Mini Stage

1.Manufactures x-y tables for measure equipments use
2.Material: aluminum or stainless steel optional
3.Travel distance: 50 to 500mm
4.Vspd: linear motion system



Gxy15 diameter 12, gxy25 d 16, gxy40 d20

1.Manufactures rail guides for linear motion system use
2.With roller or ball bearing system for guide ways
3.High precision, low friction and high rigidity
4.VSPD: linear motion system
5.Limited travel linear system with high rigidity, medium heavy load and high operating speed

Precision support unit

1.Supports unit of ball screw for linear motion system use
2.Available in various sizes and shapes for all linear motion applications
3.High precision, low friction and high rigidity

Shaft support portion 6, 8, 10, 12, 15, 20

Coupling

1.Couplings for linear motion system use
2.With flexible or rigid two types
3.Material: aluminum or stainless steel
4.Provide high torque loads while not sacrificing misalignment capabilities and remaining affordable.



Facp-l diameter 16, 20, 25, 32, 40 and weight 12, 19, 36, 69, 130 respectively. Facp-s diameter 12, 16, 20, 25, 32 and weight 3, 8, 13, 24, 48 respectively.

SS-T12A Heating Station Main Unit with T12A-X3 / T12A-CPU / T12A-F/ T12A-Face ID/ T12-andriod / T12-N12/ T12-N13 Motherboard Heating groove for Phone X-13 Pro Max Android Phone motherboard CPU Face ID repair.

SS-T12A Heating Station Main Unit + Five kinds Motherboard Heating groove.

T12A-X3 for X / XS / XMAX
T12A-CPU
T12A-F
T12A-Andriod
T12A-Face ID
T12-N12 for Phone 12/12 Pro/12 Pro MAX/ 12 MINI
T12-N13 for Phone 13/13 Pro/13 Pro max/13 mini

Added T12A-N11 for phone 11 pro max motherboard

SUNSHINE SS-T12A Phone X upper / lower motherboard pre-heating station adopt special heating design and precise temperature control capability, which will locate accurately locate the needed heating part. SS-T12A has dual bayonet design to make phone X motherboard stable. SUNSHINE SS-T12A has EU, AU, and US plug, 110V or 220V for your choice. Using high purity copper to guarantee heat transfer, which is not easy for deformed, durable and anti-wear.

100V-240V SS-T12A Phone X mainboard stratified 185 degrees accurate rapid separated disassembly heating station.

Phone X logic board was folded in half, two layers then were soldered together, the upper layer is the mainboard, and the lower layer is the signal board. Which made our repair much difficult to proceed, how to repair Phone X logic board in fast and efficient method, need the professional Phone X motherboard repair tools

Features :
Adopting 185-degree layered process to remove the iP-X motherboard, not only from our fine analysis of iP-X solder paste ,but depends on the special heating design and precise temperature control of SS-T12A.
SS-T12A only heats the area that the IP-X board needs to be removed to prevent improper heating.
Dual bayonet design, make sure the iP-X motherboard is stable on the stage.
High purity copper is used as a film to ensure uniform heat transfer and heat.