Key Specifications/Special Features:
Four-layer FPC
Board dimensions: 300 x 205mm
Base material: polyimide
Surface treatment: immersion tin
vacuum
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
Double-sided fpc with immersion tin Number of layer:double-sided Min hole.Diameter:0.2mm Min line space/width : 3mil/3mil Surface finish: immersion tin Vacuum
Supplier: 1. korea cosmetic
2. korea cosmetic raw material
3. consumer goods
4. korea materials, parts, eqipments
Services: We offer all cosmetics from korea.
we are connected to various partners, so we can supply a wide range of products at the lowest prices.
we also offer beauty and plastic surgery products.
in addition, we supply various korean materials, parts, and equipment.
Buyer: Material, parts and equipment
4-Layer, Immersion Gold-PCB 4 Layer PCB Board, Immersion Gold PCB, Customized PCB, High Frequency Board, HDI PCB Supplier Layer: 4L Board thickness: 0.8mm Suface Finish: Immersion Gold Trace/Space: 5/6mil Smallest Hole Diameter: 0.25MM PCBMAIN can OEM PCB including single-side PCB, double-side PCB, immersion gold PCB, high frequency board, HDI PCB, high density multilayer PCB, multilayer PCB including 2 layer flexible PCB, 4, 6, 8, 10, 12 layer PCB board.
4-Layer, Immersion Gold Gold fingers-PCB Multilayer PCB, 4 Layer PCB Board, Multilayer FPC, Immersion Gold PCB, Gold Fingers PCB, OEM PCB Manufacturer Layer/Board thickness: 4L/1.6mm Suface Finish: Immersion Gold Trace/Space: 5/5mil Smallest Hole Diameter: 0.2MM Golder fingers PCBMAIN can produce multilayer hasl PCB including 2 layer flexible PCB, 6,4,8,10,12 layer PCB board, multilayer FPC, immersion gold PCB, gold fingers PCB and other high density multilayer PCB.
Layer: 2 layer Materials: PI Copper Thickness: 35um Min Board Thickness: 0.1mm Surface coating: HAL, HAL LF, Immersion Gold, Immersion Tin, Immersion Silver PI thickness: 1/2mil, 1 to 10 mil ADH thickness: 1/2mil, 1mil FPC, flexible PCB OEM/ODM.
We supply multi-faceted semiconductor chips. 1. Flash Memory [NAND/NOR] 2. eMMC (Flash+Controller) 3. ddram (ddr5,4,3,2/lpddr5,4,3) 4. Module 5. SSD 6. HDD
Double-sided fpc Base material :fccl Number of layer:double-sided Min hole.Diameter:0.2mm Min line space/width : 3mil/3mil Surface finish: immersion tin Quality certification: ul&iso9001 Flammability rate: 94v-0 Quality standard:ipc-6013f/aql-ii Vacuum
Product Description Name of Product : Arecanut palm leaf plates and cups. Made of : Arecanut palm tree leaf (Sheath). Nature of product: Purely natural & Eco-friendly, Chemical free. Botany name : Areca catechu Linn. Manufacturing method: Getting shape by hydraulic mechanical press with heated metal mould. Product Specification Shapes : Round, Oval, Square, Rectangle, Hexagonal. .Etc. Thickness : 2-4 mm Depth : 20-35 mm Size : 100 mm-300 mm Above Sizes as follows: Apart from the below sizes, we can tailor to any preferred size and shape depending on the requirement. 18 cm â?? Rectangle 20 cm - Round Side 24 cm â??Square 25 cm - Hexogen Main 25 cm-Rectangle Plate 25 cm - Round Plate 13 cm â?? Heart 13 cm - Dip Bowl 16 cm Rectangle 17cm Square 18 cm Round Bowl 24 cm Square New
