A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air. The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air. The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
Base material: Aluminum/Copper/Iron Alloy Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K. Board Thickness: 0.5mm~3.0mm(0.02"~0.12") Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ Outline: Routing, punching, V-Cut Soldermask: White/Black/Blue/Green/Red Oil Legend/Silkscreen Color: Black/White Surface finishing: Immersion Gold, HASL, OSP Max Panel size: 600*500mm(23.62"*19.68") Packing: Vacuum/Plastic bag Samples L/T: 10~15 Days MP L/T: 12~15 Days
Power Diodes (Stud/Flat Type) Silicon Diodes are electronic components that conduct current in only one direction. In function, they are similar to one-way valves. Silicon Diodes, using semiconductor materials such as silicon are used as voltage regulators, signal rectifiers, oscillators and signal modulators / demodulators. Semiconductor diodes consist of a PN junction having two terminals, an anode (+) and a cathode (-). Current flows from the anode to the cathode within the diode. Diodes can be used as voltage regulators, tuning devices in RF tuned circuits, frequency multiplying devices in RF circuits, mixers in RF circuits, switching applications, or can be used to make logic decisions in digital circuits. Diodes can be sub-divided into six major categories: General Purpose Diodes (PN junction diodes) PIN Diodes Schottky Barrier Diodes Step-recovery Diodes Varactor Diodes Zener Diodes Laser Diodes PIN Diodes are three-layer Semiconductor Diodes consisting of an intrinsic layer separating heavily doped P and N layers. The charge stored in the intrinsic layer in conjunction with other Diode parameters determines the resistance of the Diode at RF and microwave frequencies. This resistance typically ranges from kilo ohms to less than 1 ohm for a given diode. PIN Diodes are typically used as switches or attenuator elements. Step-recovery Diodes employ graded doping where the doping level of the Semi conductive materials is reduced as the P/N junction is approached. This produces an abrupt turn-off time by allowing a very fast release of stored charge when switching from forward to reverse bias. It also allows a rapid re-establishment of forward current when switching from reverse to forward bias. These Diodes are used in very high frequency (VHF) and fast switching applications. Varactor Diodes are P/N junction Diodes that are designed to act as a voltage-controlled capacitance when operated under reverse bias. One characteristic of P/N junctions is inherent capacitance. When the junction is reverse biased, increasing the applied voltage will cause the depletion region to widen, thus increasing the effective distance between the two â??platesâ?? of the capacitor and decreasing the effective capacitance. By adjusting the doping gradient and junction width, the capacitance range can be controlled and changes can be applied using reverse voltage. Our Products Automatic Voltage Regulator (AVR) Automatic Transfer Switch (ATS) Power Diodes (Stud/Flat Type) Power Diodes (Capsule Type) Phase Control Thyristors (Stud/Flat Type) Phase Control Thyristors (Capsule Type) Inverter Grade Thyristors (Capsule Type) Power Modules Bridge Rectifier Modules Three Thyristor Welding Modules Bridge Rectifiers Moulded Rectifiers For Generators Mono Block Bridge Rectifiers (Single Phase) Mono Block Bridge Rectifiers (Three Phase) Welding Bridge Rectifiers Field Failure Relay (FFR) Generator Diodes
1. Number of Layers: 1 layer 2. Base Material: FR4, High Tg FR4, Halogen Free, Rogers, Aluminium, Cem-1, Cem-3, Ceramic, etc. 3. Copper Thickness: 1/3 oz ~ 6 oz 4. Board Thickness: 0.2 mm ~ 7.0 mm 5. Min. Line Width/space: 3mil/3mil 6. Min. Hole Size: 0.1 mm 7. Surface Finishing: HASL, LF HASL, OSP, Immersion Gold, Immersion Silver, etc. 8. Impedance control: ±10% 9. Solder Mask: Green, Black, White, Red, Blue, Yellow, Mass Black, etc . 10. Silkscreen: White, Black, Green 11. Hole tolerance: PTH±0.075 mm, NPTH±0.05 mm 12. PCB Standard: IPC-A-610 E Class II-III 13. Profiling Punching: Routing, V-CUT, Beveling 14. Wrap and Twist: 1% 15. Place of Origin: Taiwan AD Plus Corporation provides service in the comprehensive range of professional PCB manufacturing. We passed ISO 9001:2015 & ISO 14001:2015 certified, UL approved, ROHS etc. According to product of versatility, AD Plus Corporation is with professional CAM engineers and process expertise, enabling prompt and accurate PCB manufacturing which meets with customer needs, together with strict quality control that contributes to more time- and costs-saving for the customer.
We offer our state-of-the art, automated rohs lead free manufacturing facility which includes pcb stacker; printer, high speed chip shooter & bga capable smt machine and ten zone nitrogen capable re flow oven for assembly / mounting of surface mount devices. ( smd soldering ). We also support leaded solder assembly & through hole component assembly with wave solder / hand solder and complete / finished product assembly. At par with the norms and guidelines laid down by the industry, we have come up with a distinctive plethora of pcb assemblies. Assembled with the best manufacturing practices and with utmost precision, these are checked on different stages of products before final dispatch. We guarantee that the quality of our products is never compromised so as to deliver them to our customers at reasonable rates.
Led lights pcb assembly according to wattage requirement.
Pcb type: fr2/cemi/fr4/mcpb Multi layer/ single layer pcb, Lead free pcb/ rohs pcb
Fr2/cemi/fr$/mpcb Multi layer/single layer pcb Rohs pcb/ Lead free pcb/
