Fast Adhesive

An adhesive set which consists of high viscosity cyanoacrylate adhesive and activator. High bonding strength. Suitable for use on vertical surfaces as it will not drip or slump. It is particularly suited to bonding difficult substrates which have a porous or uneven nature since it increases bonding strength by preventing the adhesive to be absorbed by the surface.

SECrosslink-6063 is solvent-free and fast curing at low temperature. It is used for electronic components, ceramics, glass, silicon wafers, metals and other components that need to be bonded. It is suitable for FIP process. Brand SECrosslink Type SECrosslink-6063 Product Low temperature curing type conductive silver adhesive Curing temperature 100 Adhesive types Epoxy Application Electronics and semiconductors Appearance Silver gray Density 4.5g/cm3 Content of effective elements 87% Volume resistivity 0.00005©cm Curing time 0.5h Shelf life 6 months

Ca based super glue with accelarator spray for bonding in 12 secs for all adhering applications. 25 sets in carton 50 gram ca glue + 200 ml accelarator aerosol in a set.

The series of LED silicone packaging materials, mainly used in light-emitting diodes ( LED ) package, having a high refractive index and high light transmittance, can increase the LED luminous flux, low viscosity, easy for deaeration, pouring and molding, make LED has better durability and reliability. This series product is a two-component silicone fluid sealant with high refractive index. Mainly used for electronic components of the seal, enhanced electronic device integrity, improve to shocks, shock resistance, improve the internal components, circuit insulation, conducive to device miniaturization, lightweight, avoid element, circuit is directly exposed to the environment, improve the device's waterproof, moisture-proof performance. Features: high light transmittance, high refractive index, fast curing speed, good fluidity, good heat resistance, weather resistance; Typical application: high-power LED light emitting diode package ( lens filler ), large power LED module top molding package, TOP chip, SMD chip, LED package, LED fluorescent powder glue, potting products such as solar panels. 0.5kg/bottle.

TSG Granule Hotmelt Adhesive, Our TSG Granule Hotmelt Adhesive sets the standard for fast, reliable bonding in packaging and assembly lines. Its unique granular formula ensures easy handling and precise dosing, reducing waste and increasing efficiency. With a quick set time and strong bond strength, it's specifically designed for high-speed automated processes, providing secure sealing for packaging and durable bonding for furniture assembly.

Supplier: LED packaging adhesive, UV adhesive, SMD adhesive, fast curing adhesive, underfilled adhesive, anaerobic adhesive, epoxy adhesive

Hotmelt Adhesive - carton closing , Paper bags handle making Versatile EVA based hotmelt for variety of substrates in End of line Packaging. Product Features - Suitable to paper to paper/Laminated substrate/Aqueous Varnished Surface - Can be used for Warp around Case Sealing application - Good hot tack with fast setting product - Clean cut-off from the nozzle - Good Thermal Stability Technical Specification Appearance: Light Yellow Form: Chiklets Melt Viscosity at 150 C by 1800- 3500 cps Brookfield Thermoset Softening Point: 95 ±5 (by Ring and Ball method) TYPE

"Hotmelt Adhesive - carton closing - Non Laminated Cartons" EVA based low viscous hotmelt for Carton Sealing. Product Features - Suitable to paper-to-paper substrate either in grey board, white board, non-varnished surface - Mostly used in mono carton flap sealing - Fast setting product - Good Thermal Stability Technical Specification Appearance: Light Yellow Form: Chiklets Melt Viscosity at 150 C by 800 1600 cps Brookfield Thermoset Softening Point 105 ±5 (by Ring and Ball method) TYPE