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C17200/CuBe2/CW101C/DIN 2.1247 Beryllium Copper

C17200 is manufactured to provide a combination of high strength and hardness properties coupled with superior thermal properties. This range of properties makes C17200 the premier material for copper alloy molds and a wide range of other applications from oil and gas to aerospace.

Chemical Composition:
Be: 1.80-2.0%
Co+Ni: 0.20% Min.
Co+Ni+Fe: 0.60% Max.
Cu: Balance
Note: Copper plus additions equal 99.5% minimum.

Material description:
High strength, good fatigue strength, good conductivity,
non-magnetic, wear resistance

Applications
- Nozzles and needles for hot runner systems
- Inserts in plastic blow moulding and plastic injection moulding
- Needles and nozzles for hot canal systems
- Packing bearings rings in extreme high pressure hydraulics(e.g. jet cutting)
- Stud holders for stud welding equipment
- High strength, non-magnetic, non-sparking parts, sleeves,bushings, bearings for offshore, onshore, airplanes, precision instruments and medical applications moulding

Shapes :
Round bars, Round wires, Round tube,
Flat bars, Square bars, Rectangular bars, Hexagon bars, Plates, Sheets, Coils
Custom shapes are available upon request.

Available Sizes:
Rod: Dia.5~200mm; Wire: Dia.0.1-5.0mm
Tube: OD10~60mm, ThK 0.1~10mm
Plate: thk min 0.5mm
Custom Diameter & Sizes, Random Mill lengths

Related Standard :
Rods/Bars/: ASTM B196; SAE J461,463; AMS 4533,4534,4535; AMS4650,4651;
RWMA Class 4, GOST 15835
Tubes: ASTM B251,643
Strips: ASTM B194, AMS4530,4532; SAE J461,463, GOST 1789  
Sheets: ASTM B194
Wires: ASTM B197, AMS4725, SAE J461,463, JIS 3270, GOST 15834
Plates: ASTM B194, SAE J461,463; AMS4530,4533,4534,AMS4650,4651; RWMA Class 4.
European Standards: CuBe2, DIN 2.1247, CW101C to EN, BrB2

Other material are also available
C17300/CuBe2Pb/CW102C/DIN 2.1248
C17500/CuCo2Be/CW104C/DIN 2.1285
C17510/CuNi2Be/CW110C/DIN 2.0850
CuCo1Ni1Be/CW103C

CuCo1Ni1Be/CW103C Cobalt Nickel Beryllium Copper

Chemical Composition:
Be: 0.40-0.70%
Co: 0.80-1.30%
Ni: 0.80-1.30%
Cu: Balance
Note: Copper plus additions equal 99.5% minimum.

Shapes :
Round bars, Round wires, Round tube,
Flat bars, Square bars, Rectangular bars, Hexagon bars, Plates, Sheets, Coils
Custom shapes are available upon request.

Available Sizes:
Rod: Dia.5~16mm; Wire: Dia.0.1-5.0mm
Tube: OD10~60mm, ThK 0.1~10mm
Plate: thk min 0.5mm
Custom Diameter & Sizes, Random Mill lengths

Typical Physical Properties:
Density (g/cm3): 8.83
Density before age hardening (g/cm3): 8.75
Elastic Modulus (kg/mm2 (103)): 14.10
Thermal Expansion Coefficient (20 °C to 200 °C m/m/°C): 17 x 10-6
Thermal Conductivity: 209 W/m â?¢ oK at 20 C
Melting Range (°C): 1000-1070
Note: 
1). the units are based upon Metric.
2). the typical physical properties apply to age hardened products.

Related Standard :
Rods/Bars/Tubes: ASTM B441, SAE J461,463; RWMA Class 3
Sheets: ASTM B534
Wires: ASTM B441
Plates: ASTM B534, SAE J461,463; RWMA Class 3
European Standards: CuCo1Ni1Be, CW103C to EN

Other material are also available
C17200/CuBe2/CW101C/DIN 2.1247
C17300/CuBe2Pb/CW102C/DIN 2.1248
C17500/CuCo2Be/CW104C/DIN 2.1285
C17510/CuNi2Be/CW110C/DIN 2.0850
CuCo1Ni1Be/CW103C

Copper-powder fractions 69.1% cu63 & 30.9% of cu65 with purity 99.99%.

C18150 Chromium Zirconium Copper bar as per RWMA Class 2

Ed copper foils for fpc

Dimension range:
Thickness: 9~35µm

Performances:
The product surface is black or red, has lower surface roughness.

Applications:
Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film.

Features:
High density, high bending resistance and good etching performance.


S-hte ed copper foils for pcb

Specifications:
Thickness: 1/4oz~2oz(9µm~70µm)
Width: 260mm ~1290mm
(for normal pcb)

Specifications:
Thickness: 1/4oz~2oz(9µm~70µm)
Width: 260mm ~1290mm
(for normal pcb)

S-hte ed copper foils for pcb

Specifications:
Thickness: 1/4oz~2oz(9µm~70µm)
Width: 260mm ~1290mm
(for normal pcb)

One-side shiny

Vlp ed copper foil
Specifications:
Thickness: 1/4oz~3oz(9µm~105µm)
Max size: 1295mm×1295mm

Performance:
ClassificationUnit9µm12µm18µm35µm70µm105µm
Cu content%=99.8
Area weigthG/m280±3107±3153±5283±7585±10875±15
Tensile strengthR.T.(23?)Kg/mm2=28
H.T.(180?)=15=18=20
ElongationR.T.(23?)%=5.0=6.0=10
H.T.(180?)=6.0=8.0
RoughnessShiny(ra)µm=0.43
Matte(rz)=3.5
Peel strengthR.T.(23?)Kg/cm=0.77=0.8=0.9=1.0=1.5=2.0
Degraded rate of hcl(18%-1hr/25?)%=7.0
Change of color(e-1.0hr/200?)%Good
Solder floating 290?Sec.=20
Appearance(spot and copper powder)----None
PinholeEaZero
Size toleranceWidthMm0~2mm
LengthMm----
CoreMm/inchInside diameter 79mm/3 inch

High-precision rolled copper foil
Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material.
Base material: c11000 copper, cu > 99.96%
Thickness range: 0.009mm-0.15mm
Width range: 200mm-640mm
Temper: hard, soft
Application: ccl, electronics shielding and heat radiation, wide copper tape etc.
NameGbAlloy no.Size (mm)
(iso)(asmt)(jis)(bis)(din)
Copper foilT2Cu-etpC11000C1100C101R-cu57Thickness: 0.009-0.15 /max width: 640
ItemUnitThickness
9um12um18um35um70um90um
PurityCu%=99.97
Surface roughnessRaUm=0.17
Tensile strengthRm(hard)N/mm2420-440450-470460-480430-450410-430
Rm(soft)N/mm2160-180180-220200-230210-240220-250
ElongationA50(hard)%0.8-1.20.8-1.31.0-1.51.2-1.81.5-2.0
A50(soft)%=5.0=6.0=8.0=10.0=15.0=20.0
Oxidation resistance200?Min60
PinholeEaNone
WidthMm100-660
Width accuracyMm0~ +2
Core/3 in, 6 in, 80mm
Note: we can provide products with other properties according to customers` requirements.

Physical properties
Density: 8.9g/cm3
Electrical conductivity (20°c): min 90%iacs for annealed to temper
Min 80%iacs for rolled to temper
Thermal conductivity (20°c): 390w/(m°c)
Elastic modulus: 118000n/m
Softening temperature: =380°c

Sizes and tolerances (mm)
ThicknessThickness tolerancesWidthWidth tolerances
0.012~0.04± 0.001100~600± 0.1
> 0.04~0.10± 0.002

Specifications available (mm)
ThicknessWidthTemper
0.012~0.04100~600O, h,
> 0.04~0.10100~600O, h

Ed copper foils for fpc

Dimension range:
Thickness: 9~35µm

Performances:
The product surface is black or red, has lower surface roughness.

Applications:
Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film.

Features:
High density, high bending resistance and good etching performance.

High-precision rolled copper foil
Rolled copper foil has extraordinary strength, bendability, ductility and lustrous surface, plus its excellent mechanical capacity, makes it irreplaceable as a raw material.
Base material: c11000 copper, cu > 99.96%
Thickness range: 0.009mm-0.15mm
Width range: 200mm-640mm
Temper: hard, soft
Application: ccl, electronics shielding and heat radiation, wide copper tape etc.

Note: we can provide products with other properties according to customers` requirements.

Physical properties
Density: 8.9g/cm3
Electrical conductivity (20°c): min 90%iacs for annealed to temper
Min 80%iacs for rolled to temper
Thermal conductivity (20°c): 390w/(m°c)
Elastic modulus: 118000n/m
Softening temperature: =380°c

Ed copper foils for fpc

Dimension range:
Thickness: 9~35µm

Performances:
The product surface is black or red, has lower surface roughness.

Applications:
Flexible copper clad laminate (fccl), fine circuit fpc, led coated crystal thin film.

Features:
High density, high bending resistance and good etching performance.

S-hte ed copper foils for pcb

Specifications:
Thickness: 1/4oz~2oz(9µm~70µm)
Width: 260mm ~1290mm
(for normal pcb)


Vlp ed copper foil
Specifications:
Thickness: 1/4oz~3oz(9µm~105µm)
Max size: 1295mm×1295mm

1. Material: tinned copper foil 2. Single foil thickness: 0.05mm, 0.10mm, 0.20mm, ... 3. Cross section: 50-4000 SQMM 4. Purpose: flexible electrical or conductive connection 5. RoHS compliant 6. Customization available for special dimension, shapes and structure.

Cas no: 7440-33-7Eninec no: 231-143-9 Mf: w
Grade standard:industrial, Purity:99.9%Appearance: black poweder
Application:hard alloySize:40nm, 70nm, 100nm, 150nmShape:spherical
Note: we can supply different size products of nano tungsten w nanoparticles according to client's requirements.
Product performance
Nano powder particles is uniform, high activity, high specific surface passivization treatment after the powder can be controlled in oxygen content of less than 1%.

Negotiation must be done first then test and buy the product, we also proposed penalty cost after negotiation being done


All products are by tons

Copper concentrate 20-30%
Copper Millbery - 99.97%
CIF or FOB

Copper content 90 (%)

Impurity content: 0.005 (%)
Service field: metallurgical minerals
Product name: photographic copper plate

Size: customizable
Product Picture attached

Payment method:
1.bank wire/transfer, T/T
2.paypal
3. Alisure/Credit Card
4.L/C at sight

Copper Rolls

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CONTACT ME VIA EMAIL HERE OR WHATSAPP MIKE ROSAGAST ACC CONSORTIUM

Min. Order / Reference FOB Price
500 Pieces : US $0.5/ Piece
Port : Ningbo, China
Production Capacity : 500000000000PCS
Payment Terms : L/C, T/T, D/P
Connection : Male
Shape : Equal
Head Code : Round
Angle : 90 Degree
Wall Thickness : STD
Material : Copper