All sheets
Mixed single-side and double-side
Mixed FR4 CEM1 CEM3
(18/18+35/0+35/35+70/0)
And we are not sure the percentage
we have 5-9.9cm 10-14.9cm 15-19.9cm 20up 1/4+1/6 half and we mainly sell 5-9.9cm and 10-14.9cm others need to wait more time
1. High Temperature & High Frequency Resistant Circuit Base Material
1) Polyimide woven glass fibre copper clad laminate
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in the environment which request long life usage under the high temperature. For example, high temperature & high frequency resistant circuit boards in many electric equipments of Airplane engine instrument, Pit Drilling, Auto-control equipment and MULLER.
Copper foil thickness£º0.018¡«0.105mm
2) Polyimide woven glass fibre insulation laminated board
Performance: Excellent high-frequency dielectric properties, High temperature & radiation resistant. Long used under 230¡æ high temperature.
Usage: It is broadly used in making special high temperature & high frequency resistant insulation board such as Dry type transformer, Special Motor and Radio & TV Transmitter.
2. Microwave Circuit Base Material
1) PTFE woven glass fibre copper clad laminate
Performance: Little breakage and Steady dielectric constant. This product has a good electrical properties and high machining performance.
Usage: It is widely used in Moving Communication, Radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Performance: Little breakage and Steady dielectric constant.
High temperature resistant is ¡Ý150¡æ. This product has a high machining performance. The Machining technics of the printed circuit board is the same as the traditional FR-4.
Usage: It is widely used in Satellite communication, Solid-state phased-array radar, Microwave antenna and all kinds of Communication Equipments in microwave circuit.
Performance: Little breakage and Steady dielectric constant.
Usage: It is used in making Si-B-O-N material.
Specification: 625¡Á1040mm
Thickness£º0.1-60mm
3. Ultra Thick Copper Clad Laminate
Performance: Best electrical properties. It can be afford high power electric current. The peel strength of the copper foil can be arrived over 3N/mm.
Usage: It is used in making electricity, automobile electronic products and high power electronic equipment circuit base material.
Specification: 510¡Á610 mm; 625¡Á1000mm; 1040¡Á1250mm
Copper Clad Laminate Thickness: 0.15¡ª5.0mm;
Insulation Laminated Board Thickness£º0.10--60mm.
4. Metal Base Copper Clad Laminate
1) Copper base copper clad laminate
2) Aluminum base copper clad laminate
3) Iron base copper clad laminate
FR1, CEM1 and FR4 Copper Clad Laminates Offcuts
Width: 5cm to 15cm
Length: 45cm to 120cm
Thickness: 1.6mm
All offcuts are famous Brand name from Copper Clad Laminates Manufacturer in China.
Our warehouse team handles each Pallets properly and separated by offcuts width range such as 5-7cm, 7-9cm and 10cm&above.
FR1, CEM1 and FR4 Copper Clad Laminates Offcuts
Width: 5cm to 15cm
Length: 45cm to 120cm
Thickness: 1.6mm
All offcuts are famous Brand name from Copper Clad Laminates Manufacturer in China.
Our warehouse team handles each Pallets properly and separated by offcuts width range such as 5-7cm, 7-9cm and 10cm&above.
