Multi Layer Pcb(4-16Layer)

We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer.

Chipset 1 (H61) â?? 3,350 units
Chipset 2 (H81) â?? 2,206 units
Chipset 3 (H55) â?? 436 units
Chipset 4 (B250) â?? 1,600 units
Chipset 5 (SR406) â?? 345 units


Thank you,

Divanti Group

we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing

Hankook Smart Flex AH35

FEATURES AND BENEFITS

All weather traction
Enhanced controllability
Fuel efficient drive
Excellent durability


The Hankook Smart Flex AH35 is a highway terrain all-season tire manufactured for commercial vehicles. The tyre model is made to be mounted on the vehicle's steering axle.

Hankook Smart Flex AH35 - Key Features

All-Weather Performance: The tire offers reliable traction in dry, wet, and winter conditions, thanks to its wide grooves and 3D sipes, which also prevent hydroplaning.
Enhanced Control: The ribbed tread design ensures constant road contact, improving steering response and driving stability.
Fuel Efficiency: The optimized 3D siping reduces rolling resistance, leading to lower fuel consumption and CO2 emissions.
Durability: Reinforced carcass structure maintains the tire's shape under heavy loads, extending tread life and making it cost-efficient.

IC Chips, IC, Recycle, Reuse or Repair
These IC Chips are for reuse or for recovery of minerals, gold, silver and more.
All ICs are mixed with fingers, no finders.
These are ready for shipping, sold in small quantity or in bulk.

Please feel free to contact our resale agent for more information.
Price is price on request and quantity, please contact for more information.

Multi-layer PCBs, FR4, board thicknses 1.6 mm, OSP or LFHAL surface PCB.

Layer count: 6
Finishing thickness: 1.575 ¡à10%mm
Minimum width/spacing: 4/4-mil
Minimum via diameter: 0.2mm
Surface finishing: lead-free hasl
Specialty: all via are filled with copper paste
Board thickness: 1.2mm

Vacuum package

HDI R-F Multi-Layer PCB with HASL Finishing
• Vendor to be UL recognized
• All patterns according to Customer PCB Artwork/Film/Gerber File.
• Material: FR-4 or other
• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
• Etch on Top/Bottom/Side Copper Layer.
• All PCB will be electrical tested before shipment
• Legend Silkscreen: Top or Bottom side
• Solder mask color: Green/Blue/Yellow/Red/Other
• Complied ROHS standard
• Packing: Inner vacuum packing; Outer carton packing:
• FOB Port: Shenzhen or HK.

HDI
Item Mass Production Prototype
HDI structure 1+N+1,1+1+N+1+1 2+N+2
Buried hole Filled Filled
Aspect ratio 0.75:1 0.75:1
Minimum laser hole 0.1mm(4mil) 0.1mm(4mil)
Minimum laser pad 0.25mm(10mil) 0.25mm(10mil)
Blind hole No filled No filled
Rigid & Flex board NO YES
Press fit hole YES YES
Control Depth drilling YES YES
Lead-free & Halogen-free YES YES
Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm
Immersion Tin 0.6-1.2µm 0.6-1.2µm
Immersion silver 0.2-0.6µm 0.3-0.6µm
OSP 0.1-0.4µm 0.25-0.4µm
HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm
Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm.

HDI R-F Multi-Layer PCB with HASL Finishing
• Vendor to be UL recognized
• All patterns according to Customer PCB Artwork/Film/Gerber File.
• Material: FR-4 or other
• Date code location: Printed on Top/Bottom/Side Silkscreen Layer
• Etch on Top/Bottom/Side Copper Layer.
• All PCB will be electrical tested before shipment
• Legend Silkscreen: Top or Bottom side
• Solder mask color: Green/Blue/Yellow/Red/Other
• Complied ROHS standard
• Packing: Inner vacuum packing; Outer carton packing:
• FOB Port: Shenzhen or HK .

Types:
Single-sided, Double-sided, Multi-layers (max 28 layers) and
Rigid-flexible PCB, Aluminium board
Surface Finishing:
HASL(LF), Gold plating, Electroless nickel immersion gold,
Immersion Tin, OSP(Entek)
Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4
Copper Foil:ED/RA
Min. Line Width:2 mil
Min. Line Spacing:2 mil
Min. Hole Size:0.2mm
Max. Board Size:800x400mm
Min. Board Thickness:0.1mm
Min. Solder Mask Thickness:10um
Solder Mask Types:Green, yellow, black, white, blue, red and clear
Profiling:Punching, Routing, V-cut
Soldering Thermal Resistance:300°C/10 seconds
Peeling Strength:=1.4kg/cm
Surface Resistance:105mO
Insulation Resistance:105mO
Dielectric Strength:9.8x105v/cm
Flammability:UL-94V-0
Performance Test:
100% electrical and electricity performance test

Notes:
- The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II;
- Does not cover the freight cost and international bank transferring cost.


The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm

thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II