Double-Sided Pcb

Double sided PCB, OSP or HASL surface finishing, Finished CU 1 oz, 1.6 mm board thickness, green glossy solder mask and white legend

Fr-4 board, 1.6mm board thickness and 1oz copper thickness, Hasl-lf surface finishing, green solder mask and white legend, Ul and rohs certified, Fast prototype and mass production for pcb and pcb assembly as per buyers' requirements, Component sourcing, pcb reverse engineering and pic decoding available, High quality and good price. Pcb capability: Max layer count for rigid pcb: 1-12, Pcb board thickness: 14mil -175mil, Drill to metal: 7mil, Hole size: 6mil, Inner layer registration: 3mil, Line width & space inner/outer: 3mil/3mil (minimum), Aspect ratio: min solder mask dam: 2.5mil, Controlled impedance: +/- 8,161;,235;, Max internal copper wt: 3 oz, Advanced technologies: blind/buried via, hdi micro via, Surface treatment: enig, osp, immersion silver/tin, lead free hasl, Materials: fr4, high tg epoxy, halogen free, Certificates: rohs, iso14001 and ul, Price: quite competitive especially for orders in huge quantities, Products application: computer, communication, test & control system, medical equipment etc. Lead time: 5-20 days (depends on qty, production status etc. ) Delivery mode: ups, dhl, fedex, tnt, standard flight & vessel, pls kindly feel free contact with us if you have any question about pcb&pcba. 200mm*160mm*140mm¡ê,172; 0.1kg per pcs

Specifications: Base material: FR4 Layers coverage: two Board thickness: 1.6mm Copper thickness: 4oz Surface treatment: immersion gold Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request.

Key specifications/special features: Base material: fr4 Layer coverage: 2 layers Board thickness: 2.0mm Copper thickness: 2oz Surface treatment: lead-free hasl Solder mask color: blue Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request

Key specifications/special features: Base material: fr4 Layer coverage: 2 layers Board thickness: 1.2mm Copper thickness: 1oz Surface treatment: immersion gold Line space/width: 0.15mm/0.15mm (minimum) Hole size: 0.4mm (minimum) Soldermask color: orange Payment details: Payment terms: Telegraphic transfer (TT, T/T) Minimum order: 1 to 99 pieces. Base on customer's request

OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA 1. SMT service; 2. Design service, Gerber drawings; 3. Good quality and fast delivery with competitive price. Specifications of OEM / ODM ROHS Gold Plating / Gold Immersion 2 Layer / Double Layers PCB / PCBA: Layer 2 Finished Board Thickness 1.6mm Material FR-4 Min. Drilled Hole Size 3 mil(0.075mm) Min. Line Width 3 mil(0.075mm) Min. Line Spacing 3 mil(0.075mm) Surface Finish Plating/Immersion Gold Copper Thickness 10.5oz , 1oz , 2oz ,3oz,4oz, 5oz ,7oz , 11oz OZ Solder Mask Color Blue/Red/Green Copper Thickness in Hole >25.0um (>1mil) Inner Packing Vacuum Packing/Plastic Bag Outer Packing Standard Carton Packing Shape Tolerance +/-0.13 Hole Tolerance PTH: +/-0.076 NPTH:+/-0.05 Certificate UL/ISO 9001, ISO14000, SGS, ROHS Special Requirements Buried and blind vias + controlled impedance BGA Profiling Routing, V-CUT, Beveling 1. PCB factory price directly; 2. PCB mass production with short lead time; 3. PCB ROHS compliant; 4. PCB ISO9001:2000, UL, ISO14001 Certification; 5. PCB payment T/T, L/C, Western Union; 6. FOB Shenzhen & HK.

Track width/ space: 7mils/7mils Hole diameters: 0.3mm Copper Weight: 1/1oz Solder Mask: Green Surface Treating: HASL.

Double sided FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend LF HASL finish Seal packing

Material: Fr-4 Board finish thickness 1.2mm Product size: 29mm*125mm Min line width: 4mil Min line spacing: 4mil Min hole size: 0.4mm Surface treament: HASL Vacuum Packing/Plastic Bag

1.2mm double-sided PCBs Manufacturing Process:CNC Drilling--Pattern plating--Nickel and gold plating-- Wet film solder mask--Preflux--CNC Routing--Punching-- Carbon & Silver thru hole--Selective plating-- Hot air levelling--Panel for automation--V. Cut--E. Test Production Capacity: Max. Board Size-Standard: 508mm*610mm, On Request: 610mm*610mm Min./Max. Board Thickness-Standard: 0.6mm/3.0mm, On Request: 0.4mm/3.2mm Min. Finish Hole Size-Standard: 0.50mm, On Request: 0.30mm Max. Aspect Ratio-Standard: (4:1), On Request: (8:1) Min. Line Width-Standard: 0.10mm, On Request: 0.13mm Min. Line Pitch-Standard: 0.10mm, On Request: 0.13mm Min. SMT Device Pitch-Standard: 0.45mm, On Request: 0.30mm Min. SMT Device Land Width-Standard: 0.254mm, On Request: 0.254mm Board Flatness Tolerance-Standard: 0.5% Board diagonal, On Request: 0.5%-1% Inner:vacuum packing Outside:carton packing