1. High Temperature & High Frequency Resistant Circuit Base Material 1) Polyimide woven glass fibre copper clad laminate Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature. Usage: It is broadly used in the environment which request long life usage under the high temperature. For example, high temperature & high frequency resistant circuit boards in many electric equipments of Airplane engine instrument, Pit Drilling, Auto-control equipment and MULLER. Specification: 625mm¡Á1040mm, 1040mm¡Á1250mm£¨41 inch¡Á49 inch£© Thickness: 0.1mm¡«6.0mm Copper foil thickness£º0.018¡«0.105mm 2) Polyimide woven glass fibre insulation laminated board Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature. Usage: It is broadly used in making special high temperature & high frequency resistant insulation board such as Dry type transformer, Special Motor and Radio & TV Transmitter. Specification: 625mm¡Á1040mm, 1040mm¡Á1250mm£¨41 inch¡Á49 inch£© Thickness: 0.1mm¡«65mm 2. Microwave Circuit Base Material 1) PTFE woven glass fibre copper clad laminate Performance: Little breakage and Steady dielectric constant. This product has a good electrical properties and high machining performance. Usage: It is widely used in Moving Communication, Radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit. Specification: 500¡Á500mm Thickness: 0.1 - 6.35mm Copper foil Thickness: 0.018mm - 0.105mm¡£ 2) Polyphenylene oxide woven glass fibre copper clad laminate Permittivity: 3.2+0.1 Performance: Little breakage and Steady dielectric constant. High temperature resistant is ¡Ý150¡æ. This product has a high machining performance. The Machining technics of the printed circuit board is the same as the traditional FR-4. Usage: It is widely used in Satellite communication, Solid-state phased-array radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit. Specification: 625¡Á1040mm Thickness£º0.1-6.0mm Copper foil Thickness£º0.018-0.070mm 3) Polyphenylene oxide woven glass fibre insulation laminated board Permittivity: 3.2+0.1 Performance: Little breakage and Steady dielectric constant. Usage: It is used in making Si-B-O-N material. Specification: 625¡Á1040mm Thickness£º0.1-60mm 3. Ultra Thick Copper Clad Laminate Performance: Best electrical properties. It can be afford high power electric current. The peel strength of the copper foil can be arrived over 3N/mm. Usage: It is used in making electricity, automobile electronic products and high power electronic equipment circuit base material. Specification: 510¡Á610 mm; 625¡Á1000mm; 1040¡Á1250mm Copper Clad Laminate Thickness: 0.15¡ª5.0mm; Insulation Laminated Board Thickness£º0.10--60mm. 4. Metal Base Copper Clad Laminate 1) Copper base copper clad laminate 2) Aluminum base copper clad laminate 3) Iron base copper clad laminate
