Uses:it has good stability, good solvent releasing capacity, and good resistant to bending, good glossiness, good adhesive force and good resistance to gel. It can be used in printing industry to produce solvent type printing ink for soft plate, surface printing ink for plastic and hot-melt adhesive.
Performance:it has strong adhesive force, good resistant to bending, good resistant to water and excellent stability. It can work well with nitro fiber. It can work with pigment and filler to offer bright and brilliant colors.
Itemindex
Benzene soluble polyamide resinsalcohol soluble polyamide resins
Hj-7010hj-1014hj-1417hj-1720hj-9088lhj-9088hj-9088hhj-0005hj-2000hj-2003
Acid value mgkoh/g <5555555555
Amine value, mgkoh/g <5555555555
Viscosity, mpa.S70~100100~140140~170170~20080~120120~160160~20080~160120~17080~160
Softening point oc105~118105~118105~118105~118105~118105~118105~11895~105115~125110~120
Chroma, <8888888888
Solubilityall
Note: for benzene soluble polyamide resin: the inspection conditions of viscosity & chroma: solid is 40%, solvents are xylene/ isopropanol/ absolute alcohol (4:3:3), viscosity method is rotation method. For solubility: the solution is 40% of resin solution, the ratio just like viscosity inspection.
For alcohol soluble polyamide resin: the inspection conditions of viscosity & chroma: solid is 50%, solvent is 95% ethanol, rotation method (hj-2000); the inspection conditions of viscosity & chroma: solid is 40%, solvents are isopropanol/absolute alcohol/normal butyl alcohol (1:1:1), rotation method (hj-2003). For solubility: the solution is 40% of resin solution, the ratio just like viscosity inspection.
Packing:pe film lined pp woven bag, net wt 25kg.
High molecular weight polyamide resin- hot melt HT-65 high molecular weight polyamide resin especially designed for hot melt-adhesive use. This resin has the characteristics of high softening point, and high molten viscosity so that it is suitable for applications where high heat resistance, high creep strength, high adhesive strength required and it is especially application for low pressure moulding. Viscosity (mPas / 200C degree) - 2,000 ~ 5,000.
High molecular weight polyamide resin-hot melt HT-45 is a high molecular weight polyamide resin especially designed for hot melt adhesive use. It is easy to soluble in mixed organic solvent , such as aliphatic or aromatic hydrocarbons and alcohols type solvent. This resin has the characteristics of good mechanical strength, heat resistance, flexibility and long open times(good workability). This product is suitable for bonds to many difficult substrates including : PCB parts, metals, plastics, leather and fabric. Viscosity (mPa s/ 200C degree)- 2,000 ~ 4,000
Supplier: Polyamide resin
•uses: used in alkyd resin, polyamide resin, ink, coating, or used as adhesive, material of textile and detergent, surfactant of lubricant and antirust oil, and food additive. Itemindex requirements Chroma (fe/co) 8# Viscosity (cp/25degree)3000-8000 Acid value (mgkoh/g)190 Saponification number (mgkoh/g)193 Plastic drum or plastic coated metal pail, net wt 180 kg
Supplier: Dimer acid, polyamide resin
Supplier: Curing agents, epoxy resin, polyamide resin, and modified amine resin
Supplier: Phenolic resin (phenol formaldehyde resin - novolac & resol type), polyamide resin
Buyer: Phenol, formaldehyde
Supplier: Epoxy resins and hardners & polyamide.
Buyer: Epoxy flooring users and construction industry
Supplier: Phenolic resins, polyamide resins, ketonic resins, rosin derivatives, polyester resins
Buyer: Phenol, ptbp, eda, rosin, camphor, adipic acid, fumeric acid, neo penta glycol
