HENGDA-M8133
Chemical name:3-Aminopropyltrimethoxysilane
Structural Formula:
CAS NO:13822-56-5
Equivalent Name:A-1110, Z-6610, KBM-903, AMMO
Property:
Appearance Colorless Transparent Liquid
Purity â?¥97%, â?¥98%
Density(�?20),g/cm3 1.005~1.015
Molecular Weight 179.28
Refractive Index(n25D) 1.4205~1.4225
Applications:
1. It can improve the physical and electrical properties of mineral-filled phenolics, epoxies, polyamides, polybutylene terephthalate and many other thermoset and thermoplastic composites. Filler wetting and dispersibility in the polymer matrix can also be improved.
2. In shell molding, this silane can strengthen the bond between the phenolic binder and foundry sand.
3. As a phenolic resin binder additive, HENGDA-M8133 silane coupling agent can impart moisture resistance and allow recovery after compression.
4. HENGDA-M8133 is an excellent adhesion promoter to consider for use in many coating, adhesive, and sealant systems. With polysulfide, urethane, RTV silicones, epoxy, nitrile, and phenolic adhesives and sealants, the product can improve pigment dispersion and adhesion to glass, aluminum, steel and various other substrates.
HENGDA-M8252
Chemical name: N-(2-Aminoethyl)-3-aminopropylmethyldimethoxysilane
Structural Formula:
CAS NO.: 3069-29-2
Equivalent Name: A-2120, Z-6023, KBM-602
Property:
Appearance Colorless Transparent Liquid
Purity (%) â?¥97, â?¥98
Density(�?20),g/cm3 0.960~0.980
Molecular Weight 206.36
Refractive Index(n25D) 1.4400~1.4550
the flexural strength of the sand-resin composites while maintaining the shelf life of the resin over long periods.
2. It is used as the raw material in the synthesis of amino silicone fluids or amino fuctional siicones.
3. It can be added to 1 part- and 2-part polysulfide/silicone-crosslinked sealants, provide better adhesion to a variety of substrates, including glass, aluminum and steel.
4. It is used as an additive to phenolic resin binders for mineral fiber insulating materials.
5. It is used in the surface modification of silicon-containing materials such as glass beads, silica, talc, mica, clay.
HENGDA-E8133
Chemical name:3-Aminopropyltriethoxysilane
Structural Formula:
CAS NO: 919-30-2
Equivalent Name:A-1100, Z-6011, KBE-903, AMEO
Property:
Appearance Colorless Transparent Liquid
Purity â?¥98%, â?¥99%, â?¥99.5%
Density(�?20),g/cm3 0.935~0.955
Molecular Weight 221.34
Refractive Index(n25D) 1.4135~1.4235
Applications:
1.Widely used in fiberglass industry.
2. It can improve the physical and electrical properties of mineral-filled phenolics, epoxies, polyamides, polybutylene terephthalate and many other thermoset and thermoplastic composites. Filler wetting and dispersibility in the polymer matrix can also be improved.
3. In shell molding, this silane can strengthen the bond between the phenolic binder and foundry sand.
4. As a phenolic resin binder additive, HENGDA-E8133 silane coupling agent can impart moisture resistance and allow recovery after compression.
5. HENGDA-E8133 is an excellent adhesion promoter to consider for use in many coating, adhesive, and sealant systems. With polysulfide, urethane, RTV silicones, epoxy, nitrile, and phenolic adhesives and sealants, the product can improve pigment dispersion and adhesion to glass, aluminum, steel and various other substrates.
