PCB
-Rigid pcb:single-sided pcb, double-sided pcb, multi-layer pcb(4-30 layers)
-Rigid-flexible pcb(1-16layers)
-Flexible pcb(flex thickness:25um, 50um, 75um, 125um)
Capability:
-High frequency(taconic material)/tg/density/precision impedance controlled boards
-Heavy copper pcb, metal based pcb.Hard gold pcb, blind&buried vias boards, halogen free pcb, aluminum-backed boards
-Gold finger+hal&leadfree hasl pcb, leadfree compatible pcb
Material: cem-1, cem-3, high tg, high cti, halogen free, rogers, taconic, argon, aluminum-backed, high frequency.
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Multi-layer PCBs, FR4, board thicknses 1.6 mm, OSP or LFHAL surface PCB.
Layer count: 6 Finishing thickness: 1.575 ¡à10%mm Minimum width/spacing: 4/4-mil Minimum via diameter: 0.2mm Surface finishing: lead-free hasl Specialty: all via are filled with copper paste Board thickness: 1.2mm Vacuum package
HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK. HDI Item Mass Production Prototype HDI structure 1+N+1,1+1+N+1+1 2+N+2 Buried hole Filled Filled Aspect ratio 0.75:1 0.75:1 Minimum laser hole 0.1mm(4mil) 0.1mm(4mil) Minimum laser pad 0.25mm(10mil) 0.25mm(10mil) Blind hole No filled No filled Rigid & Flex board NO YES Press fit hole YES YES Control Depth drilling YES YES Lead-free & Halogen-free YES YES Immersion Gold Ni:2-5µm Au:0.05-0.10µm Ni:3-6µm Au:0.075-0.15µm Immersion Tin 0.6-1.2µm 0.6-1.2µm Immersion silver 0.2-0.6µm 0.3-0.6µm OSP 0.1-0.4µm 0.25-0.4µm HASL (Sn-Pb&LF) Pad:>3µm /Big Cu:>1µm Pad:>4µm Big Cu:>1.5µm Flash Gold Ni:3-6µm Au:0.01-0.05µm Ni:3-6µm Au:0.02-0.075µm. HDI R-F Multi-Layer PCB with HASL Finishing • Vendor to be UL recognized • All patterns according to Customer PCB Artwork/Film/Gerber File. • Material: FR-4 or other • Date code location: Printed on Top/Bottom/Side Silkscreen Layer • Etch on Top/Bottom/Side Copper Layer. • All PCB will be electrical tested before shipment • Legend Silkscreen: Top or Bottom side • Solder mask color: Green/Blue/Yellow/Red/Other • Complied ROHS standard • Packing: Inner vacuum packing; Outer carton packing: • FOB Port: Shenzhen or HK .
Notes: - The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II; - Does not cover the freight cost and international bank transferring cost. The packaging price is quoted based on¡êoSize 0.2m287;FR-4 Tg135 material; 1.0-1.6mm thickness; H-1oz copper; PTH161;Y0.3mm; 5/5mil; LF HASL; IPC class II
1. Rigid PCB boards 2. Attained UL ,ISO,CQC certificate 3. IPC Class 2 standard 4. 9 working days for 4-layer board. Inner :vacuum packing/plastic bag Outer :standard carton packing.
4 layers PCB FR4 material 1.6mm board thickness 1OZ copper thickness Green soldermask White legend Immersion gold finish Seal packing
Types: Single-sided, Double-sided, Multi-layers (max 28 layers) and Rigid-flexible PCB, Aluminium board Surface Finishing: HASL(LF), Gold plating, Electroless nickel immersion gold, Immersion Tin, OSP(Entek) Base Material:Polyimide(Kapton), Polyester(PET), Aluminium, FR4 Copper Foil:ED/RA Min. Line Width:2 mil Min. Line Spacing:2 mil Min. Hole Size:0.2mm Max. Board Size:800x400mm Min. Board Thickness:0.1mm Min. Solder Mask Thickness:10um Solder Mask Types:Green, yellow, black, white, blue, red and clear Profiling:Punching, Routing, V-cut Soldering Thermal Resistance:300°C/10 seconds Peeling Strength:=1.4kg/cm Surface Resistance:105mO Insulation Resistance:105mO Dielectric Strength:9.8x105v/cm Flammability:UL-94V-0 Performance Test: 100% electrical and electricity performance test
