cu, ca, mn, mg, fe), humic acid granular 80%, potassium humate flakes 98%, potasium fulvic humate 98%, humic acid powder 95%, potassium humate crystal 98%, potassium fulvic humate 98%, seaweed extract powder/flakes, fulvic acid 81%, silicon super spreader, glycine cheleted mixture (cu, mn, cr, zn), choline chloride 50%, 60%, 75%, 98%, bypass fat 84% & 99%, yeast extract powder, beef extract powder, peptone, dextrose monohydrate..
Coffee, cocoa, frozen seafood, soybeans, sugar, cotton, wheat, corn, steel, copper, lead, nickel, steel scrap metal, crude oil, diesel, fuel oil, gasoil, gasoline, bunker, pet coke, coal, propane, fertilizer.
1) basmati rice 1121 sella, 1509, 1401, 1718 2) non basmati rice ir 64 parboiled, sona masoori, swarna, brown rice, ponni, idli rice 3) all kinds of spices like red chilli powder, coriander powder, moringa powder, turmeric powder, masala powder, cardamom, cinnamon, and turmeric fingers. 4) refined sunflower oil, palm oil, coconut oil 5) aluminum ingots, copper cathodes, copper Millberry Scrap. 6) solar panels, lithium-ion batteries, inverters, lead acid batteries 7) icumsa 45, s30 sugar.
Copper concentrate 20-30% Copper Millbery - 99.97% CIF or FOB
