1.2mm double-sided PCBs Manufacturing Process:CNC Drilling--Pattern plating--Nickel and gold plating-- Wet film solder mask--Preflux--CNC Routing--Punching-- Carbon & Silver thru hole--Selective plating-- Hot air levelling--Panel for automation--V. Cut--E. Test Production Capacity: Max. Board Size-Standard: 508mm*610mm, On Request: 610mm*610mm Min./Max. Board Thickness-Standard: 0.6mm/3.0mm, On Request: 0.4mm/3.2mm Min. Finish Hole Size-Standard: 0.50mm, On Request: 0.30mm Max. Aspect Ratio-Standard: (4:1), On Request: (8:1) Min. Line Width-Standard: 0.10mm, On Request: 0.13mm Min. Line Pitch-Standard: 0.10mm, On Request: 0.13mm Min. SMT Device Pitch-Standard: 0.45mm, On Request: 0.30mm Min. SMT Device Land Width-Standard: 0.254mm, On Request: 0.254mm Board Flatness Tolerance-Standard: 0.5% Board diagonal, On Request: 0.5%-1% Inner:vacuum packing Outside:carton packing