DB840B
The Underfill is a one-component epoxy sealant for CSP or BGA underfill processes. It can form a consistent and non-defective underfill layer, which can effectively reduce the impact caused by mismatching of overall temperature expansion characteristics between the silicon chip and the substrate or external forces. Fast curing when heated. The lower viscosity characteristics allows for better underfilling; and good reworkability.
DB724
This product provides a strong adhesion seal for shaft seals, metals, glass, plastics, etc., and can replace traditional seal ring. Mainly used in sealing of oil cooling system, engine cover, oil sump and other oil systems.
DB736 DB740
This product is a one-component, medium temperature fast heat curing modified epoxy resin adhesive. Excellent adhesion between many different types of materials. The product has excellent working performance, good high temperature resistance, low curing shrinkage, blister resistance, water boiling resistance and excellent sealing performance.
DB1109
This product is a single coating adhesive. It can be dried at a low temperature and then cured at a high temperature to adapt to the bonding of various substrates. Such as: PVC, ABS, , PC, PA, glass, stainless steel, various alloys, carbon fiber, glass fibers, etc. Typical applications: bonding metal to plastic parts, carbon fiber or glass fiber to plastic parts, glass to plastic parts, anodized aluminum to plastic parts, etc.
DB3030
This series of products have high structural bonding strength. In the shear strength test in the laboratory, the bonding property of this product is stronger than that of steel strip. The product is an epoxy adhesive that can firmly bond wood, metal, thermoplastic, glass fiber and composite components. The product has the functions of chemical corrosion resistance, salt corrosion resistance and high temperature resistance of 150 . Application: Structural bonding; automotive, marine, communication equipment
DB118
This product is a one-component epoxy resin adhesive with high thermal conductivity, which is the best matching adhesive for thermal bonding of chips. Applicable to all kinds of electronic products, characterized by rapid thermal curing, and easy to apply. Upon cure, it has high bonding strength, good thermal conductivity, low shrinkage, low moisture absorption, good insulation performance, etc., which can reduce the working temperature of the chip, extend the life of the chip
Flexible Graphite preform Plate (Prefabricated Plate)
A flexible graphite preform plate is a graphite preform plate formed by rolling with an expanded graphite worm as base material. It has good conductivity and mechanical properties, strong corrosion resistance, is lightweight, and has a long service life
The DOCBOND Flexible Graphite preform plate can be customized according to the size of the client s requirements. The client can produce the graphite bipolar plate of the right size only by molding
Microporous plugging agent for graphite bipolar plate of fuel cell
This series of product are used for impregnation and filling of bipolar plate in hydrogen fuel electric reactor.
tightness chemical resistance and temperature stability does not affect the electrical performance especially can improve the hardness and strength of the flexible molded graphite plate
