Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm Performance: ClassificationUnit9µm12µm18µm35µm70µm105µm Cu content%=99.8 Area weigthG/m280±3107±3153±5283±7585±10875±15 Tensile strengthR.T.(23?)Kg/mm2=28 H.T.(180?)=15=18=20 ElongationR.T.(23?)%=5.0=6.0=10 H.T.(180?)=6.0=8.0 RoughnessShiny(ra)µm=0.43 Matte(rz)=3.5 Peel strengthR.T.(23?)Kg/cm=0.77=0.8=0.9=1.0=1.5=2.0 Degraded rate of hcl(18%-1hr/25?)%=7.0 Change of color(e-1.0hr/200?)%Good Solder floating 290?Sec.=20 Appearance(spot and copper powder)----None PinholeEaZero Size toleranceWidthMm0~2mm LengthMm---- CoreMm/inchInside diameter 79mm/3 inch
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. NameGbAlloy no.Size (mm) (iso)(asmt)(jis)(bis)(din) Copper foilT2Cu-etpC11000C1100C101R-cu57Thickness: 0.009-0.15 /max width: 640 ItemUnitThickness 9um12um18um35um70um90um PurityCu%=99.97 Surface roughnessRaUm=0.17 Tensile strengthRm(hard)N/mm2420-440450-470460-480430-450410-430 Rm(soft)N/mm2160-180180-220200-230210-240220-250 ElongationA50(hard)%0.8-1.20.8-1.31.0-1.51.2-1.81.5-2.0 A50(soft)%=5.0=6.0=8.0=10.0=15.0=20.0 Oxidation resistance200?Min60 PinholeEaNone WidthMm100-660 Width accuracyMm0~ +2 Core/3 in, 6 in, 80mm Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c Sizes and tolerances (mm) ThicknessThickness tolerancesWidthWidth tolerances 0.012~0.04± 0.001100~600± 0.1 > 0.04~0.10± 0.002 Specifications available (mm) ThicknessWidthTemper 0.012~0.04100~600O, h, > 0.04~0.10100~600O, h
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance.
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) Vlp ed copper foil Specifications: Thickness: 1/4oz~3oz(9µm~105µm) Max size: 1295mm×1295mm
Ed copper foils for fpc Dimension range: Thickness: 9~35µm Performances: The product surface is black or red, has lower surface roughness. Applications: Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film. Features: High density, high bending resistance and good etching performance. S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb)
S-hte ed copper foils for pcb Specifications: Thickness: 1/4oz~2oz(9µm~70µm) Width: 260mm ~1290mm (for normal pcb) One-side shiny
High-precision rolled copper foil Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material. Base material: c11000 copper, cu > 99.96% Thickness range: 0.009mm-0.15mm Width range: 200mm-640mm Temper: hard, soft Application: ccl, electronics shielding and heat radiation, wide copper tape etc. Note: we can provide products with other properties according to customers` requirements. Physical properties Density: 8.9g/cm3 Electrical conductivity (20°c): min 90%iacs for annealed to temper Min 80%iacs for rolled to temper Thermal conductivity (20°c): 390w/(m°c) Elastic modulus: 118000n/m Softening temperature: =380°c
C18150 Chromium Zirconium Copper bar as per RWMA Class 2
CuCo1Ni1Be/CW103C Cobalt Nickel Beryllium Copper Chemical Composition: Be: 0.40-0.70% Co: 0.80-1.30% Ni: 0.80-1.30% Cu: Balance Note: Copper plus additions equal 99.5% minimum. Shapes : Round bars, Round wires, Round tube, Flat bars, Square bars, Rectangular bars, Hexagon bars, Plates, Sheets, Coils Custom shapes are available upon request. Available Sizes: Rod: Dia.5~16mm; Wire: Dia.0.1-5.0mm Tube: OD10~60mm, ThK 0.1~10mm Plate: thk min 0.5mm Custom Diameter & Sizes, Random Mill lengths Typical Physical Properties: Density (g/cm3): 8.83 Density before age hardening (g/cm3): 8.75 Elastic Modulus (kg/mm2 (103)): 14.10 Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): 17 x 10-6 Thermal Conductivity: 209 W/m � oK at 20 C Melting Range (°C): 1000-1070 Note: 1). the units are based upon Metric. 2). the typical physical properties apply to age hardened products. Related Standard : Rods/Bars/Tubes: ASTM B441, SAE J461,463; RWMA Class 3 Sheets: ASTM B534 Wires: ASTM B441 Plates: ASTM B534, SAE J461,463; RWMA Class 3 European Standards: CuCo1Ni1Be, CW103C to EN Other material are also available C17200/CuBe2/CW101C/DIN 2.1247 C17300/CuBe2Pb/CW102C/DIN 2.1248 C17500/CuCo2Be/CW104C/DIN 2.1285 C17510/CuNi2Be/CW110C/DIN 2.0850 CuCo1Ni1Be/CW103C
