Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8% Advantage of high quality Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs
Advantage of High efficiency P Type polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20m Transfer efficiency:>18.8%
Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Hengxing science and techology co.,ltd built in 1995, with 24 years of steel wire transforming and coating industries, our main product as galavanized steel wire, strand, PC steel wire strand, steel cord radial tire, hyrolic hose and polycrystaline silicon. Listed on Shenzhen A stock market in 2007,we have independent R&D center, passed the ISO, SGS,BV certification and so on. As the biggest galavanized steel wire and srand manufacture in China, and the biggest steel cord for radial tire, with high quality and performance, our product widely used in the industries as electric cable, suspension construction, radial tire and hydrolic hose, and sawing.
Advantage of high quality P Type Polycrystalline Solar Wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Technology : Diamond wire cutting Type : P type Resistance:1~3 s minority carrier:>2 s Hem width:157.00~157.25mm Thickness:200±20 m Transfer efficiency:>18.8%
Green silicon carbie Green silicon carbide is produced as the same type as the black silicon carbide, except the different raw materials.Ití»s crystallization have higher purity and hardness.Green silicon carbide is suitable for processing hard alloy, metallic and non-metallic marterails with hard and brittle feature such as copper, brass, aluminium, magnesslum , jewel, optical glass, ceramics, etc.Super micropower of it is also a kind of ceramics material.
The breaking strength of diamond wire is high and stable; the diamond particles is well distributed and and no agglomeration, to keep the diameter of diamond wire uniform withdifferent diamond density; strongbonding force of plating ,and there's no peeling and cracks; the coating is compact and smooth, the appearance looks silver andbeautiful. Item: Diamond wire Shape:wire Material: Imported C-steel Diameter:55μm-450μm available 24 years of history in steel wire transforming and coating Listed on Shenzhen A stock market in 2007 An annual output of 3000000 Kilometers of sawing wire ISO/TS 16949 And ISO9002 certificated
Advantage of 156x156mm 200um High efficiency P Type polysilicon wafer Manufacturer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8%
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of Hot Sales A Grade polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Name: High efficiency polysilicon wafer Technology : Diamond wire cutting Type : P type Resistance:1~3μs minority carrier:>2 μs Hem width:157.00~157.25mm Thickness:200±20μm Transfer efficiency:>18.8% Advantage of high quality High efficiency P Type polysilicon wafer The production process is simple, cost-effective, and reduces silicon waste High conversion efficiency, low fragmentation rate and low optical attenuation Manufacturing Specialization, Intelligence and Greening Customized products to meet customer needs Hengxing company website: https://hengxingsteelwire.com/ Email contact US:wmsale@hxkjgf.com
Silica, silicon carbide, silicon carbide, also known as carbon refractory sand, is made of quartz sand and petroleum coke, sawdust and other raw materials in smelting in electric resistance furnace, high temperature and be become.Green silicon carbide black silicon carbide and silicon carbide two commonly used basic varieties: (1) black silicon carbide containing SiC by about 95%, its toughness is higher than the green silicon carbide, mostly used for processing low tensile strength of material, such as glass, ceramics, stone, refractory material, cast iron and nonferrous metal, etc.;(2) the green silicon carbide containing SiC98 % above, good self-sharpening, mostly used for processing hard alloy, titanium alloy and optical glass, also used for honing cylinder jacket and fine grinding HSS cutting tools.
99.6% white fused alumina, 95% brown fused alumina, white fused mullite, fused spinel, alumina bubble, black carbide silicon, green carbide silicon.
White fused alumina, brown fused alumina, black silicon carbide, green silicon carbide.
Silicon carbide.
White fused alumina, brown fused alumina, black silicon carbide, green silicon carbide.
Gallium, gallium arsenide gaas poly, single crystal, wafer, gallium oxide, gan, gacl3, indium, germanium, fluorspar, chlorinated paraffin, plasticizers, dop substitutes, dop, dinp, dotp, epoxidized soybean oil (eso), pvc resin, tio2, potassium oxalate, pto, pbo, pcd sheet, welding flux, submerged arc flux, welding wire, aluminum alloy, magnesium alloy, aluminum lithium alloy, magnesium lithium alloy, master alloy.
Calcium metal, calcium silicon, ferro silicon , silicon metal.Trading agent
Alsint C997 (Alumina 99.7% KER 710)ceramic tube, Alsint, thermowell, Alumina ceramic tube, ceramic protection tube, recrystallised Alumina tube, insulator, thermocouple insulators, KER799. silicon carbide, Silicon carbide protection sheath, Silicon Nitride Bonded SiC, Si sic tube.
Fine chemicals, lcd, polyimide monomer, noble metal catalysts, small molecule silicone.
Sic heating element,sic heater,silicon carbide heating element,mosi2 heating element,mosi2 heater,molybdenum disilicide heating element.
