Support for 379 semiconductor manufacturer brands and 69832 models.
Based on high-speed industrial grade FPGAs, combined with powerful ARM and built-in SSD, capable of reaching the ultimate speed of device programming.
3.3V device programming pulses up to 125MHZ.
Burn + verify 8GB eMMC in 250 seconds, one of the fastest programmers in the world.
Support USB,LAN interface
PG128 is one of a new series of models launched by our company for small and medium-sized customers. It is a cost-effective automation equipment solution customized for small and medium-sized customers. The system adopts the mode of industrial control computer (built-in control card), motion control system, optical and mechanical positioning comparison system, fast and accurate positioning, and fully automatic completion of the whole process of chip grasping, placing, burning, taking and packaging conversion. It solves the problem of high cost of original personnel, low efficiency and high defect rate, which can be quickly transformed into automatic equipment by manual, and can also meet the market demand of the majority of small, medium and micro customers.
The Main Features:
1. Superior performance the system can select Tray, Tape packaging input and Tray, Tape packaging output operation, optional ATMK20 marking machine, so it can provide most kinds of IC burning, marking and packaging integration operation.
2. Intelligent operation automatically take and put IC in order to complete the specified task: take and put material/positioning/burning/dosing/packaging using self-made software directly and programming communication, fast integration of motion and programming control.
3. Efficient programming built-in high-speed intelligent ELNEC/PY burner, the efficiency is much higher than the parallel mass production programmer, providing a high speed, low noise, stable and reliable programming platform.
4. Optional marking mode IC marking or printing is provided for Tray/Tape packaging. (Work with optional printer, can print 1~2 numbers or text combination).
5. Accurate positioning mechanical positioning seat structure or optional CCD positioning. IC positioning should be carried out before placing the SOKET to ensure placement accuracy.
6. Modular burning unit modular design of burning device, 6 sets of burning seat divided into three units, with double nozzle to achieve high efficiency burning;
7. Multi-site programming - up to 4 8 or 618 workstations simultaneously asynchronous programming; Minimize device idle time when burning high density Memory.
8. Minimum changes to machine configuration - universal Pin driven design ensures that the adapter is universal, programming different product types of the same package of IC using the same socket (adapter).
9. Quick replacement of consumable parts, simple maintenance - boot self-test, modular design allows simple maintenance, repair and replacement; Different input and output devices can be changed quickly.
Powerful operating software setting parameters and test results are automatically saved, the next boot directly use; Such benefits are for quality control and production tracking; A graphical user interface makes access easier.
Fast programming speed, continuous programming speed up to 5Mb/s,
2GB EMMC, NANDFlash programming time of only 365 seconds.
48-pin universal driver, DIP devices can be used without conversion zones, support for in-circuit/on-board burn-in.
support for high-speed IEEE1284 (ECP/EPP) LPT ports to connect the BeeProg2 to any PC.
Support for 330 semiconductor manufacturer brands and 47731 models;
Support for 330 semiconductor manufacturer brands and 47731 models.
Extensive support for a wide range of IC types and package types.
Burn EEPROM, MCU, SPI NOR/NAND FLASH, Parallel NOR/NAND FLASH, EMMC, EMCP, CPLD, FPGA. etc. ICs.
Supports DIP, SOP,,SSOP, TSOP, PLCC, QFN, BGA and other packages.
Burning software supports NAND FLASH Bad Block Skip and file partition table burning function.
Built-in memory card slot to support project burn-in.
1.Type of machine:High speed tape inspection machine
2.Model:AOI 60
3.UPH:20,000-55,000
4.Applicable tape sizes:8-62mm carrier tape width.
5.Adhesive tray size :33cm
6.Inspection functions:Product orientation, silk screen, batch number, leakage, flip, pin, dotting, etc.
7.Applicable products Chip:Electronic components, braided switch, hardware, connector, shield, carrier tape, etc.
8.Working environment :Clean room, room temperature
9.Interface language version:Chinese/English
10.IMage positioning module :CCD iMage positioning
11.Overall dimensions :1100 W600 H1700mm (without warning light)
12.Machine weight :110KG
Technical parameters:
Function:
Blister tray feeding /Tape discharging
2 dimensional barcode scanning (Coxnex)
Positioning function
AOI empty/reverse detection
Specifications and Parameters:
Optimum operating temperature: 13--32C
Noise: less than 80 dB
Net weight: 200kg
Host: 880(L) X1640(W) X 1490(H)mm(excluding alarm lamp height 400mm and input/output accessories and display)
Motion system: X/Y axis servo motor, Z cylinder Real/Tray stepper motor
Accuracy: X axis 0.02mm; Y 0.02 mm; the Z axis 0.05 mm.
Effective stroke: X axis: 205mm; Y-axis: 390mm; Z axis (cylinder): 15mm;
Suitable package form:
PLCC, JLCC, QFN, SON, EBGA, FBGA, VFBGA, BGA, etc.
Detection system:
AOI detection system detects empty/reverse
Fiber optic inspection system for floating material
Technical parameters.
Functions:
Blister tray infeed/Tape outfeed
2-dimensional barcode scanning (Cognex)
Positioning function
AOI empty material/reverse detection
Specifications and parameters
Optimum operating temperature: 13 - 32C
Noise level: less than 80dB
Net weight: 200kg
Main unit: 880(L) X 1640(W) X 1490(H)mm (excluding alarm light height of 400mm and optional input/output accessories and display)
Drive system:
Motion system: X/Y axis servo motor, Z cylinder Real/Tray stepper motor
Auto IC Programmer
Product Introduction
PRO360 is the new update fully automatic IC programming equipment of our company with high cost performance. PRO360 supports tray/tape/tube feeding and discharging, IC marking and it can be combined with high-performance universal programmers or customized programming systems. It supports up to 10 groups of 80 adapters.
High-speed and stable system collocation let your R & D, design, production in one step, and help you achieve more efficient and rapid market product launch. We can help you seize business opportunities and occupy more market share in the competitive globalization era.
Modularization of programming module
Modular design components of the adapter pressing block can be independently controlled operation.
It can be quickly disassembled and replaced according to customer needs.
Motor pressing block system: The pressing height can be adjusted without overvoltage to improve the life of the SOCKET.
Professional visual system
Upward CCD (1.3 million pixels) is used for adapter positioning.
The downward CCD (1.3 million pixels) is used for IC positioning and has the function of flying photography.
It can meet the picking and positioning of small-size products with high precision upward and downward CCD positioning system (positioning accuracy up to + 0.02mm).
System interaction: PRO360 supports AOI detection of material picking/taping, and it can also scan laser label information of IC to provide full-process inspection for products. The production information can interact with MES in real time.
PGMES Standard MES interface (order number, NG/OK number, running status), CPS display platform,
One-key setting: Built-in standard template data (one-key setting parameters).
Auxiliary function: it can report abnormal causes and provide solutions when alerting.
â?? Equipment state monitoring: it can monitor the running state of the equipment and respond to it (warning and adjusting parameters when the reject rate is high).
â?? Maintenance: Remote service, Debugging; Maintenance reminders, Replacement reminders.
Consumables management: The equipment dynamically records the nozzle and socket movement times, screw running distance and other information.
PG-280P Fully Automated IC Programming Equipment
Product Introduction
PG-280P is a mass-produced automated IC programming equipment with high cost performance. PG-280P supports tape-in/out, tube-in/out, IC marking and other functions. The number of programming modules can be 4 or 8. It not only improves the production efficiency, but also eliminates the possible human error in the process of IC programming. The performance of both mechanical system and programming system has reached the very high level.
Feature
Equipped with high precision CAM mechanism and 4 nozzle, the actual UPH output is 2800.
Motor pressing block system: the speed of pressing block can be adjusted and the action is flexible and fast. The pressing height can be adjusted without overvoltage to improve the life of the SOCKET.
High precision mechanical positioning system (positioning accuracy: ±0.05mm).
PG280P can interact with the customers MES system, and the production process can be controlled in real time. It can also be matched with the lightweight CPS system developed by our company.
PG280P can be used with programmers BeeHive204AP *2 or SP16-FX *16 or PD-200-S8 *2 or CTP-S20 *16.
Supported adapter: up to 16.
I/O Devices: Tape, Tube
Supported package: PLCC, JLCC, SOIC, QFP, TQFP, PQFP, VQFP, SOP, TSOP, TSSOP, SON, BGA, EBGA, VFBGA.
Supported IC size: >2*3mm
Supports simultaneous programming of 4 chips.
Remote control interfaces are reservedfor integration with third-party
automatic programming systems andinformation systems.
64 modules can be controlled byautomatic system.
Each computer can connect 2BeeHive304 to achieve 8 chipsprogramming at the same time.
Supports USB and LAN(1Gbit/s)ports.
