The stainless steel solder paste FIFO adopts the automatic slide double inlet design, which can store 72 bottles and two kinds of solder paste free label management. It meets the electronic enterprise with large amount of solder paste, saving 10% of the cost. Product Code: SMB10SUA-000-R6; Material: 304 stainless steel + acrylic transparent side plate; Solder paste storage capacity: 72 bottles; Product size: 173 * 443 * 995mm; Number of groups: single group; Packing: wooden frame packaging.
Solder paste FIFO fixture processing factory 17 years of processing experience, long-term partners of the top 500 companies, dozens of non-standard custom use case technology mature and stable, high praise rate, that is, buy and use free design fee for your provincial 10% cost . Product Code: SMF10B20-000-R0; Material: abs engineering plastic + aluminum plate; solder paste storage volume 74 bottles; Product size: 900 * 400 * 207 mm; Layers: double layer; Packing: wooden frame packaging.
Small stainless steel FIFO uses slide-type design solder paste for automatic first-in, first-out, label-free management, saving a labor cost. Double row double outlet 48 bottles of solder paste storage, can manage 2 brands of solder paste. Product Code: SMB10SUA-000-R4; Material: 304 stainless steel; Solder paste storage capacity: 48 bottles; Product size: 171.5*443*701mm; Number of groups: single group; Packing: wooden frame packaging.
The double-layer solder paste slide is the FIFO of Donghongxin. It was jointly developed by Huayang General Group in 2012. After 7 years of continuous optimization and improvement, it saves time and effort and saves money.
DongHongXin ic aluminum tube is made of imported aluminum precision machining, and its precision is high. The surface and the groove are smooth and burr-free, which improves the production efficiency of the workshop.
The product is made of high quality 304 stainless steel and large precision sheet metal processing equipment. The surface is smooth and burr-free, no scratches, overall beautiful, durable, high temperature resistant and corrosion resistant.
The semiconductor intelligent cabinet is used for the management of the electronic component tail number. The two-dimensional code scanning access product is convenient for quickly searching for the storage position of the previous batch of products, preventing the occurrence of the mixing problem, improving the product qualification rate and reducing the production cost.
Anti-oxidation intelligent cabinet adopts computer control system QR code scanning and input products to quickly find the required materials and improve production efficiency. Product number: TEB30A09-000-R0; Storage quantity: 80 cabinets; System interface: MES system interface; Operation mode: touch screen operation; Material: stainless steel + iron paint; Size: 2050*655*1715 mm; Relative humidity monitoring range: RH =0~75%; Language: Chinese, English, and Traditional Chinese.
The intelligent nitrogen cabinet is made of 304 stainless steel anti-static paint, which is beautiful and elegant. Product number: TEB30A47-000-R0; Storage quantity: 100 cabinets; Control system: ICMS system; Support barcode: QR code; System interface: MES system interface; Operation mode: Touch screen operation; Material: stainless steel + surface paint; 2000*600*1600 mm; Rated voltage: AC220V; Rated current:
The moisture-proof intelligent cabinet is made of stainless steel as a whole. It is sturdy and durable. The built-in compartment can be freely adjusted to store a variety of products for storage. The appearance is beautiful and elegant, and the cleaning and maintenance are more convenient.
In the power electronic module technology, the DBC substrate is mainly used as a carrier for various chips (IGBT chip, Diode chip, resistor, SiC chip, etc.), and it is placed in an ultrasonic cleaning device for cleaning before soldering. It is necessary to use a cleaned basket to fix the DBC board and then put it into the equipment for cleaning.
DongHongXin 4 inch crystal plate is made of high quality imported sus420j2 stainless steel material. It has high hardness, high flex resistance, high flatness, high smoothness, smooth surface and no burr. It is in line with the mainstream film, cutting and drawing. The requirements of the chip device and the size requirements of the standard 4-inch wafer.
The wafer plate is mainly used to support the wafer on the fixed blue film. Because the blue film has very high requirements on the surface finish and flatness of the wafer plate, we use laser cutting to cut the raw material into pieces and then polish it. After grinding, heat treatment is performed to make the hardness HRc>47. This product will be more viscous and more resistant to folding.
The semiconductor package hanging basket is made of high quality 304 stainless steel. The surface is finely polished and beautiful. Smooth and burr-free. It is safer and safer to use. The etched buffer number can distinguish products in an orderly manner, and find products at a glance to improve production efficiency.
Donghongxin 8-inch wafers are processed with imported new pp materials. They are non-toxic and environmentally friendly. The color is even and vivid, and can be reused to ensure that the wafers are not polluted by the external environment. The 25-slot large storage + arc angle design not only avoids damage to the wafer, but also saves you money by storing more wafers.
After the wafer is cut, the shop operator can automatically lock the 8-inch automatic lock wafer storage rack, and the frame for fixing the wafer will be locked inside to avoid the wafer due to operator error. The problem of falling pieces occurs, ensuring the safety of the cut wafers, and also improving production efficiency.
The TPAK aluminum box is designed with a portable + baffle. The TPAK package is safer, more convenient and faster, and is a good product to improve the production efficiency of the package. Product Code: WBF40TP2-000-R0; Material: 6063 aluminum profile; Number of slots: 5 slots; Dimensions: 135*183*101 mm; Surface treatment: surface sandblasting oxidation treatment; Accessories: cartridge *1 + baffle * 2 Packing: Carton packaging.
Sop package cleaning basket is good, but many enterprises often use the sop package cleaning basket slot size delivered by the supplier during the use process. The size of the slot is not accurate, and it is easy to appear that the problem of poor material placement during the ultrasonic cleaning process causes product defects, and some may hit the ultrasonic cleaning machine, which seriously affects the service life of the equipment. Therefore, in the selection of sop package cleaning basket must choose the quality of the supplier, in order to ensure the quality of the production line.
The ic frame ultrasonic cleaning basket is made of 304 stainless steel. After precise laser cutting, each slot is more precise to ensure that the ic frame will not be deformed during storage. The overall frame is welded by the master of welding technology experience for more than 10 years. The welding points are even and full, and the ic frame ultrasonic cleaning basket is more durable. After the welding is completed, the entire ic frame is ultrasonically cleaned to the surface of the basket for electrolytic treatment. The surface is smooth and smooth, and the ic frame is smoother. The quality of the ic frame is guaranteed from every detail, so that customers can favor your company more and give you a steady order.
QFN wafer ring is made of high quality imported corrosion-resistant stainless iron material, laser-cut, stamped material, and then polished surface treatment process. It can also be matt to solve the problem of poor UVtape adhesion when the blue film is attached. Donghongxin QFN iron ring has smoothness, high precision, smooth surface and no burr, and has the advantages of excellent folding resistance, excellent corrosion resistance and strong scratch resistance. Our regular sizes are: 6 inch, 8 inch, 12 inch, thickness 1.0/1.2/1.5mm, laser engraving and logo according to your requirements. Welcome new and old customers to come to consult and discuss cooperation.
Inside the box, the wafer chip is transported during the production process without the need to remove expensive wafers, bumps, scratches, and the like. DongHongXin non-standard wafer frame raw materials made of Japanese imported materials to make durable, flatness, high hardness, anti-folding, anti-corrosion performance, anti-scratch ability and so on
The SOP package stainless steel cleaning basket is made of laser cutting, bending and welding with a thickness of 1.2mm. The SOP package stainless steel cleaning basket has a sturdy and durable overall frame and a longer service life. The draping ensures that the product is not scratched and the operator is safer and smoother to use.
The plastic wafer patch ring is made of high quality and durable pps material. The product has excellent high temperature resistance and can withstand high temperature baking at 110 °C. It has good steel and corrosion resistance. The cost performance of plastic wafer patch is much higher than that of stainless steel. Its light weight and durability are favored by the majority of semiconductor companies. At the same time, we can customize plastic rings or square rings of various sizes according to requirements.
The traditional solder paste storage method is to use a special person to stick the label and put it into the refrigerator for storage. This directly affects the production cost of the enterprise. The automatic FIFO solder paste can effectively solve this problem, eliminating the label management and saving one person. The labor cost, and the management of solder paste is more standardized, avoiding the waste of solder paste and improving the production efficiency of the workshop by 10%. DongHongXin 17 years focus on the electronic smt industry turnover storage solution one-stop strength manufacturers, willing to be electronic The development of the industry contributes to its own meager strength. Product Code: SMF10A04-000-R1; Material: ABS plastic + aluminum alloy; Size: 460 * 580 * 99 mm; Storage: 23 bottles; Packing: wooden frame packaging.
Red glue is an indispensable material for electronic smt processing enterprises. Its control directly affects the utilization rate and production efficiency of red glue. DongHongXin has developed a red glue FIFO legal control based on customer demand. The fixture can standardize the management of red glue, improve the use efficiency of red glue to avoid waste, and save 10% of the cost of red glue in one year. The products are well received by major electronics companies. 17 years of technology precipitation DongHongXin company can be customized according to your requirements, 8 days fast delivery. Red glue FIFO legal control Product No.: SMF10H06-000-R0; Material: ABS plastic; Size: 435*995*300 mm; Storage of 100 bottles of red plastic; Packing: wooden frame packaging.
The 4*4 material box is used for the rotation, storage and drying of the LED package chip holder. The whole is made of 6061 aluminum profile precision hollowing, which is stable and durable. The smooth and burr-free surface groove can better protect the chip holder from being scratched by the outside no problem of injury wii occurr.
Semiconductor IC packaging nailing machine is a + + cylinder by imported PLC control system of fiber optic sensing system, this nailing machine use brand vibration plate automatic feeding rubber nails, nail glue delivery guarantee nailing process smoothly. Intelligent design can realize plastic (IC) automatic feeding and automatic feeding two models, the automatic feeding hose model applies to more than one machine, a nailing fast, stable, save the characteristics of the artificial. The non-automatic feeding mode is suitable for one machine, which has the characteristics of small floor area, and the speed of the nail is determined by the speed of the worker.
The high temperature resistant slot magazine is made of imported materials and has a hard surface oxidation treatment. It can withstand temperatures above 300 degrees without deformation and discoloration, and is stable and durable.
The ic packaging material tube adopts high-quality 6063 aluminum profile after CNC precision processing and hard oxidation treatment, so that the surface groove is smooth and burr-free, and the hardness is high and the folding resistance is strong.
Electronic patch slot magazine wholesaler DongHongXin 17 years of electronic turnover and storage series product design production and processing experience, with hundreds of sets of molds, complete specifications, technology mature and stable direct copying to save you the cost of pre-opening mold, save 10 The cost of % helps you to purchase from one stop. Product Code: WBF40Z23-000-R0; Material: 6061 aluminum profile; slot number: 25 slots; size: 190*57.5*148 mm; surface treatment: surface anode sandblasting oxidation; accessories: box *1; packaging: carton package.
With the increasing trend of intelligent electronic products, such as more and more electronic components in cars, mobile phones, and smart homes, and increasingly harsh application environments, semiconductor product design engineers need to consider various factors such as space and performance. The product not only has low power consumption, but also has a smaller package size as an ideal electronic component. The D2PAK packaged electronic components fully meet these requirements. The chip lead frame is not only small in area, but also has a very thin thickness. During the packaging process, the lead frame needs to be turned around, and a high-precision aluminum alloy case is used for the turnover transportation.
DongHongXin led amplifying ring adopts the new pom match +Gf glass fiber material processed by precision injection molding machine. The high precision between the sub-mother rings is better and the service life is longer.
DongHongXin square wafer ring is processed by slow wire processing with sus420j material. The surface of the wafer ring is polished and heat treated to make it more resistant to folding and flatness. It is more stable when bonding.
In the custom sus420 wafer ring you need to provide the depth of the film tray of your equipment, in order to determine the thickness of the sus420 wafer ring, in general, you buy the equipment manufacturer will tell you the parameters of the ring. If you have special requirements, you can tell Donghongxin Engineering here that you will design and process the sus420 wafer ring according to your needs.
Jedec tray stainless steel turnover box is used for TPAK wire bonding process to store and transport the wire product tray. The whole is made by hand welding of Φ6 sus201 wire rod. Each welding point is even and full, and the whole product is sturdy and durable. Then, the welded product is polished and the surface is electrolyzed to process the Jedec tray stainless steel turnover frame. The surface groove is smooth and burr-free, ensuring that the products of the turnover are not damaged and the product quality is improved.
