Product Name: Sensor IC Substrate
Material: Shengyi SI10U
Minimum width / spacing: 35 / 35um
Surface: Immersion Gold
PCB thickness: 0.25mm
Layer: 4Layers
Structure: 1L-4L,1L-2L,3L-4L
Solder mask ink: TAIYO PSR4000 AUS308
Aperture: Laser hole 0.075mm, Mechanical hole 0.1mm
Application: Sensor IC Substrate
Product Name: Teflon PCB
Material: Teflon
Quality standard: IPC6012 Class 2
Dielectric constant: 2.65
Layers: 2Layers
Thickness: 1.5mm
Copper thickness: base copper 0.5oz, finished copper thickness 1oz
Surface technology: Immersion Gold
Application:Microwave high frequency PCB application
Industry Leading, Standard Loss, Thermally Robust Epoxy Laminate and Prepreg
isola 370hr is the industry's best in class lead-free compatible product for high-reliability applications across a wide range of markets.
isola 370hr laminates and prepregs, deigned by Polyclad, are made using a patented high performance 180�°C Tg FR-4 multifunctional epoxy resin system that is designed for multilayer Printed Wiring Board (PWB) applications where maximum thermal performance and reliability are required. isola manufacture isola 370hr laminates and prepregs with high quality E-glass glass fabric for superior Conductive Anodic Filament (CAF) resistance. isola 370hr provides superior thermal performance with low Coefficient of Thermal Expansion (CTE) and the mechanical, chemical and moisture resistance properties that equal or exceed the performance of traditional FR-4 materials.
Product Name: 77GHz Millimeter wave radar PCB
Material: Rogers RO3003G2 + Shengyi S1000-2M
Quality standard: IPCB6012 Class3
Dielectric constant: 3.00 + / - 0.04
Layers: 8Layers
Thickness: 1.4mm
Copper thickness: base copper 0.5oz, finished copper thickness 1oz
Surface technology: Silver, Gold or OSP
Application: Car driverless 77GHz Millimeter wave radar
Model Rogers RO4003C High-Frequency Board
D K 3.38 0.04
Layer 2Layers
DielectricsThickness 0.508mm(20mil)
Finished Thickness 0.6mm
Material Copper Thickness (17m)
Finished Copper Thickness 1OZ(35m)
surface treatment Immersion Silver
Application communication infrastructure, computers, aerospace
RO4003C RO4350B Data-Sheet
isola fr408 is mid loss, epoxy laminate and prepreg, isola fr408 is a high-performance FR-4 epoxy laminate and prepreg system designed for advanced circuitry applications.
The PCB material TG of FR4 is usually 130 and 180 or higher. For example, the practical frequency of isola 370hr can reach 10G. The application of isola 370hr is mostly in high-frequency communication, microwave, high-speed digital circuits and other fields.
But the loss of isola 370hr is too large, and it is still similar to ordinary FR4. The biggest advantage is that the temperature stability will be better. The loss of isola fr408 is only one tenth of isola 370hr.
This is another product besides isola 370hr. isola fr408 low dielectric constant (Dk) and low dissipation factor (Df) make it an ideal candidate for broadband circuit designs requiring faster signal speeds or improved signal integrity. isola fr408 is compatible with most FR-4 processes. This feature allows the use of isola fr408 without adding complexity to current fabrication techniques.
Model : rigid-flex pcb(f-fpcb)
Material : FR-4+PI
Layer : 2+2+2
Color : Green/White
Finished Thickness : 1.0mm+0.15mm
Copper Thickness : 0.035mm(1OZ)
Surface Treatment : Immersion Gold
Minimum line width / distance : 0.1/0.1mm
Application : digital rigid-flex pcb prototype fabrication
PCBA electronic product assembly and processing refers to the electronic processing manufacturer to undertake the processing project of the electronic client, and conduct the semi-finished and finished product assembly of electronic products. The difference between the two is mainly whether the products received by the entrusting party can be used directly. Electronic product assembly and processing is very popular in developed countries and other places, which completely saves the electronic R & D companies in the factory rent, equipment purchase to spend a lot of money, save production costs, improve product profitability. More and more manufacturers with long-term vision and the ability to grasp the market prospect will join it. However, there is a premise that the consignor needs to ensure that the processing party has sufficient capacity and experience to ensure the correct production and normal delivery of products, so as to seize the market opportunities.
iPcb Circuits Limited(ipcb�®.com) professional provides a variety of electronic processing services, such as PCBA processing test, SMT chip, dip plug-in and finished product assembly, aging test, etc. Equipped with professional international standards of the factory for production, through the U.S. UL certification, ISO9001 production standards, finished product pass rate as high as 99.8%. 10 years of processing experience and the trust of many listed companies are worthy of your favor. The developed countries are keen on electronic processing. Quality is the premise standard, advanced equipment and rich processing experience is the basis. Ipcb has more than 4000 cooperative customers all over the world, which is a witness to our ability.
The communication backplane PCB is made of isola 370hr material. The communication backplane bus is a high-speed data path between the PLC host and the I / O expansion module, supporting the I / O data refresh between the host and the expansion module. The technical level of backplane bus determines the I / O expansion ability of PLC products, which is the core technology of PLC design and manufacturing.
At present, the PCB board of PLC mostly uses isola 370hr material, and PLC mostly uses serial communication technology to realize backplane bus. Compared with parallel bus, serial bus has less leads and low hardware cost, and is not easy to be interfered. Serial bus can improve the reliability of automatic equipment in harsh factory and industrial environment.
In the field of communication PCB, it is widely used in wireless network, transmission network, data communication and fixed network broadband. Related products include backplane, high-speed multilayer board, high-frequency microwave board, multi-functional metal substrate, etc.
