Commercial / Telecom Rigid-Flex Fpc

This Medical Imaging board for a medical device that is eighteen layers and presents difficult registration due to the number of layers and board's dimensions. Application: Medical Imaging Size: 4.5 by 22.25 Layers: 18 Overall, Four Layers Flex with Four Layers of Epoxy Silver Shielding Materials: Adhesiveless Flex, Polyimide Core, Polyimide No Flow Prepreg Traces: 7/4 Innerlayers - 7/5 Outerlayers Minimum Hole: 0.024 Minimum Pad: 0.040 Thickness: 0.093 +/- 0.005 vacuum-packed for inner,thicker carton for outer

Supplier: Portable power station, resindential energy storage system, commercial & industrial energy storage system, mini grid solar energy solutions, solar panels, pv derivatives, lifepo4 battery, lithium battery, solar battery
Services: Samples, oem & odm service

Place of origin: taiwan Brand name: fr4, rogers, isola, etc. Copper thickness: 0.45 mils - 14 mils Board thickness: 280 mils (max finished board) Min. Hole size:

Material: pi, pet, pc Production category: single side fpc, double side fpc, multilayer fpc, aluminum base board, copper base board Surface finishing: ni/au plating, immersion tin/gold, pure-tin plating Standard: rohs, sgs, ukas, iso14001, dnv, ul Stiffener: fr4, pi, pet Solder mask color: green/yellow/black/white/red/blue Export area: global The capacity of double-sided board: 60000 sq m/year The capacity of multilayer board: 100000 sq m/year We have: Advanced equipment Reliable quality Reasonable price High output Quick delivery Unlimited ordering quantity Packing: vacuum packing

Rigid-Flex circuit boards are composed of a combination of rigid and flexible circuit boards that are permanently connected to one another. The proper application of Rigid-Flex circuit boards offers optimum solutions for difficult, limited space conditions. This technology offers the possibility of a secure connection of device components with the assurance of polarity and contact stability, as well as a reduction in plug and connector components. Additional advantages of pcb bare board are dynamic and mechanical stability, the resulting 3-dimensional freedom of design, simplified installation, space savings, and maintenance of uniform electrical characteristics. Use of Rigid-Flex circuit boards can reduce the total cost of the final product. Rigid-Flex circuit boards give you unlimited freedom of packaging geometry while retaining the precision density and repeatability of printed circuits. As a high reliability replacement for wire and wire harness assemblies, flex circuits provide a significant cost savings with no reduction in performance.

Layers : Sample 1~32 / Mass Production 1~20 Size :Max shipping size is 600mmx550mm , +/-0.15mm Finished Board Thickness: Min 0.4mm(4L)/0.6mm(6L),+/-0.1mm (Max) 3.6mm(2.2~3.6mm depends on material), +/-10% Copper Thickness :1/3~5oz (Depends on material) Impedance Control :+/-10% Via Holes (Min) : Mechanical Drill:0.2mm / Micro Via:0.1mm PTH+/-0.075mm NPTH +/-0.05mm Aspect Ratio : Sample :10:1 / Mass Production :8:1 Min Trace(Width/Spacing) : Internal 0.075mm / External 0.075mm The tolerance followed by IPC-6012 Advance Process : Blind Routing Cavity,Coil Board,Plug Hole With Epoxy,Half Hole Plated Spacing between Pads : Min :8 mil

Rigid-Flex Circuitï¼? Layers : 4 Layer PCB Material: FR4, Polyimide FPC thickness:0.15mm Rigid Board Thickness: 1.6mm Surface Finishing: ENIG Finished Copper thickness: 1/1/1/1 OZ Special Process: Rigid-Flex PCB Rigid-Flex PCB Capability: Minimum Circuit Trace Width/Space: 2.7/2.7mil The Minimum Via Size : 0.15mm The Minimum legend Height/Width: 0.5mm/0.12mm Surface Finishing: HASL-LF, ENIG,ENEPIG,OSP,Gold Finger,Hard Gold Plating,Immersion Silver,Immersion Tin Special Technology: Blind&buried via, Via In Pad,Backdrill,Small BGA Pad,Impedance control,Heavy Copper,Copper Filled Vias,Countersink hole,Depth Milling Material Type: FR4,Metal Core,Halogen Free FR4,Rogers,PTFE,Arlon,Nelco,Polyimide Maximum Panel Dimension: 1200mm x 600mm Final Board Thickness: 0.4mm ~ 6.0mm Final Copper Thickness: HOZ 1OZ 2OZ 3OZ 4OZ 6OZ 10OZ FR4 Substrate Thickness: 0.1mm 0.2mm 0.3mm 0.4mm 0.5mm 0.6mm 0.8mm 1.0mm 1.2mm 1.5mm 2.0mm 2.36mm Shaping: CNC Routing,Punching,V-CUT, Depth milling, Castellation Special Hole: Blind&buried hole,Depth milling,T-slot,Countersink hole About King Sun PCB: King Sun PCB Technology is a manufacturing enterprise that be engaged in high density interconnector multilayer, various types PCB prototype, small and mass production PCB produce. Our products included: HDI PCBs, Via in PAD PCBs, ENEPIG PCBs, Castellated Holes PCBs, Small BGA ball PCBs, Heavy copper foil PCBs, High Frequency PCBs, Rigid-Flex PCBs.Products are used in wide range of IoT industries, Hi-Tech industries, Power supply, Telecommunication, Computer, Industrial control, Digital products, Science and Education instruments, Medical instruments, Automobile, etc. In 2005,we expanded our products to develop and manufacture metal core base PCBs(MCPCB) ,now commonly used in LED lighting and Automobile industry. MCPCBs first class material ensure reliability and play a major role in excellent heat dissipation. It greatly increase longevity of LED Lighting. now we have gained reputable recognition in famous LED Lighting companies. King Sun concentrates on high quality, fast and satisfied service in summary, our service offering are: ï?§ Quick-turn around prototypes fabrication. ï?§ Low cost for mass productions orders. ï?§ MCPCB fabrication. ï?§ PCB prototype assembly ï?§ Function test after PCB assembly ï?§ Stencil making ï?§ Components source

Product Parameter Materials: FR4+Polyimde Overall Board Thickness:1.75mm Layer:4 Surface finished: ENIG Features: Min hole: 0.20mm Hybrid board 4layers flex+4layers rigid pcb

Material: fr-4+pi Layer count£º6 layer Board thickness:1.60mm Min line/space: outer layers:0.09/0.09mm Inner layers: 0.075/0.075mm