used for printed circuit board electroplating and electroless plating,plastic electroplating and electroplating of high-end decorations etc..
Copper(II) sulfate pentahydrate 99%
As .0010%
Pb 0.0005%
Fe 0.003%
Ni 0.0005%
Zn 0.0005%
Co 0.0005%
Cd 0.0005%
Cr 0.0005%
Cl 0.0003%
Water insoluble content 0.005%
