Resin Plug Vias Board
Material: FR4
Layer:6
Board thickness: 1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size: 0.2mm
Surface finish: ENIG 3U
Specialty:Resin Plug Vias Board
Application: Partech Instruments
Security six laminates
Material: FR4
Layer:6
Board thickness: 1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.076/0.076mm
Min hole size: 0.2mm
Surface finish:Immersion Gold + Hard Gold
Specialty:Hard Gold Finger 30U
Application:Security
Security eight laminates
Material: FR4
Layer:8
Board thickness: 1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.076/0.076mm
Min hole size: 0.2mm
Surface finish:Immersion Gold
Specialty:Impedance controlled
Application:Security
Car pcb
Material: fr4
Layer: 2
Board thickness: 2.0mm
Copper weight: 2oz
Min trace width/spacing: 0.2/0.2mm
Min hole size: 0.4mm
Surface finish: hasl
Specialty: taiyo white color solder mask
Application: gm automobile board
Single sided aluminum substrate
Material:aluminum
Layer:1
Board thickness:1.0mm
Copper weight: 1oz
Min trace width/spacing: 0.2/0.2mm
Min hole size:
Surface finish:hasl
Specialty:good heat conduction
Application:back light source
Camera module four laminates (state set)
Material: FR4
Layer:4
Board thickness: 1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size: 0.25mm
Surface finish:Immersion Gold
Specialty:Immersion Gold 6U Bonding
Application:Camera module
Material:FR4
Layer:2
Board thickness:0.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size:0.3mm
Surface finish:Immersion Gold
Specialty:
Application:Household Appliances
Material:FR4
Layer:6
Board thickness:1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size:0.2mm
Surface finish:ENIG 3U
Specialty:Resin Plug Vias Board
Application:Partech Instruments
Material:FR4
Layer:6
Board thickness:1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.076/0.076mm
Min hole size:0.2mm
Surface finish:Immersion Gold + Hard Gold
Specialty:Hard Gold Finger 30U
Application:Security
Material:FR4
Layer:4
Board thickness:1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size:0.25mm
Surface finish:Immersion Gold
Specialty:Immersion Gold 6U Bonding
Application:Camera module
Material:FR4
Layer:4
Board thickness:1.0mm
Copper weight: 1oz
Min trace width/spacing: 0.15/0.15mm
Min hole size:0.3mm
Surface finish:Immersion Gold + Hard Gold
Specialty:Hard Gold Finger(Au 30u)
Application:Communication optical fiber
Material: FR4
Layer:2
Board thickness: 1.6mm
Copper weight: 1 oz
Min trace width/spacing: 0.15/ 0.15mm
Min hole size: 0.3mm
Surface finish : OSP
Specialty:
Application:Household Appliances
Material:FR4
Layer:4
Board thickness:1.0mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size:0.2mm
Surface finish:Immersion Gold + Hard Gold
Specialty:Hard Gold Finger(Au 15u)
Application:Communication optical fiber
Printer double layer board (bonding)
Material: fr4
Layer:2
Board thickness:1.6mm
Copper weight: 1oz
Min trace width/spacing: 0.1/0.1mm
Min hole size:0.3mm
Surface finish:immersion gold
Specialty:immersion gold 4u bonding
Application:hp printer
Material:Rogers
Layer:2
Board thickness:1.6mm
Copper weight: 1oz
Min trace width/spacing: 1.0/0.5mm
Min hole size:0.5mm
Surface finish:HASL
Specialty:Rogers material + high frequenc
Application:Telecommunications
