Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Material: FR-4 Tg135 PCB Size:158.75*118.6mm Board thickness: 1.6mm Surface finished: HAL LF Copper thickness: 1/1 Oz Min through hole: 0.2mm Consumer Electronics
Type: Double sides printed wiring board Laminate: FR4 TG170 Board size and thickness: 100*36*1.60mm*3UP Surface finished: ENIG Copper thickness: 35um Solder mask : Green Silkscreen : White
FR4 material, 0.2mm thickness pcb, thin pcb, ENIG pcb, 94v0 pcb material: FR4, copper finished: 1/1 OZ finished thickness: 0.2mm surface finished: immersion gold (Au 2Uâ??) min hole: 0.25mm solder mask: green
OEM China Electronics Double-sided PCB Manufacturer Shenzhen One Stop PCBA Service PCB Assembly
OEM China Electronics Double-sided PCB Manufacturer Shenzhen One Stop PCBA Service PCB Assembly
IPC Releases 5 New Standards for Flexible/Rigid-Flexible Printed Boards and Performance of Rigid Printed Boards IPC announces the release of five newly revised standards covering several areas of the supply chain. IPC/WHMA-A-620D, Requirements and Acceptance for Cable and Wire Harness PCB Assemblies IPC-2223E, Sectional Design Standard for Flexible/Rigid-Flexible Printed Boards IPC-2591-Version 1.1, Connected Factory Exchange (CFX) IPC-1791A, Trusted Electronic Designer, Fabricator and Assembler Requirements IPC- 6012E, Qualification and Performance Specification for Rigid Printed Boards PURCHASE NOW Details on some of the changes for the newly released standards: IPC/WHMA-A-620D provides several changes that were requested by the industry. The task group addressed the target conditions in the document by moving some conditions to acceptable criteria while other cases were moved to training. There are several new or revised graphics The solderless wrap section was completely revised A new section was added for over-molding of flexible flat ribbon IPC-2223E establishes the specific requirements for the design of flexible and rigid-flexible printed board applications and its forms of component mounting and interconnecting structures. Several figures are updated New sections and comments on microvia stacking Back-drilled holes and dual row zero insertion force (ZIF) connectors updated IPC-6012E establishes and defines the qualification and performance requirements for the fabrication of rigid printed boards. Provides new acceptance criteria for back drilled holes Establishes new requirements for copper wrap plating of holes in new designs Discusses reliability issues for microvia structures in class 3 products IPC-2591 V1.1 establishes the requirements for the omnidirectional exchange of information between manufacturing processes and associated host systems for assembly manufacturing. provides changes made to message sections, and message structure sections Appendix A was added with a short description of all changes from V1.0 Appendix B provides acronyms and abbreviations IPC-1791A provides minimum requirements, policies and procedures for printed board design, fabrication and assembly organizations and/or companies to become trusted sources for markets requiring high levels of confidence in the integrity of delivered products. New Appendix D covering requirements for trust certification of non-U.S. electronic design, fabrication and assembly organizations Several sections have been updated from Scope through and including 3.0requirements Classifications of Class I, 2 and 3 have been added
Layers: 2Rigid + 2flex + 2Rigid design Material: FR4 middle TG + Dupont AP8515R Thickness: Rigid 0.80mm Flex 0.20mm with stiffener Surface treatment: immersion gold Apply for surveillance producation Solder mask: Green + Coverlay Legend: White Rigid-flex Printed circuit board manufacturer from China
MEGTRON 6 is advanced material designed for high-speed network equipment, mainframes, IC testers and high frequency measuring instruments. The main attributes of MEGTRON 6 are: low dielectric constant and dielectric dissipation factors, low transmission loss and high heat resistance; Td = 410C (77°F). MEGTRON 6 meets IPC specification 4101 /102 /91.
Hitech Circuits Co., Ltd. is a leading Ceramic PCB Manufacturer and Ceramic Substrate Manufacturer in China, we specialized in Ceramic PCB Manufacturer Ceramic Substrate Manufacturer, Electronic Ceramic Supplier, AL2O3 Ceramic Supplier, ZRO2 Ceramic Supplier, High Temperature Ceramic Coating, Industrial Ceramics Manufacturer, Anti ESD Coating, Anti Glue Coating, and Silicon Carbide Coating Services. The products are widely used in high power LED ceramic substrate, microwave wireless communications, HCPV solar animal cells, ceramic sensor substrates, semiconductor and military electronics. DBC Ceramic PCB DPC Ceramic PCB HTCC Ceramic PCB LTCC Ceramic PCB
Copper Base PCB, Metal PCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and the metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. LED PCB always be produced with Aluminum core, but sometimes steel core PCB and copper core PCB also be used. Copper Base PCB Metal PCB ENIG White 1 Layer, Copper base material. Finished board thickness is 1.6mm. White solder mask 1 Oz finished copper thickness. Surface Finish is ENIG 2u
Product type: Aluminum Substrate Material: Aluminum plate +high thermal insulation material Layer/Thickness: 2L/1.6 mm Outer Copper:/ 1.5 OZ Surface treatment: HASL LF Min Line Width: 0.3mm Min Line Space: 0.3mm Min Hole: 0.35 mm Solder Mask: White X 2 sides Silkscreen: Blackx 1 side Technical featuer: special materials Application: Lamps and lanterns
Layer count: 10 layer Board thickness 0.80mm Raw material FR4 370HR Min.line width/space 0.075/0.075mm Minimum hole diameter 0.10mm Surface finishing ENIG Plug via-in-pad by resin and plate flat
10layers HDI PCB Base material: FR4, Tg170 Surface finishing: immersion gold Board thickness: 1.0mm Copper thickness: 0.5oz Minimum line width: 0.1mm Minimum line spacing: 0.1mm Laser drilling + blind and buried drilling Impedance control Board stack up: 1+8+1 Impedance control
Layers3 36 Layers HDI Step 3+N+3 Min.Line Width0.05mm (2 mil) Min.Line Space0.05mm (2 mil) Min.Annular ring0.1mm (4 mil) Min. Via0.1mm (4 mil) Max.Size500mm X 800mm MaterialFR4,High Tg220 Material thickness Start at 25um Plus copper Copper thickness0.3 OZ to 10 OZ (10um 350um) Please contact us for more information about HDI PCB Board.
Minimum line spacing:0.4mm Minimum line width: 0.3mm Copper thickness: 18/25/35/70um Plate thickness: 0.0075"(0.2mm)-0.125"(3.2mm) Material: Copper substrate board Outsourcing size: 41*25*23mm
Material: Aluminum Bases Layer/Thickness: 2L/1.6 mm Copper Thickness:1 OZ Surface treatment:ENIG Solder Mask:White Technical featuer: special materials
Product type 2 Layer Metal Base PCB Material Copper base Layers/thickness : 2L/1.6mm Line Space/width : 25/30mil Surface treatment : ENIG Minimum hole dia. 2.5mm Outer Layer Copper Thickness 1/1 OZ
Layer NO# 1 or 2Layers Material: Aluminum 0.80~3.80W/m.k Finished Thickness: 1mm or 1.6mm Outer Copper: 1 ~3 OZ Surface treatment: HASL LF / OSP / ENIG
