4-Layer, Immersion Gold-PCB
4 Layer PCB Board, Immersion Gold PCB, Customized PCB, High Frequency Board, HDI PCB Supplier
Layer: 4L
Board thickness: 0.8mm
Suface Finish: Immersion Gold
Trace/Space: 5/6mil
Smallest Hole Diameter: 0.25MM
PCBMAIN can OEM PCB including single-side PCB, double-side PCB, immersion gold PCB, high frequency board, HDI PCB, high density multilayer PCB, multilayer PCB including 2 layer flexible PCB, 4, 6, 8, 10, 12 layer PCB board.
4-Layer, Immersion Gold Gold fingers-PCB Multilayer PCB, 4 Layer PCB Board, Multilayer FPC, Immersion Gold PCB, Gold Fingers PCB, OEM PCB Manufacturer Layer/Board thickness: 4L/1.6mm Suface Finish: Immersion Gold Trace/Space: 5/5mil Smallest Hole Diameter: 0.2MM Golder fingers PCBMAIN can produce multilayer hasl PCB including 2 layer flexible PCB, 6,4,8,10,12 layer PCB board, multilayer FPC, immersion gold PCB, gold fingers PCB and other high density multilayer PCB.
we are leading manufacturer & exporter of standoff/spacers as per requirement or Drawing
We just processed in a large batch of chipsets. I posted below current inventory and attached pictures of each type of chipset. Please review and let me know your interest/offer. Chipset 1 (H61) â?? 3,350 units Chipset 2 (H81) â?? 2,206 units Chipset 3 (H55) â?? 436 units Chipset 4 (B250) â?? 1,600 units Chipset 5 (SR406) â?? 345 units Thank you, Divanti Group
4 Base Material Fr4 TG140 Board Thickness 1.6 mm Copper Thickness 1OZ Min. Hole Size 8mil (0.2mm) Min. Line Width/ Spacing 6mil (0.154mm)/5mil (0.125mm) Solder mask Color Green Silkscreen Color White Surface Finishing ENIG Min.Quantity of Order No MOQ Certificate UL, ISO 9001, ISO 14001 Difficulty
ase Material Fr4 TG140 Board Thickness 1.6 mm Copper Thickness 1OZ Min. Hole Size 8mil (0.2mm) Min. Line Width/ Spacing 6mil (0.154mm)/5mil (0.125mm) Solder mask Color Green Silkscreen Color White Surface Finishing ENIG Min.Quantity of Order No MOQ Certificate UL, ISO 9001, ISO 14001 Difficulty
4-layer printed circuit board with selective hard gold coating 50 micro inch (1.25 micrometers) Pcb p / n: 842378 1. Number of layers: 4 layers 2. Material: fr4 Thickness 3.Board: 1.6mm 4. Copper thickness: 1/1/1/1 ounce of copper 5. The minimum drill size: 0.2 mm 6. Minimum track and clearance: 0.125 mm 7. Surface: submerged gold + selective solid gold 8.Green soldering mask 9.Special technology: selective solid gold coating up to 50u "(1.25um) 10.Applications: consumer electronic products 11.One stopping the turnkey service of ems, including the purchase of materials, smt and through assembly, assembly of prefabricated boxes 12.Ul is recognized and complies with rohs requirements.
Key specifications/special features: specifications: Base material: ptfe, pcb, fr4 Layer count: 4layer board Board thickness: 1.6mm Copper thickness: 1oz Surface finishing: enig Solder mask color: green Available specifications: Base materials: fr4, aluminum, fpc and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: hal, enig, osp, gold finger and tin chemistry Possible solder mask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1, 000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) Smt pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (pth): 0.25mm Hole tolerance (npth): 0.15mm Sm tolerance (lpi): dimensions
Quick Details Place of Origin: Liaoning, China (Mainland) Brand Name: GESP Model Number: 2 Layer Pcb Base Material: FR-4 Copper Thickness: 0.25 Oz -12 Oz Board Thickness: 1.6mm-3.2mm 0.2mm-4.5mm Min. Hole Size: 0.15mm Min. Line Width: 5mil Min. Line Spacing: 4 mil Surface Finishing: HASL/enig/OSP/immersion silver /gold finger Base Material:: FR-4,CEM-3, Roger,teflon , taconic,arlon , Metal/ceramic/aluminum base Copper Thickness:: 0.25 oz -12 oz Board Thickness:: 0.005 Certificate:: ISO/UL/RoHS/TS16949 Gold thickness:: 0.05UM V-cut Scoring:: YES Standards:: IPC Class 2, Class 3 Max. Panel Size:: 22 Impedance Control: yes Surface Finishing:: HASL Lead Free/OSP/Soft Gold/Hard Gold
Available specifications: Base materials: FR4, aluminum, FPC and copper Copper thickness: 0.5oz (minimum) Copper thickness: 4oz (minimum) Board thickness: 0.2mm (minimum) Board thickness: 3.2mm (maximum) Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry Possible soldermask colors: green, black, white, yellow, blue, red and more Board dimensions: 600 x 1,000mm Hole diameter: 0.2mm (minimum) Line width: 0.075mm (minimum) Line spacing: 0.075mm (minimum) SMT pitch: 30¡ã (minimum) Annular ring: 0.05mm (minimum) Aspect ratio: 11:01 Surface/hole plating tolerance: Hole tolerance (PTH): 0.25mm Hole tolerance (NPTH): 0.15mm SM tolerance (LPI): Dimension Electrically test: supported RoHS Directive-compliant Possibility of SMT device mounting: supported Product-level Certifications: SGS:12024915-G2 ROHS:SP10-003347-SH UL:E302512-080423 SGS:12409491-GZ
