A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.
The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air. The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air. The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.
Base material: Aluminum/Copper/Iron Alloy Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K. Board Thickness: 0.5mm~3.0mm(0.02"~0.12") Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ Outline: Routing, punching, V-Cut Soldermask: White/Black/Blue/Green/Red Oil Legend/Silkscreen Color: Black/White Surface finishing: Immersion Gold, HASL, OSP Max Panel size: 600*500mm(23.62"*19.68") Packing: Vacuum/Plastic bag Samples L/T: 10~15 Days MP L/T: 12~15 Days
1. Number of Layers: 1 layer 2. Base Material: FR4, High Tg FR4, Halogen Free, Rogers, Aluminium, Cem-1, Cem-3, Ceramic, etc. 3. Copper Thickness: 1/3 oz ~ 6 oz 4. Board Thickness: 0.2 mm ~ 7.0 mm 5. Min. Line Width/space: 3mil/3mil 6. Min. Hole Size: 0.1 mm 7. Surface Finishing: HASL, LF HASL, OSP, Immersion Gold, Immersion Silver, etc. 8. Impedance control: ±10% 9. Solder Mask: Green, Black, White, Red, Blue, Yellow, Mass Black, etc . 10. Silkscreen: White, Black, Green 11. Hole tolerance: PTH±0.075 mm, NPTH±0.05 mm 12. PCB Standard: IPC-A-610 E Class II-III 13. Profiling Punching: Routing, V-CUT, Beveling 14. Wrap and Twist: 1% 15. Place of Origin: Taiwan AD Plus Corporation provides service in the comprehensive range of professional PCB manufacturing. We passed ISO 9001:2015 & ISO 14001:2015 certified, UL approved, ROHS etc. According to product of versatility, AD Plus Corporation is with professional CAM engineers and process expertise, enabling prompt and accurate PCB manufacturing which meets with customer needs, together with strict quality control that contributes to more time- and costs-saving for the customer.
We offer our state-of-the art, automated rohs lead free manufacturing facility which includes pcb stacker; printer, high speed chip shooter & bga capable smt machine and ten zone nitrogen capable re flow oven for assembly / mounting of surface mount devices. ( smd soldering ). We also support leaded solder assembly & through hole component assembly with wave solder / hand solder and complete / finished product assembly. At par with the norms and guidelines laid down by the industry, we have come up with a distinctive plethora of pcb assemblies. Assembled with the best manufacturing practices and with utmost precision, these are checked on different stages of products before final dispatch. We guarantee that the quality of our products is never compromised so as to deliver them to our customers at reasonable rates.
Led lights pcb assembly according to wattage requirement.
Pcb type: fr2/cemi/fr4/mcpb Multi layer/ single layer pcb, Lead free pcb/ rohs pcb
Fr2/cemi/fr$/mpcb Multi layer/single layer pcb Rohs pcb/ Lead free pcb/
We are providing electronic manufacturing services to various industries like lighting industries, automation and automotive industries, defence sector, medical electronics. We offer our state-of-the art, automated rohs lead free manufacturing facility which includes pcb stacker; printer, high speed chip shooter & bga capable smt machine and ten zone nitrogen capable re flow oven for assembly / mounting of surface mount devices. ( smd soldering ). We also support leaded solder assembly & through hole component assembly with wave solder / hand solder and complete / finished product assembly.
