Layer: 1 to 32 layers
Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 OZ to 7.0 OZ
Copper thickness in hole: >25.0 um (>1mil)
Max. Board Size: 23 ¡¨¢ 25 (580mm¡¨¢900mm)
Min. Drilled Hole Size: 3mil (0.075mm)
Min. Line Width: 3mil (0.075mm)
Min. Line Spacing: 3mil (0.075mm)
"we can offers a full range of rigid board constructions from single / double sided up to 32 layers and beyond, with vast experience in high layer count / high technology boards. We have continually invested not only in the equipment and processes to allow the production of these high technology boards, but also in the latest test and inspection equipment to ensure the highest quality. Some key rigid technology features are: ?high layer count multilayer ?fr4 / polyimide / high speed / special materials ?micro via / blind via / buried via ?stacked vias ?controlled impedance"
Layer: 1 to 32 layers
Material type: fr-4, cem-1, cem-3, high tg, fr4 halogen free, rogers
Board thickness: 0.21mm to 7.0mm
Copper thickness: 0.5 oz to 7.0 oz
Copper thickness in hole: >25.0 um (>1mil)
Max. Board size: 23 ¡¨¢ 25 (580mm¡¨¢900mm)
Min. Drilled hole size: 3mil (0.075mm)
Min. Line width: 3mil (0.075mm)
Min. Line spacing: 3mil (0.075mm)
