Igjr-4/10 semi-conductor laser cladding equipment
Introduction
Laser cladding technology is interdisciplinary high and new technology refer to
Ray, mechanical, electrical, computer, material, physics, chemistry, etc. This technology is proposed in 60-70's of last century, and developed very fast with laser technology development from 80's of last century.Its working principle is melted alloy powder and substrate surfaces synchronously by the laser energy, and formed lowest dilutability layer of metallurgical bonding with matrix, can improved significantly matrix substrate surfaces performance of wear-resisting, corrosion resistance, oxidation resistance and so on, to achieve the aim of surface engineering or renovating.The laser cladding technology represents the highest level of strengthening the remanufacturing for the important precision workpiece, and also is the best technology that equip high performance alloy surface and no-effect the substrate properties on the normal base material.
Equipment compositionï
Laser systemïlaser power supplyïcontrolsystemïcnc systemïcooling systemïpowder feeder
Advantage of laser cladding:
1.In the future, will abolish chromium plating process because of environmental protection pressure.
2.Chrome plated workpiece can't satisfy the large mining height condition requirement contain corrosive gas or liquid.
3.The working life of laser cladding layer is 5 times than electroplate technology, at present, the hydraulic support of made-in china more than 7m and export require laser cladding.
4.The column next maintenance after laser cladding is very easy, only repair the local damage part, do not proceed this complicated technology of deplate-iron plating or welding repair-chrome plated again, saving time and money, better for the environment.
Application:
Almost whole inerratic axle for laser cladding equipment and rolling mill liner.
The UV laser marking machine is developed by using a 355nm UV laser. This machine uses a third-order intracavity frequency doubling technology. Compared with infrared lasers, the 355nm UV laser has a very small spot, and the marking effect is directly interrupted by a short-wavelength laser. The molecular chain greatly reduces the mechanical deformation of the material. Thermal deformation (cold light), because it is mainly used for ultra-fine marking and engraving. It is especially suitable for applications such as marking, micro-hole drilling of food and pharmaceutical packaging materials, high-speed dicing of glass materials, and complex pattern cutting of silicon wafers.
Laser cutting (84561000)
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