Rounded Cut Wire

Rounding Cut Wire ball produced by sung kwang, which is accurately cutting high carborn steel and removing sharp edge, is suitable for shot peening for goods because of its high durability and uniform hardness and diameter

Rounding Cut Wire ball produced by sung kwang, which is accurately cutting high carborn steel and removing sharp edge, is suitable for shot peening for goods because of its high durability and uniform hardness and diameter

Supplier: Hr coil/sheets/plates, crca coil/sheets, gi coil/sheets, hrpo coil/sheets/plates, ms angle, ms channel, ms wire rod, ms universal column, ms universal beam, ms flat, ms rounds

Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity

Wire blast carbon steel and wire blast stainless steel can be used in the following three areas :1)Cutting use(cylindrical shape with sharp edge) 2)Section state (comers are round) 3)Integral state (ball shape). The Stainless steel of wire blast becomes toughter as it is used. Therefore, it can be used as an abradant for much longer time.

Solar Wafer Cutting wire Silicon Cutting Sawing Wire Sawing wire , also called ultra fine wire,is cold drawing high strengh brass plated steel wire with high carbon. It can be used for cutting high hardness of single crystal line silicon,poly crystal line silicon,quartz material,etc. (1)Sawing wire is a high grade steel wire that can be used to cut a wide range of products.It serves as the abrasive carrier in a Multi Wire Saw. (2)The technique finds its origin in the world of solar cells. From the mid eighties, this technology was developed to decrease kerf loss and increase productivity. (3)In the early nineties the method was introduced for slicing silicon ingots to wafers for the electronics industry. Since then the technique has been more and more introduced for cutting other hard and brittle materials as well. (4)Saw wire is used to cut a wide variety of products, such as silicon, germanium, gallium aresenide, quartz, indium phosphide, to name only a few. ( 5 )Saw wire is mostly used in the production of solar cells. The use of photovoltaic energy is increasing, as humanity becomes more and more aware of the scarcity of the natural resources. Advantage of Sawing Wire for Solar Wafer Cutiing -------- Very thin and tensile wires of low keff loss Hence more wafters per cut and less fractures Make higher productivity Tight diameter and ovality tolerances A wide range of spool types An advanced winding technology INTRODUCTION: Solar Wafer Cutting wire Silicon Cutting Sawing Wire 17 years of history in steel wire transforming and coating Listed on Shenzhen A stock market in 2007 An annual output of 10,000 tons of sawing wire ISO/TS 16949 And ISO9002 certificated Can provide all kinds of all kinds of the length of the wire, the line length subject only to the spool take-up capacity limit. H wheel type mainly includes NTC210 type, BS200, BS64, BS126, etc. According to customer needs to provide other specification size of h wheel.

Sawing wire for multi sawing solar wfter cutting Item: Sawing wire for multi-wire sawing Ultra Fine Wire Saw For Cutting High Hardness of Monocrystalline Silicon Shape:wire Material: Imported C-steel Coating:Brass,combinations Number of wires:1 wire Other Name: Solar Wafer Cutting wire Silicon Cutting Sawing Wire Diameter:65um-350um available Advantage of Sawing Wire for Solar Wafer Cutiing

Wire Cut EDM machines which are widely used in the fields of moulds, automobile parts, aeronautics and astronautics, electronic instrument, military, light industry, and household appliance. Specification Wire Cut EDM, also known as (wire electrical discharge machining or wire EDM) is a high-precision method for cutting nearly any electrically conductive material. A thin, electrically-charged EDM wire held between upper and lower mechanical guides forms one electrode, while the material being cut forms the second electrode. Electrical discharge between the wire and the workpiece creates sparks that rapidly cut away materials. Application of Wire Cut EDM: The wire cut EDM is suit to cut the metal stamping mould, plastin mould, super abrasive materials, precious metals and cutting sheets, gear cutter hob, mechanical parts processing ,etc EDM machines which are widely used in the fields of moulds, automobile parts, aeronautics and astronautics, electronic instrument, military, light industry, and household appliance Advantages of Wire Cut EDM: * The process is burr-free, distortion-free and can be used to machine exotic materials which are work-hardened, ductile or brittle. * High Precision. It is capable of making cuts that match your designs within �± 0.0001â??. * Less set up time. EDM manufacturing reduces the need for tooling, which in turn lessens the amount of time that it takes to set up. * Tapers. EDM machining is useful for cutting long tapers that other machining methods cannot produce. * Accurate internal cuts. Square-edged internal cuts are difficult to produce with other machining methods, but Wire EDM makes it possible. * Fine hole drilling. EDM drilling is capable of producing tiny holes that are difficult to produce with other methods.