Base material: Aluminum/Copper/Iron Alloy Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K. Board Thickness: 0.5mm~3.0mm(0.02"~0.12") Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ Outline: Routing, punching, V-Cut Soldermask: White/Black/Blue/Green/Red Oil Legend/Silkscreen Color: Black/White Surface finishing: Immersion Gold, HASL, OSP Max Panel size: 600*500mm(23.62"*19.68") Packing: Vacuum/Plastic bag Samples L/T: 10~15 Days MP L/T: 12~15 Days
