Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with High frequency material PCB, including Rogers and Taconic.
Main parameters:
1) Woven Glass-Reinforced PTFE
2) Available material:
RO4350B
4mil(0.1mm)
10mil(0.254mm)
13.3mil(0.338mm)
20mil (0.508mm)
30mil(0.762mm)
60mil(1.524mm)
RO4003C
12mil(0.3mm)
20mil(0.508mm)
32mil(0.813mm)
60mil(1.524mm)
F4BK
www.wang-ling.com.cn
Taconic
20mil(0.5mm)
30mil(0.762mm)
40mil(1.0mm)
ER 2.55
3) NPTH and PTH
4) Together with FR-4 combination
5) Application: Power divider, Combiner, Coupler, Power amplifier, Trunk amplifier, Station and 3G antenna.
Vaccume bags.
Bicheng provides RD, high-tech companies and organizations, large and small, and some universities with quick turn prototypes.
Main parameters:
1). Material: FR-4, High Tg FR-4
2). Layer count: 2 -16 Layer, 20 m PTH
3). Thickness: 0.5-1.6mm +/- 10%
4). Copper weight(Finished): 18-35 m
5). SMOBC: LPI Green solder mask/ White legend
6). Holes: 0.3mm minimum, 4/4 mil track/space
7). Pads finish: HASL, HASL Pb
8). Delivery time (calendar day)
2 Layer -- 1 days
4 Layer -- 3 days
6 Layer -- 5 days
8 Layer -- 5 days
10 Layer -- 7 days
12 Layer -- 10 days
14 Layer -- 12 days
16 Layer -- 12 days.
Packing: vacuum bag and carton box outside.
Max. 25kg/ctn.
1) SMT solder paste stencil
2) 12" x 12" to 28" x 28"
3) With /without aluminium frame
4) 100% Laser cut (Chemical etch is optional)
5) Stencil thickness 0.05mm-0.2mm
6) Fiducal mark backside half-etch
Vaccum bags.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with PCB prototypes.
It covers:
1) 1-32 Layers, 0.3-6mm thick, Heavy copper (2-10 oz)
2) High Tg 170, High CTI 600V
3) Impedance control +/-10%
4) 1+C+1 HDI, Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Rogers and FR-4 combination PCB.
8) BGA, CSP, QFN
9) Quick turn delivery
10) MOQ: 1 PCS.
Packing:
Vacuum bag and carton box outside
Max. 25kg/ctn.
Bicheng provides RD, high-tech, IT research companies and organizations, large and small with multi-layer PCB's.
It covers:
1) 4-32 Layers, 0.5-6mm thick
2) High Tg 170, High CTI 600V
3) Impedance control +/-10%
4) 1+C+1 HDI, Buried/blind vias
5) Half hole, Via in pad, countersink hole
6) ENIG, HASL, Immersion Silver, OSP, Gold finger, peelable mask
7) Rogers and FR-4 combination PCB.
8) BGA, CSP, QFN
9) Quick turn prototype
10) Small and volume production.
Vaccum bags.
